adhesives

Amalu, Emeka H., Ekere, Ndy and Mallik, Sabuj (2011) Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process. Materials and Design, 32 (6). pp. 3189-3197. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2011.02.045)

ageing

Bernasko, Peter, Mallik, Sabuj, Ekere, Ndy and Takyi, G. (2011) Evaluating the effect of pad sizes on the inter-metallic layer formation and growth for Sn-Ag-Cu solders on Cu metallization. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.

Al/SiC

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

alloy

Kumar, Santosh, Mallik, Sabuj, Ekere, Ndy and Jung, Jaepil (2013) Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100 μm Size Solder Bumps. Metals and Materials International, 19 (5). pp. 1083-1090. ISSN 1598-9623 (Print), 2005-4149 (Online) (doi:https://doi.org/10.1007/s12540-013-5025-z)

aluminium

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

assembly lines

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers, New York, USA, pp. 14-19. ISBN 9781424413355 (doi:https://doi.org/10.1109/IEMT.2007.4417048)

attenuation

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763635)

Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763615)

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684351)

Mallik, Sabuj, Schmidt, M., Bauer, R. and Ekere, Ndy (2008) Influence of solder paste components on rheological behaviour. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, USA, pp. 1135-1140. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684512)

ball grid array

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:https://doi.org/10.1007/978-94-017-8832-8_3)

bonding

Kumar, Santosh, Mallik, Sabuj, Ekere, Ndy and Jung, Jaepil (2013) Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100 μm Size Solder Bumps. Metals and Materials International, 19 (5). pp. 1083-1090. ISSN 1598-9623 (Print), 2005-4149 (Online) (doi:https://doi.org/10.1007/s12540-013-5025-z)

cement-based materials

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763635)

Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763615)

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684351)

Mallik, Sabuj, Schmidt, M., Bauer, R. and Ekere, Ndy (2008) Influence of solder paste components on rheological behaviour. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, USA, pp. 1135-1140. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684512)

chip

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

chip resistors

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2014) Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications, 3 (5). pp. 254-259. ISSN 2327-2635 (Print), 2327-2643 (Online) (doi:https://doi.org/10.11648/j.ijmsa.20140305.27)

coefficient of thermal expansion

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

copper

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

cost

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

creep

Marks, Antony, Ekere, Ndy, Mallik, Sabuj and Bhatti, Rajinderpal (2011) Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes. Soldering and Surface Mount Technology, 23 (2). pp. 75-84. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911111120140)

Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910810885705)

Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar and Marks, Antony (2008) An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20 (2). pp. 3-10. ISSN 0954-0911 (doi:1108/09540910810871511)

creep-recovery

Ekere, N and Mallik, Sabuj (2008) A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications. In: Kobayashi, Akira, (ed.) Smart processing technology: SPT '07. High Temperature Society of Japan, Ibaraki, Japan, pp. 59-64.

density

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

design of experiments

Mallik, Sabuj and Ekere, Ndy (2011) Investigating the effects of area ratio and aspect ratio on stencil printing process used in the electronics assembly line. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.

ductile and brittle fractures

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:https://doi.org/10.1007/978-94-017-8832-8_3)

EDX

Nath, Jyotishman, Mallik, Sabuj and Bora, Anil (2015) A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D Metallurgical & Materials and Mining Engineering, 96 (1). pp. 1-6. ISSN 2250-2122 (Print), 2250-2130 (Online) (doi:https://doi.org/10.1007/s40033-014-0063-3)

elastic and plastic behaviour

Amalu, Emeka H., Ekere, Ndy and Mallik, Sabuj (2011) Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process. Materials and Design, 32 (6). pp. 3189-3197. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2011.02.045)

electronic control unit

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2010.09.023)

electronic materials

Kumar, Santosh, Mallik, Sabuj, Ekere, Ndy and Jung, Jaepil (2013) Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100 μm Size Solder Bumps. Metals and Materials International, 19 (5). pp. 1083-1090. ISSN 1598-9623 (Print), 2005-4149 (Online) (doi:https://doi.org/10.1007/s12540-013-5025-z)

electronics manufacturing

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers, New York, USA, pp. 14-19. ISBN 9781424413355 (doi:https://doi.org/10.1109/IEMT.2007.4417048)

