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Items where Author is "Yin, C."

Items where Author is "Yin, C."

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Number of items: 5.

Bailey, C., Zhu, X., Lu, H. and Yin, C. (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:10.1109/EPTC.2012.6507130)

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

Bailey, C., Lu, H., Tilford, T., Rizvi, J. and Yin, C. (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938505)

Bailey, C., Lu, H., Yin, C. and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

This list was generated on Sat Apr 21 15:20:10 2018 BST.