Items where Author is "Morris, J.E."
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Abaqus® v. 6.9
Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:10.1109/NMDC.2010.5652157)
axial and transverse coefficients of thermal expansion (CTE)
Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:10.1109/NMDC.2010.5652157)
CNT-Cu TSVs
Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:10.1109/NMDC.2010.5652157)
Cu vias
Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:10.1109/NMDC.2010.5652157)
cure data
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642820)
cure kinetics
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642820)
cure kinetics models
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)
curing of an encapsulant material
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129
curing process
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642822)
differential scanning calorimetry (DSC)
Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)
Differential Scanning Calorimetry (DSC)
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)
dual-section microwave system
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129
effective thermal conductivity
Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:10.1109/NMDC.2010.5652157)
electronic packaging
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129
Fourier transform infra-red spectroscopy (FTIR)
Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)
isotropic conductive adhesive materials
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)
microelectronics packaging
Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)
microwave
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129
microwave oven
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642822)
packaging
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages. In: International Microwave Power Institute’s 44th Annual Symposium: 2010 Proceedings. International Microwave Power Institute (IMPI), Mechanicsville, VA, USA, pp. 30-35. ISSN 1070-0129
particle swarm optimisation method
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)
particle swarm optimization
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. (2010) On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642820)
polymer crosslinking
Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:10.1109/ISSE.2010.5547360)
polymer cure models
Morris, J.E., Tilford, T., Bailey, C., Sinclair, K.I. and Desmulliez, M.P.Y. (2009) Polymer cure modeling for microelectronics applications. In: 32nd International Spring Seminar on Electronics Technology, 2009. ISSE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4260-7 (print) (doi:10.1109/ISSE.2009.5206929)
SWCNT (single walled carbon nanotube)-Cu composites
Sinha, A., Mihailovic, J.A., Morris, J.E., Hua, Lu and Bailey, C. (2010) Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application. In: Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE. Nanotechnology Materials and Devices Conference (NMDC), 2010 IEEE . IEEE Xplore Digital Library, Monterey, CA, pp. 262-266. ISBN 978-1-4244-8896-4 (doi:10.1109/NMDC.2010.5652157)
thermomechanical stress development
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S.K., Morris, J.E., Desmulliez, M.P.Y. and Bailey, C. (2010) Numerical analysis of microwave underfill cure in ball-grid packages. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642822)