emulsions

Ekere, Ndy, Mallik, Sabuj, Durairaj, Rajkumar and Marks, Antony (2007) A study of the rheological properties of lead free solder paste formulations used for flip-chip interconnection. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. IEEE/CPM International Electronics Manufacturing Technology Symposium . IEEE, New York, USA, pp. 165-171. ISBN 9781424413355 (doi:https://doi.org/10.1109/IEMT.2007.4417065)

fatigue

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

FESEM

Nath, Jyotishman, Mallik, Sabuj and Bora, Anil (2015) A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D Metallurgical & Materials and Mining Engineering, 96 (1). pp. 1-6. ISSN 2250-2122 (Print), 2250-2130 (Online) (doi:https://doi.org/10.1007/s40033-014-0063-3)

flip chip assembly

Ekere, N and Mallik, Sabuj (2008) A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications. In: Kobayashi, Akira, (ed.) Smart processing technology: SPT '07. High Temperature Society of Japan, Ibaraki, Japan, pp. 59-64.

Flip chip packaging

Sharma, Ashutosh, Mallik, Sabuj, Ekere, N. and Jung, Jae-Pil (2014) Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes. Journal of the Microelectronics and Packaging Society, 21 (4). pp. 1-13. ISSN 1226-9360 (Print), 2287-7525 (Online) (doi:https://doi.org/10.6117/kmeps.2014.21.4.001)

flip-chip assemblies

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers, New York, USA, pp. 14-19. ISBN 9781424413355 (doi:https://doi.org/10.1109/IEMT.2007.4417048)

flip-chip assembly

Mallik, Sabuj (2009) Study of the time-dependent rheological behaviour of lead-free solder pastes and flux mediums used for flip-chip assembly applications. PhD thesis, University of Greenwich.

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.

flip-chip assembly applications

Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2008) Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 1219-1224. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684527)

flow

Ekere, Ndy, Mallik, Sabuj, Durairaj, Rajkumar and Marks, Antony (2007) A study of the rheological properties of lead free solder paste formulations used for flip-chip interconnection. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. IEEE/CPM International Electronics Manufacturing Technology Symposium . IEEE, New York, USA, pp. 165-171. ISBN 9781424413355 (doi:https://doi.org/10.1109/IEMT.2007.4417065)

flux

Marks, Antony, Ekere, Ndy, Mallik, Sabuj and Bhatti, Rajinderpal (2011) Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes. Soldering and Surface Mount Technology, 23 (2). pp. 75-84. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911111120140)

Mallik, Sabuj (2009) Study of the time-dependent rheological behaviour of lead-free solder pastes and flux mediums used for flip-chip assembly applications. PhD thesis, University of Greenwich.

Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910810885705)

Fractures

Mallik, Sabuj and Kaiser, Franziska (2014) Reliability study of subsea electronic systems subjected to accelerated thermal cycle ageing. In: Proceedings of The World Congress on Engineering 2014. Newswood Limited, Hong Kong, pp. 1436-1440. ISBN 978-988-19253-5-0 ISSN 2078-0958 (Print), 2078-0966 (Online)

heat sink

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

heat sink geometry

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

industrial production

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers, New York, USA, pp. 14-19. ISBN 9781424413355 (doi:https://doi.org/10.1109/IEMT.2007.4417048)

interface materials

Bernasko, Peter, Mallik, Sabuj, Ekere, Ndy and Takyi, G. (2011) Evaluating the effect of pad sizes on the inter-metallic layer formation and growth for Sn-Ag-Cu solders on Cu metallization. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.

intermetallic compounds

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2015) Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology, 27 (1). pp. 52-58. ISSN 0954-0911 (doi:https://doi.org/10.1108/SSMT-07-2013-0019)

Intermetallic compounds (IC)

Nath, Jyotishman, Mallik, Sabuj and Bora, Anil (2015) A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D Metallurgical & Materials and Mining Engineering, 96 (1). pp. 1-6. ISSN 2250-2122 (Print), 2250-2130 (Online) (doi:https://doi.org/10.1007/s40033-014-0063-3)

Isothermal ageing

Nath, Jyotishman, Mallik, Sabuj and Bora, Anil (2015) A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D Metallurgical & Materials and Mining Engineering, 96 (1). pp. 1-6. ISSN 2250-2122 (Print), 2250-2130 (Online) (doi:https://doi.org/10.1007/s40033-014-0063-3)

