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Items where Author is "Marks, Antony"

Items where Author is "Marks, Antony"

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Number of items: 10.

Marks, Antony, Ekere, Ndy, Mallik, Sabuj and Bhatti, Rajinderpal (2011) Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes. Soldering and Surface Mount Technology, 23 (2). pp. 75-84. ISSN 0954-0911 (doi:10.1108/09540911111120140)

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763635)

Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763615)

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684351)

Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2008) Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 1219-1224. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684527)

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.

Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar and Marks, Antony (2008) An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20 (2). pp. 3-10. ISSN 0954-0911 (doi:1108/09540910810871511)

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers, New York, USA, pp. 14-19. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417048)

Ekere, Ndy, Mallik, Sabuj, Durairaj, Rajkumar and Marks, Antony (2007) A study of the rheological properties of lead free solder paste formulations used for flip-chip interconnection. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. IEEE/CPM International Electronics Manufacturing Technology Symposium . IEEE, New York, USA, pp. 165-171. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417065)

Ekere, Ndy, Durairaj, Rajkumar, Mallik, Sabuj, Marks, Antony, Bauer, R. and Winter, M. (2006) Rheological characterisation of new lead-free solder paste formulations for flip-chip assembly. ESTC 2006: 1st Electronics Systemintegration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 995-1000. ISBN 1424405521 (doi:10.1109/ESTC.2006.280132)

This list was generated on Mon Jun 18 21:58:48 2018 BST.