Items where Author is "Strusevitch, Nadia"
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accelerated temperature cycle
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)
agitation method
Kaufmann, Jens Goerg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris, Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-009-0886-2)
circuits
Richardson, Andrew, Bailey, Christopher, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:10.1108/03056120710723706)
continuum modeling
Christakis, Nicholas, Chapelle, Pierre, Strusevitch, Nadia, Bridle, Ian, Baxter, John, Patel, Mayur, Cross, Mark, Tüzün, Ugur, Reed, Alan R. and Bradley, Michael S.A. (2006) A hybrid numerical model for predicting segregation during core flow discharge. Advanced Powder Technology, 17 (6). pp. 641-662. ISSN 0921-8831 (doi:10.1163/156855206778917715)
copper
Kaufmann, Jens Goerg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris, Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-009-0886-2)
core flow
Christakis, Nicholas, Chapelle, Pierre, Strusevitch, Nadia, Bridle, Ian, Baxter, John, Patel, Mayur, Cross, Mark, Tüzün, Ugur, Reed, Alan R. and Bradley, Michael S.A. (2006) A hybrid numerical model for predicting segregation during core flow discharge. Advanced Powder Technology, 17 (6). pp. 641-662. ISSN 0921-8831 (doi:10.1163/156855206778917715)
Design for Reliability modelling
Stoyanov, Stoyan, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)
electrodeposition
Kaufmann, Jens Goerg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris, Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-009-0886-2)
Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)
Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. In: 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684362)
electromechanical devices
Richardson, Andrew, Bailey, Christopher, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:10.1108/03056120710723706)
electronics industry
Richardson, Andrew, Bailey, Christopher, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:10.1108/03056120710723706)
electroplating
Kaufmann, Jens Goerg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris, Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-009-0886-2)
Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)
embedded die
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: IMAPS Poland 2007: 31 International conference and exhibition: Proceedings. Institute of Electrical and Electronics Engineers, Inc.. ISBN 9788391770146
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)
fatigue life-time
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)
finite element analysis
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: IMAPS Poland 2007: 31 International conference and exhibition: Proceedings. Institute of Electrical and Electronics Engineers, Inc.. ISBN 9788391770146
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)
Finite Element Analysis (FEA)
Stoyanov, Stoyan, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)
granular material
Christakis, Nicholas, Chapelle, Pierre, Strusevitch, Nadia, Bridle, Ian, Baxter, John, Patel, Mayur, Cross, Mark, Tüzün, Ugur, Reed, Alan R. and Bradley, Michael S.A. (2006) A hybrid numerical model for predicting segregation during core flow discharge. Advanced Powder Technology, 17 (6). pp. 641-662. ISSN 0921-8831 (doi:10.1163/156855206778917715)
high density interconnection technology
Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)
lead free solder interconnects
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)
megasonic acoustic streaming
Kaufmann, Jens Goerg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris, Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-009-0886-2)
megasonic agitation
Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)
metals
Kaufmann, Jens Goerg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris, Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-009-0886-2)
micro-physical parametrizations
Christakis, Nicholas, Chapelle, Pierre, Strusevitch, Nadia, Bridle, Ian, Baxter, John, Patel, Mayur, Cross, Mark, Tüzün, Ugur, Reed, Alan R. and Bradley, Michael S.A. (2006) A hybrid numerical model for predicting segregation during core flow discharge. Advanced Powder Technology, 17 (6). pp. 641-662. ISSN 0921-8831 (doi:10.1163/156855206778917715)
microvias
Kaufmann, Jens, Desmulliez, Marc P.Y., Price, Dennis, Hughes, Mike, Strusevitch, Nadia and Bailey, Chris (2008) Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1235-1240. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684530)
non-linear transient finite element simulations
Stoyanov, Stoyan, Bailey, Christopher, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. In: 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432818)
numerical modelling
Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. In: 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684362)
Strusevitch, Nadia, Stoyanov, Stoyan, Liu, D., Bailey, Christopher, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)
numerical optimisation
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: IMAPS Poland 2007: 31 International conference and exhibition: Proceedings. Institute of Electrical and Electronics Engineers, Inc.. ISBN 9788391770146
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)
NXP
Stoyanov, Stoyan, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)
package design parameters
Stoyanov, Stoyan, Bailey, Christopher, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. In: 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432818)
packaging design
Strusevitch, Nadia, Stoyanov, Stoyan, Liu, D., Bailey, Christopher, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)
plating rate
Kaufmann, Jens Goerg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris, Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-009-0886-2)
reduced order models (ROM)
Stoyanov, Stoyan, Yannou, J.-M., Bailey, Christopher and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359948)
reliability management
Richardson, Andrew, Bailey, Christopher, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:10.1108/03056120710723706)
segregation
Christakis, Nicholas, Chapelle, Pierre, Strusevitch, Nadia, Bridle, Ian, Baxter, John, Patel, Mayur, Cross, Mark, Tüzün, Ugur, Reed, Alan R. and Bradley, Michael S.A. (2006) A hybrid numerical model for predicting segregation during core flow discharge. Advanced Powder Technology, 17 (6). pp. 641-662. ISSN 0921-8831 (doi:10.1163/156855206778917715)
side-by-side dies
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: IMAPS Poland 2007: 31 International conference and exhibition: Proceedings. Institute of Electrical and Electronics Engineers, Inc.. ISBN 9788391770146
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)
SiP
Strusevitch, Nadia, Stoyanov, Stoyan, Liu, D., Bailey, Christopher, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)
SiP structure
Stoyanov, Stoyan, Yannou, J.-M., Bailey, Christopher and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359948)
Stoyanov, Stoyan, Bailey, Christopher, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. In: 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432818)
SiP technology
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: IMAPS Poland 2007: 31 International conference and exhibition: Proceedings. Institute of Electrical and Electronics Engineers, Inc.. ISBN 9788391770146
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)
solder joints
Strusevitch, Nadia, Stoyanov, Stoyan, Liu, D., Bailey, Christopher, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)
stacked die
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)
stcked die
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: IMAPS Poland 2007: 31 International conference and exhibition: Proceedings. Institute of Electrical and Electronics Engineers, Inc.. ISBN 9788391770146
System-in-Package (SiP) structures
Stoyanov, Stoyan, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)
thermo-mechanical behaviour
Stoyanov, Stoyan, Yannou, J.-M., Bailey, Christopher and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359948)
Stoyanov, Stoyan, Bailey, Christopher, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. In: 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432818)
thermo-mechanical reliability
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: IMAPS Poland 2007: 31 International conference and exhibition: Proceedings. Institute of Electrical and Electronics Engineers, Inc.. ISBN 9788391770146
thermo-mechanical reliability analysis
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)
uncertainty analysis
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)
uncertainty analysisfatigue life-time
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: IMAPS Poland 2007: 31 International conference and exhibition: Proceedings. Institute of Electrical and Electronics Engineers, Inc.. ISBN 9788391770146
uniformity
Kaufmann, Jens Goerg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris, Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-009-0886-2)
Wafer Level Packaging (WLP)
Stoyanov, Stoyan, Strusevitch, Nadia, Rizvi, Jahir, Georgel, Vincent, Yannou, Jean-Marc and Bailey, Chris (2008) Design for reliability for wafer level system in package. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 293-298. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684364)
warpage
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: IMAPS Poland 2007: 31 International conference and exhibition: Proceedings. Institute of Electrical and Electronics Engineers, Inc.. ISBN 9788391770146
Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)