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:https://doi.org/10.1007/978-94-017-8832-8_3)

isotropic conductive adhesives

Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)

lead

Marks, Antony, Ekere, Ndy, Mallik, Sabuj and Bhatti, Rajinderpal (2011) Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes. Soldering and Surface Mount Technology, 23 (2). pp. 75-84. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911111120140)

Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar and Marks, Antony (2008) An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20 (2). pp. 3-10. ISSN 0954-0911 (doi:1108/09540910810871511)

lead free solder alloy

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:https://doi.org/10.1007/978-94-017-8832-8_3)

Lead Free Solder Paste

Mallik, Sabuj, Njoku, Jude and Takyi, Gabriel (2015) Quantitative evaluation of voids in lead free solder joints. Applied Mechanics and Materials, 772. pp. 284-289. ISSN 1660-9336

lead-free

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

lead-free solder pastes

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers, New York, USA, pp. 14-19. ISBN 9781424413355 (doi:https://doi.org/10.1109/IEMT.2007.4417048)

lead-free soldering

Ekere, N and Mallik, Sabuj (2008) A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications. In: Kobayashi, Akira, (ed.) Smart processing technology: SPT '07. High Temperature Society of Japan, Ibaraki, Japan, pp. 59-64.

metal matrix composites

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2010.09.023)

metallurgy

Mallik, Sabuj (2009) Study of the time-dependent rheological behaviour of lead-free solder pastes and flux mediums used for flip-chip assembly applications. PhD thesis, University of Greenwich.

micro-contact

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

micro-gap

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

microelectronics

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

microstructure

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763635)

Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763615)

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684351)

Mallik, Sabuj, Schmidt, M., Bauer, R. and Ekere, Ndy (2008) Influence of solder paste components on rheological behaviour. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, USA, pp. 1135-1140. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684512)

NDT

Amalu, Emeka H., Ekere, Ndy and Mallik, Sabuj (2011) Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process. Materials and Design, 32 (6). pp. 3189-3197. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2011.02.045)

new solder paste formulation

Ekere, N and Mallik, Sabuj (2008) A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications. In: Kobayashi, Akira, (ed.) Smart processing technology: SPT '07. High Temperature Society of Japan, Ibaraki, Japan, pp. 59-64.

non-destructive testing

Amalu, Emeka H., Ekere, Ndy and Mallik, Sabuj (2011) Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process. Materials and Design, 32 (6). pp. 3189-3197. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2011.02.045)

nonlinear flow

Mallik, Sabuj, Chan, Erica Hiu Laam and Ekere, Ndy (2012) Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications. Journal of Materials Engineering and Performance, 22 (4). pp. 1186-1193. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:https://doi.org/10.1007/s11665-012-0360-7)

normal probability plot

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2014) Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications, 3 (5). pp. 254-259. ISSN 2327-2635 (Print), 2327-2643 (Online) (doi:https://doi.org/10.11648/j.ijmsa.20140305.27)

particle size measurement

Marks, Antony, Ekere, Ndy, Mallik, Sabuj and Bhatti, Rajinderpal (2011) Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes. Soldering and Surface Mount Technology, 23 (2). pp. 75-84. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911111120140)

PCB

Nath, Jyotishman, Mallik, Sabuj and Bora, Anil (2015) A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D Metallurgical & Materials and Mining Engineering, 96 (1). pp. 1-6. ISSN 2250-2122 (Print), 2250-2130 (Online) (doi:https://doi.org/10.1007/s40033-014-0063-3)

printing

Mallik, Sabuj (2010) Rheological characterisation and modelling of electronic materials: time-dependent behaviours of lead-free solder pastes and flux mediums. LAP Lambert Academic Publishing GmbH & Co. KG, Saarbrücken, Germany. ISBN 978-3-8433-7771-3

printing performance

Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:https://doi.org/10.1109/EPTC.2009.5416423)

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.

printing processes

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers, New York, USA, pp. 14-19. ISBN 9781424413355 (doi:https://doi.org/10.1109/IEMT.2007.4417048)

quality control

Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910810885705)

reflow parameters

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2014) Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications, 3 (5). pp. 254-259. ISSN 2327-2635 (Print), 2327-2643 (Online) (doi:https://doi.org/10.11648/j.ijmsa.20140305.27)

Reflow process

Nath, Jyotishman, Mallik, Sabuj and Bora, Anil (2015) A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D Metallurgical & Materials and Mining Engineering, 96 (1). pp. 1-6. ISSN 2250-2122 (Print), 2250-2130 (Online) (doi:https://doi.org/10.1007/s40033-014-0063-3)

