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Items where Author is "Lu, H."

Items where Author is "Lu, H."

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96.5Sn3.0Ag0.5Cu lead-free solder adhesion adhesive adhesive bonding ageing (materials) analysis anisotropic conductive film (ACF) anisotropic conductive films anisotropic magnetoresistance assembling Assembly backlight units backlights ball grid arrays Ball Grid Arrays (BGAs) Bayesian Networks (BN) BGA bridge circuits butt joints carbon-nanotubes circuit reliability computational mechanics computer modelling computer simulation concave joints conductive adhesives contact angle contact resistance copper Cu columns curing damage delamination design design environment electro-migration Electromigration electronic components electronic package electronic product assembly failure analysis fatigue fatigue of materials films (states of matter) finite element Finite element analysis finite element method finite element modeling finite element modelling Flex-No-Lead project flexible circuit board flexible-substrates flip chip flip chip devices flip chip on flex flip chip packaging flip-chip assembly flip-chip devices flip-chip devices printed circuit manufacture flux Garofalo equation glass transition temperature Heating heterogeneous electronics based systems higher-density interconnection human vision models insulated gate bipolar transistors integrated circuit integrated circuit interconnections integrated circuit modelling integrated circuit reliability interconnection technology interconnections interfaces (materials) intermetallic intermetallic compounds junction temperatures just-noticeable difference key parameters LCD lead-free soldering lead-free solders LED LED Lateral IGBT Underfill LED backlighting devices LED driver level set method LIGBT light emitting diodes (LEDs) loss modulus luminance Material properties matrix mechanical loading metal migration microelectronic processing Miner's law of linear damage accumulation miniaturisation Modelling modules moisture absorption multi-disciplinary analysis multi-disciplinary design multi-physics multiphysics modeling no-flow underfill materials numerical modeling optical and thermal modelling techniques optical performance optical simulation packaging pb-free physics of failure (PoF) Physics-of-failure (PoF) model plastic deformation polymer films power bipolar transistors Power electronic module Power Electronic Module (PEM) power electronics modules (PEMs) power integrated circuits predictive reliability prognostic and health management (PHM)systems ray tracing calculations reflow soldering reinforcement method reinforcement technique reliability reliability prediction risk assessment ruggedized electronic display SAC alloy scanning acoustic microscopes second level semiconductor device semiconductor device modeling semiconductor device reliability Sensitivity analysis silicon Sn-2.8Ag-0.5Cu-1.0Bi SnPb and SnAgCu (solder alloys) solder solder balls solder isothermal fatigue failure solder joints Solder material soldered joints soldering solid state lighting solid state lighting systems solidification storage modulus strength of materials stress stress intensity factor surface Surrogate models temperature Temperature distribution tension Thermal conductivity thermal cycling thermal management thermo-mechanical loading Thermomigration thick film chip resistors Thin film time to failure underfill underfilling vibration vibration test viewability voids evolution Wettability wetting force X ray microscopes
Number of items: 194.

96.5Sn3.0Ag0.5Cu lead-free solder

Kamara, E., Lu, H., Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

adhesion

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H. and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:10.1108/09540910510597492)

adhesive

Rizvi, M.J., Lu, H., Bailey, C., Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:10.1016/j.mee.2007.05.045)

adhesive bonding

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

ageing (materials)

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H. and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:10.1108/09540910510597492)

analysis

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

anisotropic conductive film (ACF)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2013) Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Microelectronic Engineering, 107. pp. 17-22. ISSN 0167-9317 (doi:10.1016/j.mee.2013.02.070)

anisotropic conductive films

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

anisotropic magnetoresistance

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

assembling

Lu, H. and Bailey, C. (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:10.1109/EPTC.2002.1185694)

Assembly

Tilford, T., Cook, A., Lu, H., Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sept 2014, Helsinki, Finland. (doi:10.1109/ESTC.2014.6962815)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

backlight units

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

backlights

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

ball grid arrays

Bailey, C., Stoyanov, S. and Lu, H. (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:10.1109/HPD.2004.1346684)

Ball Grid Arrays (BGAs)

Kamara, E., Lu, H., Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

Bayesian Networks (BN)

Yin, C.Y., Lu, H., Musallam, M., Bailey, C. and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

