Items where Author is "Yin, Chunyan"

Article

Yin, Chunyan, Lu, Hua, Musallam, Mahera, Bailey, Chris and Johnson, C. Mark (2010) Prognostic reliability analysis of power electronics modules. International Journal of Performability Engineering, 6 (5):10. pp. 513-524. ISSN 0973-1318

Lu, Hua, Bailey, Chris and Yin, Chunyan (2009) Design for reliability of power electronics modules. Microelectronics Reliability, 49 (9-11). pp. 1250-1255. ISSN 0026-2714 (doi:10.1016/j.microrel.2009.07.055)

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:10.1108/09540910610665107)

Book Section

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Tilford, Tim, Xue, Xiangdong, Alam, M.O., Yin, Chunyan and Hughes, Michael (2008) Modelling technologies and applications. In: Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. In: International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:10.1109/ICEPT.2008.4607039)

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Yin, Chunyan, Tilford, Tim and Ridout, Stephen (2008) Predictive reliability and prognostics for electronic components: current capabilities and future challenges. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 67-72. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276460)

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. In: ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.444141)

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Hughes, Michael, Yin, Chunyan and Gwyer, David (2007) Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges. In: EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 4-11. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360048)

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. In: 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:10.1109/POLYTR.2007.4339175)

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. In: IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:10.1115/IPACK2007-33820)

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. In: Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:10.1109/ESIME.2006.1644052)

Rizvi, M.J., Yin, Chunyan and Bailey, Christopher (2006) Modeling the effect of lead-free soldering on flexible substrates. In: Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:10.1109/EMAP.2006.4430695)

Yin, Chunyan, Rizvi, M.J., Lu, Hua and Bailey, Christopher (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. In: Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280134)

Conference Proceedings

Bailey, Chris, Lu, Hua, Yin, Chunyan and Lee, Yek (2010) Multi-physics modelling for packaging of liquid crystal displays in harsh environments. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642898)

Musallam, M., Johnson, C.M., Yin, Chunyan, Bailey, Christopher and Mermet-Guyennet, M. (2010) Real-time life consumption power modules prognosis using on-line rainflow algorithm in metro applications. In: Energy Conversion Congress and Exposition (ECCE), 2010 IEEE. IEEE Xplore Digital Library, Atlanta GA, pp. 970-977. ISBN 978-1-4244-5286-6 (print) ISSN 978-1-4244-5287-3 (online) (doi:10.1109/ECCE.2010.5617883)

Yin, Chunyan, Lu, Hua, Musallam, M., Bailey, Christopher and Johnson, C.M. (2010) In-service reliability assessment of solder interconnect in power electronics modules. In: 2010 Prognostics and System Health Management Conference, PHM '10. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781424447565 (Print), 9781424447589 (Online) (doi:10.1109/PHM.2010.5413346)

Bailey, Chris, Lu, Hua and Yin, Chunyan (2010) Modelling reliability of power electronics packaging. In: Proceedings of the ASME InterPack Conference 2009, IPACK2009. American Society of Mechanical Engineers, New York, USA, pp. 215-220. ISBN 9780791843604 (doi:10.1115/InterPACK2009-89430)

Musallam, M., Johnson, C.M., Yin, Chunyan, Lu, Hua and Bailey, C. (2009) Real-time comparison of power module failure modes under in-service conditions. In: 2009 13th European Conference on Power Electronics and Applications, EPE '09. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-10. ISBN 978-90-75815-13-9 (electronic), 978-1-4244-4432-8 (print)

Bailey, Christopher, Lu, Hua, Tilford, Tim, Rizvi, M.J. and Yin, Chunyan (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938505)

Patil, Nishad, Das, Diganta, Yin, Chunyan, Lu, Hua, Bailey, Chris and Pecht, Michael (2009) A fusion approach to IGBT power module prognostics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 195-199. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938491)

Musallam, Mahera, Johnson, C. Mark, Yin, Chunyan, Lu, Hua and Bailey, Chris (2008) Real-time life expectancy estimation in power modules. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications, 1 . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, pp. 231-236. ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684355)

Bailey, Chris, Lu, Hua, Yin, Chunyan and Tilford, Timothy (2008) Integrated reliability and prognostics prediction methodology for power electronic modules. In: IET Seminar on Aircraft Health Management for New Operational and Enterprise Solutions. IET Digest, 2008/12390 . The Institution of Engineering and Technology, Stevenage, UK, pp. 1-39. ISBN 978-0-86341-936-2 ISSN 0537-9989 (doi:10.1049/ic:20080638)

Thesis

Yin, Chunyan (2006) Experimental and modelling analysis on the performance of anisotropic conductive films as used in electronics packaging. PhD thesis, University of Greenwich.