Reliability

Mallik, Sabuj and Kaiser, Franziska (2014) Reliability study of subsea electronic systems subjected to accelerated thermal cycle ageing. In: Proceedings of The World Congress on Engineering 2014. Newswood Limited, Hong Kong, pp. 1436-1440. ISBN 978-988-19253-5-0 ISSN 2078-0958 (Print), 2078-0966 (Online)

rheological behaviour

Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2008) Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 1219-1224. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684527)

rheological behaviours

Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:https://doi.org/10.1109/EPTC.2009.5416423)

Mallik, Sabuj (2009) Study of the time-dependent rheological behaviour of lead-free solder pastes and flux mediums used for flip-chip assembly applications. PhD thesis, University of Greenwich.

rheological characterisation

Ekere, N and Mallik, Sabuj (2008) A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications. In: Kobayashi, Akira, (ed.) Smart processing technology: SPT '07. High Temperature Society of Japan, Ibaraki, Japan, pp. 59-64.

rheological characteristics

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.

Rheology

Sharma, Ashutosh, Mallik, Sabuj, Ekere, N. and Jung, Jae-Pil (2014) Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes. Journal of the Microelectronics and Packaging Society, 21 (4). pp. 1-13. ISSN 1226-9360 (Print), 2287-7525 (Online) (doi:https://doi.org/10.6117/kmeps.2014.21.4.001)

Mallik, Sabuj, Chan, Erica Hiu Laam and Ekere, Ndy (2012) Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications. Journal of Materials Engineering and Performance, 22 (4). pp. 1186-1193. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:https://doi.org/10.1007/s11665-012-0360-7)

Marks, Antony, Ekere, Ndy, Mallik, Sabuj and Bhatti, Rajinderpal (2011) Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes. Soldering and Surface Mount Technology, 23 (2). pp. 75-84. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911111120140)

Mallik, Sabuj (2010) Rheological characterisation and modelling of electronic materials: time-dependent behaviours of lead-free solder pastes and flux mediums. LAP Lambert Academic Publishing GmbH & Co. KG, Saarbrücken, Germany. ISBN 978-3-8433-7771-3

Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)

Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)

Mallik, Sabuj, Schmidt, M., Bauer, R. and Ekere, Ndy (2008) Influence of solder paste components on rheological behaviour. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, USA, pp. 1135-1140. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684512)

Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910810885705)

Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar and Marks, Antony (2008) An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20 (2). pp. 3-10. ISSN 0954-0911 (doi:1108/09540910810871511)

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers, New York, USA, pp. 14-19. ISBN 9781424413355 (doi:https://doi.org/10.1109/IEMT.2007.4417048)

scanning electron microscopy (SEM)

Kumar, Santosh, Mallik, Sabuj, Ekere, Ndy and Jung, Jaepil (2013) Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100 μm Size Solder Bumps. Metals and Materials International, 19 (5). pp. 1083-1090. ISSN 1598-9623 (Print), 2005-4149 (Online) (doi:https://doi.org/10.1007/s12540-013-5025-z)

Shear strength

Nath, Jyotishman, Mallik, Sabuj and Bora, Anil (2015) A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D Metallurgical & Materials and Mining Engineering, 96 (1). pp. 1-6. ISSN 2250-2122 (Print), 2250-2130 (Online) (doi:https://doi.org/10.1007/s40033-014-0063-3)

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2015) Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology, 27 (1). pp. 52-58. ISSN 0954-0911 (doi:https://doi.org/10.1108/SSMT-07-2013-0019)

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2014) Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications, 3 (5). pp. 254-259. ISSN 2327-2635 (Print), 2327-2643 (Online) (doi:https://doi.org/10.11648/j.ijmsa.20140305.27)

Mallik, Sabuj and Kaiser, Franziska (2014) Reliability study of subsea electronic systems subjected to accelerated thermal cycle ageing. In: Proceedings of The World Congress on Engineering 2014. Newswood Limited, Hong Kong, pp. 1436-1440. ISBN 978-988-19253-5-0 ISSN 2078-0958 (Print), 2078-0966 (Online)

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:https://doi.org/10.1007/978-94-017-8832-8_3)

shear testing

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers, New York, USA, pp. 14-19. ISBN 9781424413355 (doi:https://doi.org/10.1109/IEMT.2007.4417048)

slip

Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar and Marks, Antony (2008) An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20 (2). pp. 3-10. ISSN 0954-0911 (doi:1108/09540910810871511)