BGA

Alam, M.O., Lu, H., Bailey, Chris and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:10.1016/j.commatsci.2008.12.001)

bridge circuits

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

butt joints

Alam, M.O., Lu, H., Bailey, Chris and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:10.1016/j.commatsci.2008.12.001)

carbon-nanotubes

Bailey, C. and Lu, H. (2011) Interconnect technologies using carbon nanotubes: Current status and future challenges. In: 2011 34th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:10.1109/ISSE.2011.6053539)

circuit reliability

Lu, H. and Bailey, C. (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:10.1109/EPTC.2002.1185694)

computational mechanics

Stoyanov, S., Bailey, C., Lu, H. and Cross, M. (2002) Integrated computational mechanics and optimization for design of electronic components. In: Parmee, Ian C. and Hajela, Prabhat, (eds.) Optimization In Industry. Springer Verlag, pp. 57-71. ISBN 9781852338342

computer modelling

Rizvi, M.J., Bailey, C. and Lu, H. (2010) Damage predictions in a chip resistor solder joint on flexible circuit board. Microelectronic Engineering, 87 (10). pp. 1889-1895. ISSN 0167-9317 (doi:10.1016/j.mee.2009.11.023)

Lu, H. and Bailey, C. (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

computer simulation

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

concave joints

Kamara, E., Lu, H., Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

conductive adhesives

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

contact angle

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

contact resistance

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

copper

Lu, H. and Bailey, C. (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:10.1109/EPTC.2002.1185694)

Cu columns

Lu, H. and Bailey, C. (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

curing

Rizvi, M.J., Lu, H., Bailey, C., Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:10.1016/j.mee.2007.05.045)

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

damage

Rizvi, M.J., Bailey, C. and Lu, H. (2010) Damage predictions in a chip resistor solder joint on flexible circuit board. Microelectronic Engineering, 87 (10). pp. 1889-1895. ISSN 0167-9317 (doi:10.1016/j.mee.2009.11.023)

delamination

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

design

Stoyanov, S., Bailey, C., Lu, H. and Cross, M. (2002) Integrated computational mechanics and optimization for design of electronic components. In: Parmee, Ian C. and Hajela, Prabhat, (eds.) Optimization In Industry. Springer Verlag, pp. 57-71. ISBN 9781852338342

design environment

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

electro-migration

Bailey, C., Zhu, X., Lu, H. and Yin, C. (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:10.1109/EPTC.2012.6507130)

Electromigration

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Bailey, C. and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S.H., Bailey, C. and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

electronic components

Stoyanov, S., Bailey, C., Lu, H. and Cross, M. (2002) Integrated computational mechanics and optimization for design of electronic components. In: Parmee, Ian C. and Hajela, Prabhat, (eds.) Optimization In Industry. Springer Verlag, pp. 57-71. ISBN 9781852338342

electronic package

Alam, M.O., Lu, H., Bailey, Chris and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:10.1016/j.commatsci.2008.12.001)

electronic product assembly

Bailey, C., Lu, H. and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:10.1016/S0168-9274(01)00065-4)

failure analysis

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

fatigue

Bailey, C., Rajaguru, P., Lu, H., Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical Modelling of High Power Lateral IGBT for LED Driver Applications. In: IEEE 68 Electronic Components and Technology Conference, 29/05/2018, San Diego, CA. (Submitted)

fatigue of materials

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

films (states of matter)

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H. and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:10.1108/09540910510597492)

finite element

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

Finite element analysis

Rajaguru, P., Lu, H., Bailey, C., Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.12.002)

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

finite element method

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S.H., Bailey, C. and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

finite element modeling

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

finite element modelling

Berthou, M., Lu, H., Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:10.1109/CPMTSYMPJ.2010.5679536)

Flex-No-Lead project

Rizvi, M.J., Yin, C.Y, Bailey, C. and Lu, H. (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

flexible circuit board

Rizvi, M.J., Bailey, C. and Lu, H. (2010) Damage predictions in a chip resistor solder joint on flexible circuit board. Microelectronic Engineering, 87 (10). pp. 1889-1895. ISSN 0167-9317 (doi:10.1016/j.mee.2009.11.023)

flexible-substrates

Rizvi, M.J., Yin, C.Y, Bailey, C. and Lu, H. (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

flip chip

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

flip chip devices

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

flip chip on flex

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2013) Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Microelectronic Engineering, 107. pp. 17-22. ISSN 0167-9317 (doi:10.1016/j.mee.2013.02.070)

flip chip packaging

Lu, H. and Bailey, C. (2002) Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips. In: The Fifth International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 85-89. ISBN 078039822X

flip-chip assembly

Lu, H., Stoyanov, S., Bailey, C., Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

