Items where Author is "Wang, W."
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electric resistance
Wang, W., Liu, Z.D., Tian, Z.J., Huang, Y.H., Liu, Z.X. and Ekere, N.N. (2008) Study of wire electrolytic-spark hybrid machining of silicon solar wafer and surface characteristics. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, 593-596 . ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684417)
etching
Wang, W., Liu, Z.D., Tian, Z.J., Huang, Y.H., Liu, Z.X. and Ekere, N.N. (2008) Study of wire electrolytic-spark hybrid machining of silicon solar wafer and surface characteristics. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, 593-596 . ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684417)
fault location
Wang, W., Liu, Z.D., Tian, Z.J., Huang, Y.H., Liu, Z.X. and Ekere, N.N. (2008) Study of wire electrolytic-spark hybrid machining of silicon solar wafer and surface characteristics. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, 593-596 . ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684417)
machining
Wang, W., Liu, Z.D., Tian, Z.J., Huang, Y.H., Liu, Z.X. and Ekere, N.N. (2008) Study of wire electrolytic-spark hybrid machining of silicon solar wafer and surface characteristics. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, 593-596 . ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684417)
reflectivity
Wang, W., Liu, Z.D., Tian, Z.J., Huang, Y.H., Liu, Z.X. and Ekere, N.N. (2008) Study of wire electrolytic-spark hybrid machining of silicon solar wafer and surface characteristics. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, 593-596 . ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684417)
silicon
Wang, W., Liu, Z.D., Tian, Z.J., Huang, Y.H., Liu, Z.X. and Ekere, N.N. (2008) Study of wire electrolytic-spark hybrid machining of silicon solar wafer and surface characteristics. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, 593-596 . ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684417)
surface discharges
Wang, W., Liu, Z.D., Tian, Z.J., Huang, Y.H., Liu, Z.X. and Ekere, N.N. (2008) Study of wire electrolytic-spark hybrid machining of silicon solar wafer and surface characteristics. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, 593-596 . ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684417)
surface resistance
Wang, W., Liu, Z.D., Tian, Z.J., Huang, Y.H., Liu, Z.X. and Ekere, N.N. (2008) Study of wire electrolytic-spark hybrid machining of silicon solar wafer and surface characteristics. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, 593-596 . ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684417)
surface topography
Wang, W., Liu, Z.D., Tian, Z.J., Huang, Y.H., Liu, Z.X. and Ekere, N.N. (2008) Study of wire electrolytic-spark hybrid machining of silicon solar wafer and surface characteristics. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, 593-596 . ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684417)
wire
Wang, W., Liu, Z.D., Tian, Z.J., Huang, Y.H., Liu, Z.X. and Ekere, N.N. (2008) Study of wire electrolytic-spark hybrid machining of silicon solar wafer and surface characteristics. In: 2nd Electronics System Integration Technology Conference, Greenwich, UK. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc, Piscataway, NJ, USA, 593-596 . ISBN 978-1-4244-2813-7 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684417)