SMT solder joints

Nath, Jyotishman, Mallik, Sabuj and Bora, Anil (2015) A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints. Journal of The Institution of Engineers (India): Series D Metallurgical & Materials and Mining Engineering, 96 (1). pp. 1-6. ISSN 2250-2122 (Print), 2250-2130 (Online) (doi:https://doi.org/10.1007/s40033-014-0063-3)

Sn-Ag-Cu

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2015) Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology, 27 (1). pp. 52-58. ISSN 0954-0911 (doi:https://doi.org/10.1108/SSMT-07-2013-0019)

solder

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2015) Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology, 27 (1). pp. 52-58. ISSN 0954-0911 (doi:https://doi.org/10.1108/SSMT-07-2013-0019)

solder joint

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2014) Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications, 3 (5). pp. 254-259. ISSN 2327-2635 (Print), 2327-2643 (Online) (doi:https://doi.org/10.11648/j.ijmsa.20140305.27)

Mallik, Sabuj and Kaiser, Franziska (2014) Reliability study of subsea electronic systems subjected to accelerated thermal cycle ageing. In: Proceedings of The World Congress on Engineering 2014. Newswood Limited, Hong Kong, pp. 1436-1440. ISBN 978-988-19253-5-0 ISSN 2078-0958 (Print), 2078-0966 (Online)

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:https://doi.org/10.1007/978-94-017-8832-8_3)

Bernasko, Peter, Mallik, Sabuj, Ekere, Ndy and Takyi, G. (2011) Evaluating the effect of pad sizes on the inter-metallic layer formation and growth for Sn-Ag-Cu solders on Cu metallization. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.

solder joints

Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763615)

Solder paste

Sharma, Ashutosh, Mallik, Sabuj, Ekere, N. and Jung, Jae-Pil (2014) Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes. Journal of the Microelectronics and Packaging Society, 21 (4). pp. 1-13. ISSN 1226-9360 (Print), 2287-7525 (Online) (doi:https://doi.org/10.6117/kmeps.2014.21.4.001)

Mallik, Sabuj, Chan, Erica Hiu Laam and Ekere, Ndy (2012) Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications. Journal of Materials Engineering and Performance, 22 (4). pp. 1186-1193. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:https://doi.org/10.1007/s11665-012-0360-7)

Mallik, Sabuj and Ekere, Ndy (2011) Investigating the effects of area ratio and aspect ratio on stencil printing process used in the electronics assembly line. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.

Marks, Antony, Ekere, Ndy, Mallik, Sabuj and Bhatti, Rajinderpal (2011) Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes. Soldering and Surface Mount Technology, 23 (2). pp. 75-84. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911111120140)

Mallik, Sabuj (2010) Rheological characterisation and modelling of electronic materials: time-dependent behaviours of lead-free solder pastes and flux mediums. LAP Lambert Academic Publishing GmbH & Co. KG, Saarbrücken, Germany. ISBN 978-3-8433-7771-3

Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)

Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910810885705)

Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar and Marks, Antony (2008) An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20 (2). pp. 3-10. ISSN 0954-0911 (doi:1108/09540910810871511)

solder pastes

Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:https://doi.org/10.1109/EPTC.2009.5416423)

Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)

Mallik, Sabuj (2009) Study of the time-dependent rheological behaviour of lead-free solder pastes and flux mediums used for flip-chip assembly applications. PhD thesis, University of Greenwich.

Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763615)

Mallik, Sabuj, Schmidt, M., Bauer, R. and Ekere, Ndy (2008) Influence of solder paste components on rheological behaviour. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, USA, pp. 1135-1140. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684512)

Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2008) Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 1219-1224. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684527)

Ekere, Ndy, Durairaj, Rajkumar, Mallik, Sabuj, Marks, Antony, Bauer, R. and Winter, M. (2006) Rheological characterisation of new lead-free solder paste formulations for flip-chip assembly. ESTC 2006: 1st Electronics Systemintegration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 995-1000. ISBN 1424405521 (doi:https://doi.org/10.1109/ESTC.2006.280132)

Soldering

Mallik, Sabuj, Njoku, Jude and Takyi, Gabriel (2015) Quantitative evaluation of voids in lead free solder joints. Applied Mechanics and Materials, 772. pp. 284-289. ISSN 1660-9336