flip-chip devices

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

Bailey, C., Stoyanov, S. and Lu, H. (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:10.1109/HPD.2004.1346684)

flip-chip devices printed circuit manufacture

Lu, H. and Bailey, C. (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:10.1109/EPTC.2002.1185694)

flux

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

Garofalo equation

Rizvi, M.J., Lu, H., Bailey, C., Bevan, E., Poutney, N. and Coates, J. (2010) Finite element modelling of failures in thick film chip resistor solder joints. In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010. in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010 . IEEE Xplore Digital Library, Taipei, pp. 1-4. ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print) ISSN 2150-5934 (doi:10.1109/IMPACT.2010.5699488)

glass transition temperature

Rizvi, M.J., Lu, H., Bailey, C., Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:10.1016/j.mee.2007.05.045)

Heating

Tilford, T., Cook, A., Lu, H., Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sept 2014, Helsinki, Finland. (doi:10.1109/ESTC.2014.6962815)

heterogeneous electronics based systems

Bailey, C. and Lu, H. (2011) Interconnect technologies using carbon nanotubes: Current status and future challenges. In: 2011 34th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:10.1109/ISSE.2011.6053539)

higher-density interconnection

Bailey, C. and Lu, H. (2011) Interconnect technologies using carbon nanotubes: Current status and future challenges. In: 2011 34th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:10.1109/ISSE.2011.6053539)

human vision models

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

insulated gate bipolar transistors

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

integrated circuit

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

integrated circuit interconnections

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

integrated circuit modelling

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

integrated circuit reliability

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

interconnection technology

Bailey, C. and Lu, H. (2011) Interconnect technologies using carbon nanotubes: Current status and future challenges. In: 2011 34th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:10.1109/ISSE.2011.6053539)

interconnections

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

interfaces (materials)

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

intermetallic

Alam, M.O., Lu, H., Bailey, Chris and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:10.1016/j.commatsci.2008.12.001)

intermetallic compounds

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

junction temperatures

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

just-noticeable difference

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

key parameters

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

LCD

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

lead-free soldering

Rizvi, M.J., Yin, C.Y, Bailey, C. and Lu, H. (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

lead-free solders

Kamara, E., Lu, H., Bailey, C., Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:10.1016/j.microrel.2010.07.152)

LED

Bailey, C., Rajaguru, P., Lu, H., Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical Modelling of High Power Lateral IGBT for LED Driver Applications. In: IEEE 68 Electronic Components and Technology Conference, 29/05/2018, San Diego, CA. (Submitted)

Rajaguru, P., Bailey, C., Lu, H., Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-Design/Simulation of Flip-Chip Assembly for High Voltage IGBT Packages. In: 23rd International Workshop on Thermal Investigations of ICs and Systems, September 2017, Amsterdam /NL.

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

LED Lateral IGBT Underfill

Rajaguru, P., Lu, H., Bailey, C., Castellazzi, A., Pathirana, V., Udugampola, N. and Udrea, F. (2018) Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectronics Reliability, 83. pp. 146-156. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.02.024)

LED backlighting devices

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

LED driver

Rajaguru, P., Lu, H., Bailey, C., Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-4673-9706-3 (doi:10.1109/THERMINIC.2015.7389607)

level set method

Bailey, C., Lu, H. and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:10.1016/S0168-9274(01)00065-4)

LIGBT

Bailey, C., Rajaguru, P., Lu, H., Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical Modelling of High Power Lateral IGBT for LED Driver Applications. In: IEEE 68 Electronic Components and Technology Conference, 29/05/2018, San Diego, CA. (Submitted)

Rajaguru, P., Lu, H., Bailey, C., Ortiz-Gonzalez, J. and Alatise, O. (2016) Electro-thermo-mechanical modelling and analysis of the Press Pack Diode in Power Electronics. In: 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-4673-9706-3 (doi:10.1109/THERMINIC.2015.7389607)

light emitting diodes (LEDs)

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

loss modulus

Rizvi, M.J., Lu, H., Bailey, C., Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:10.1016/j.mee.2007.05.045)

luminance

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

Material properties

Tilford, T., Cook, A., Lu, H., Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sept 2014, Helsinki, Finland. (doi:10.1109/ESTC.2014.6962815)

matrix

Berthou, M., Lu, H., Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:10.1109/CPMTSYMPJ.2010.5679536)

mechanical loading

Berthou, M., Lu, H., Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:10.1109/CPMTSYMPJ.2010.5679536)

metal migration

Bailey, C., Zhu, X., Lu, H. and Yin, C. (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:10.1109/EPTC.2012.6507130)

microelectronic processing

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

Miner's law of linear damage accumulation

Rizvi, M.J., Lu, H., Bailey, C., Bevan, E., Poutney, N. and Coates, J. (2010) Finite element modelling of failures in thick film chip resistor solder joints. In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010. in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010 . IEEE Xplore Digital Library, Taipei, pp. 1-4. ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print) ISSN 2150-5934 (doi:10.1109/IMPACT.2010.5699488)

miniaturisation

Bailey, C. and Lu, H. (2011) Interconnect technologies using carbon nanotubes: Current status and future challenges. In: 2011 34th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:10.1109/ISSE.2011.6053539)

Modelling

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Bailey, C. and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

modules

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

moisture absorption

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2013) Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications. Microelectronic Engineering, 107. pp. 17-22. ISSN 0167-9317 (doi:10.1016/j.mee.2013.02.070)

multi-disciplinary analysis

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

multi-disciplinary design

Bailey, C., Lu, H., Tilford, T., Rizvi, J. and Yin, C. (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938505)

multi-physics

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

Bailey, C., Lu, H., Tilford, T., Rizvi, J. and Yin, C. (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938505)

multiphysics modeling

Bailey, C., Lu, H. and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:10.1016/S0168-9274(01)00065-4)

no-flow underfill materials

Lu, H., Stoyanov, S., Bailey, C., Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

numerical modeling

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S.H., Bailey, C. and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

optical and thermal modelling techniques

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

optical performance

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

optical simulation

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

packaging

Bailey, C., Stoyanov, S. and Lu, H. (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:10.1109/HPD.2004.1346684)

pb-free

Alam, M.O., Lu, H., Bailey, Chris and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:10.1016/j.commatsci.2008.12.001)

physics of failure (PoF)

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

Physics-of-failure (PoF) model

Yin, C.Y., Lu, H., Musallam, M., Bailey, C. and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

plastic deformation

Alam, M.O., Lu, H., Bailey, Chris and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:10.1016/j.commatsci.2008.12.001)

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

polymer films

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

power bipolar transistors

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

Power electronic module

Rajaguru, P., Lu, H., Bailey, C., Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.12.002)

Power Electronic Module (PEM)

Bailey, C., Lu, H., Yin, C. and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

power electronics modules (PEMs)

Yin, C.Y., Lu, H., Musallam, M., Bailey, C. and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

power integrated circuits

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

predictive reliability

Bailey, C., Lu, H., Yin, C. and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

prognostic and health management (PHM)systems

Yin, C.Y., Lu, H., Musallam, M., Bailey, C. and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

ray tracing calculations

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

reflow soldering

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2004) Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives. In: 2004 International IEEE Conference on Asian Green Electronics (AGEC) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-245. ISBN 0-7803-8203-X (doi:10.1109/AGEC.2004.1290912)

Lu, H. and Bailey, C. (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:10.1109/EPTC.2002.1185694)

reinforcement method

Berthou, M., Lu, H., Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:10.1109/CPMTSYMPJ.2010.5679536)

reinforcement technique

Berthou, M., Lu, H., Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:10.1109/CPMTSYMPJ.2010.5679536)

reliability

Kamara, E., Lu, H., Bailey, C., Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:10.1016/j.microrel.2010.07.152)

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

reliability prediction

Yin, C.Y., Lu, H., Musallam, M., Bailey, C. and Johnson, C. M. (2008) A prognostic assessment method for power electronics modules. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1353-1358. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684552)

risk assessment

Bailey, C., Lu, H., Yin, C. and Ridout, S. (2008) Predictive reliability, prognostics and risk assessment for power modules. CIPS 2008: 5th International Conference on Integrated Power Electronics Systems. Proceedings, March, 11-13, 2008 Nuremberg/Germany. ETG-Fachbericht (111). VDE Verlag GmbH, Berlin-Offenbach, Germany, pp. 19-26. ISBN 9783800730896

ruggedized electronic display

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

SAC alloy

Berthou, M., Lu, H., Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:10.1109/CPMTSYMPJ.2010.5679536)

scanning acoustic microscopes

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

second level

Berthou, M., Lu, H., Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:10.1109/CPMTSYMPJ.2010.5679536)

semiconductor device

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

semiconductor device modeling

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

semiconductor device reliability

Bailey, C., Stoyanov, S. and Lu, H. (2004) Reliability predictions for high density packaging. In: Proceeding of The Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., U.S.A., pp. 121-128. ISBN 0780386205 (doi:10.1109/HPD.2004.1346684)