Kumar, Santosh, Mallik, Sabuj, Ekere, Ndy and Jung, Jaepil (2013) Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100 μm Size Solder Bumps. Metals and Materials International, 19 (5). pp. 1083-1090. ISSN 1598-9623 (Print), 2005-4149 (Online) (doi:https://doi.org/10.1007/s12540-013-5025-z)

solders

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

Stencil printing

Sharma, Ashutosh, Mallik, Sabuj, Ekere, N. and Jung, Jae-Pil (2014) Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes. Journal of the Microelectronics and Packaging Society, 21 (4). pp. 1-13. ISSN 1226-9360 (Print), 2287-7525 (Online) (doi:https://doi.org/10.6117/kmeps.2014.21.4.001)

Mallik, Sabuj and Ekere, Ndy (2011) Investigating the effects of area ratio and aspect ratio on stencil printing process used in the electronics assembly line. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.

stress

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763635)

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684351)

Mallik, Sabuj, Schmidt, M., Bauer, R. and Ekere, Ndy (2008) Influence of solder paste components on rheological behaviour. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, USA, pp. 1135-1140. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684512)

stretched exponential model

Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)

suspension

Mallik, Sabuj, Chan, Erica Hiu Laam and Ekere, Ndy (2012) Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications. Journal of Materials Engineering and Performance, 22 (4). pp. 1186-1193. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:https://doi.org/10.1007/s11665-012-0360-7)

thermal conductive polymer

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2010.09.023)

thermal conductivity

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

thermal constriction

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

thermal efficiency

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

thermal interface material

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2010.09.023)

thermal interface materials

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

thermal management

Mallik, Sabuj, Ekere, Ndy, Best, Chris and Bhatti, Raj (2011) Investigation of thermal management materials for automotive electronic control units. Applied Thermal Engineering, 31 (2-3). pp. 355-362. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2010.09.023)

thermal management materials

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy and Mallik, Sabuj (2011) Advanced thermal management materials for heat sinks used in microelectronics. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-8. ISBN 9781467306942

thixotropy

Mallik, Sabuj (2010) Rheological characterisation and modelling of electronic materials: time-dependent behaviours of lead-free solder pastes and flux mediums. LAP Lambert Academic Publishing GmbH & Co. KG, Saarbrücken, Germany. ISBN 978-3-8433-7771-3

Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)

Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)

ultra-fine pitch assembly

Ekere, N and Mallik, Sabuj (2008) A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications. In: Kobayashi, Akira, (ed.) Smart processing technology: SPT '07. High Temperature Society of Japan, Ibaraki, Japan, pp. 59-64.

viscoelasticity

Mallik, Sabuj, Chan, Erica Hiu Laam and Ekere, Ndy (2012) Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications. Journal of Materials Engineering and Performance, 22 (4). pp. 1186-1193. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:https://doi.org/10.1007/s11665-012-0360-7)

Viscosity

Sharma, Ashutosh, Mallik, Sabuj, Ekere, N. and Jung, Jae-Pil (2014) Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes. Journal of the Microelectronics and Packaging Society, 21 (4). pp. 1-13. ISSN 1226-9360 (Print), 2287-7525 (Online) (doi:https://doi.org/10.6117/kmeps.2014.21.4.001)

Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763635)

Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763615)

Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910810885705)

Voiding

Mallik, Sabuj, Njoku, Jude and Takyi, Gabriel (2015) Quantitative evaluation of voids in lead free solder joints. Applied Mechanics and Materials, 772. pp. 284-289. ISSN 1660-9336

wall-slip

Ekere, N and Mallik, Sabuj (2008) A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications. In: Kobayashi, Akira, (ed.) Smart processing technology: SPT '07. High Temperature Society of Japan, Ibaraki, Japan, pp. 59-64.

water

Ekere, Ndy, Mallik, Sabuj, Durairaj, Rajkumar and Marks, Antony (2007) A study of the rheological properties of lead free solder paste formulations used for flip-chip interconnection. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. IEEE/CPM International Electronics Manufacturing Technology Symposium . IEEE, New York, USA, pp. 165-171. ISBN 9781424413355 (doi:https://doi.org/10.1109/IEMT.2007.4417065)

X-ray

Mallik, Sabuj, Njoku, Jude and Takyi, Gabriel (2015) Quantitative evaluation of voids in lead free solder joints. Applied Mechanics and Materials, 772. pp. 284-289. ISSN 1660-9336