Sensitivity analysis

Rajaguru, P., Lu, H., Bailey, C., Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.12.002)

Lu, H. and Bailey, C. (2002) Predicting optimal process conditions for flip-chip aassembly using copper column bumped dies. In: Proceedings of 4th Electronics Packaging Technology Conference (EPTC 2002). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 338-343. ISBN 0780374355 (doi:10.1109/EPTC.2002.1185694)

silicon

Bailey, C. and Lu, H. (2011) Interconnect technologies using carbon nanotubes: Current status and future challenges. In: 2011 34th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:10.1109/ISSE.2011.6053539)

Sn-2.8Ag-0.5Cu-1.0Bi

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

SnPb and SnAgCu (solder alloys)

Rizvi, M.J., Lu, H., Bailey, C., Bevan, E., Poutney, N. and Coates, J. (2010) Finite element modelling of failures in thick film chip resistor solder joints. In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010. in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010 . IEEE Xplore Digital Library, Taipei, pp. 1-4. ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print) ISSN 2150-5934 (doi:10.1109/IMPACT.2010.5699488)

solder

Alam, M.O., Lu, H., Bailey, Chris and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:10.1016/j.commatsci.2008.12.001)

solder balls

Berthou, M., Lu, H., Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:10.1109/CPMTSYMPJ.2010.5679536)

solder isothermal fatigue failure

Kamara, E., Lu, H., Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

solder joints

Rizvi, M.J., Bailey, C. and Lu, H. (2010) Damage predictions in a chip resistor solder joint on flexible circuit board. Microelectronic Engineering, 87 (10). pp. 1889-1895. ISSN 0167-9317 (doi:10.1016/j.mee.2009.11.023)

Solder material

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Bailey, C. and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

soldered joints

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

soldering

Yin, C.Y,, Lu, H., Musallam, M., Bailey, C. and Johnson, C.M. (2008) A physics-of-failure based prognostic method for power modules. In: 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1190-1195. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763591)

solid state lighting

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

solid state lighting systems

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

solidification

Bailey, C., Lu, H. and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:10.1016/S0168-9274(01)00065-4)

storage modulus

Rizvi, M.J., Lu, H., Bailey, C., Chan, Y.C., Lee, M.Y. and Pang, C.H. (2007) Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology. Microelectronic Engineering, 85 (1). pp. 238-244. ISSN 0167-9317 (doi:10.1016/j.mee.2007.05.045)

strength of materials

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H. and Sharif, A. (2005) The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing. Soldering & Surface Mount Technology, 17 (2). pp. 40-48. ISSN 0954-0911 (doi:10.1108/09540910510597492)

stress

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

stress intensity factor

Alam, M.O., Lu, H., Bailey, Chris and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:10.1016/j.commatsci.2008.12.001)

surface

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

Surrogate models

Rajaguru, P., Lu, H., Bailey, C., Ortiz-Gonzalez, J. and Alatise, O. (2016) Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68. pp. 77-85. ISSN 0026-2714 (doi:10.1016/j.microrel.2016.12.002)

temperature

Yin, C.Y., Lu, H., Bailey, C. and Chan, Y.C. (2003) Experimental and modeling analysis of the reliability of the anisotropic conductive films. In: 2003 Proceedings 53rd Electronic Components & Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 698-702. ISBN 0780377915 ISSN 0569-5503 (doi:10.1109/ECTC.2003.1216359)

Temperature distribution

Tilford, T., Cook, A., Lu, H., Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sept 2014, Helsinki, Finland. (doi:10.1109/ESTC.2014.6962815)

tension

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

Thermal conductivity

Tilford, T., Cook, A., Lu, H., Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sept 2014, Helsinki, Finland. (doi:10.1109/ESTC.2014.6962815)

thermal cycling

Rizvi, M.J., Bailey, C. and Lu, H. (2010) Damage predictions in a chip resistor solder joint on flexible circuit board. Microelectronic Engineering, 87 (10). pp. 1889-1895. ISSN 0167-9317 (doi:10.1016/j.mee.2009.11.023)

thermal management

Bailey, C., Lee, Y., Lu, H., Strusevich, N. and Yin, C. (2010) Packaging of LED backlights for ruggedised displays. In: International Symposium on Advanced Packaging Materials: Microtech, 2010. APM '10. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 98-101. ISBN 9781424467563 (doi:10.1109/ISAPM.2010.5441377)

thermo-mechanical loading

Bailey, C., Zhu, X., Lu, H. and Yin, C. (2012) Modelling metal migration for high reliability components when subjected to thermo-mechanical loading. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 474-478. ISBN 9781467345538 (doi:10.1109/EPTC.2012.6507130)

Thermomigration

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Bailey, C. and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

thick film chip resistors

Rizvi, M.J., Lu, H., Bailey, C., Bevan, E., Poutney, N. and Coates, J. (2010) Finite element modelling of failures in thick film chip resistor solder joints. In: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010. in: Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International Issue Date: 20-22 Oct. 2010 . IEEE Xplore Digital Library, Taipei, pp. 1-4. ISBN 978-1-4244-9785-0 (electronic), 978-1-4244-9783-6 (print) ISSN 2150-5934 (doi:10.1109/IMPACT.2010.5699488)

Thin film

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S. H., Bailey, C. and Chan, Y. C. (2014) Electromigration in Sn-Ag solder thin films under high current density. Thin Solid Films, 565. pp. 193-201. ISSN 0040-6090 (doi:10.1016/j.tsf.2014.06.030)

time to failure

Berthou, M., Lu, H., Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:10.1109/CPMTSYMPJ.2010.5679536)

underfill

Bailey, C., Rajaguru, P., Lu, H., Castellazzi, A., Antonini, M., Pathirana, V., Udugampola, N., Udrea, F., Mitchelson, P. D. and Aldhaher, S. (2018) Mechanical Modelling of High Power Lateral IGBT for LED Driver Applications. In: IEEE 68 Electronic Components and Technology Conference, 29/05/2018, San Diego, CA. (Submitted)

Rajaguru, P., Bailey, C., Lu, H., Aliyu, A. M., Castellazzi, A., Pathirana, V., Udugampola, N., Trajkovic, T., Udrea, F., Mitcheson, P. D. and Elliott, A. D. T. (2017) Co-Design/Simulation of Flip-Chip Assembly for High Voltage IGBT Packages. In: 23rd International Workshop on Thermal Investigations of ICs and Systems, September 2017, Amsterdam /NL.

underfilling

Berthou, M., Lu, H., Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:10.1109/CPMTSYMPJ.2010.5679536)

vibration

Kamara, E., Lu, H., Bailey, C., Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:10.1016/j.microrel.2010.07.152)

vibration test

Berthou, M., Lu, H., Retailleau, P., Frémont, H., Guédon-Gracia, A., Davennel, C. and Bailey, C. (2011) Vibration test durability on large BGA assemblies: evaluation of reinforcement techniques. In: 2010 IEEE CPMT Symposium Japan, ICSJ10. IEEE Computer Society, Piscataway, USA, pp. 1-4. ISBN 9781424475933 (doi:10.1109/CPMTSYMPJ.2010.5679536)

viewability

Bailey, C., Yin, C., Lu, H. and Cartwright, C. (2011) Multi-physics and multi-disciplinary analysis for solid state lighting. In: 2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011. IEEE Computer Society, Piscataway, USA. ISBN 9781457701078 (doi:10.1109/ESIME.2011.5765859)

voids evolution

Zhu, X., Kotadia, H., Xu, S., Lu, H., Mannan, S.H., Bailey, C. and Chan, Y.C. (2013) Comments on electromigration analysis methods. In: Proceedings of 14th International Conference on Electronic Packaging Technology (ICEPT 2013). Institute of Electrical and Electronics, Inc., Piscataway, NJ, USA, pp. 529-534. ISBN 9781479904983 (doi:10.1109/ICEPT.2013.6756527)

Wettability

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

wetting force

Rizvi, M.J., Chan, Y.C., Bailey, C., Lu, H., Islam, M.N. and Wu, B.Y. (2005) Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates. IEEE/TMS Journal of Electronic Materials, 34 (8). pp. 1115-1122. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:10.1007/s11664-005-0239-6)

X ray microscopes

Lu, H., Hung, K.C., Stoyanov, S., Bailey, C. and Chan, Y.C. (2002) No-flow underfill flip chip assembly–an experimental and modeling analysis. Microelectronics Reliability, 42 (8). pp. 1205-1212. ISSN 0026-2714 (doi:10.1016/S0026-2714(02)00092-6)

This list was generated on Mon May 21 17:13:17 2018 BST.