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Items where Author is "Loh, Wei-Sun"

Items where Author is "Loh, Wei-Sun"

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Number of items: 22.

aluminium

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

aluminium wirebonds

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684555)

computer modelling

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684555)

computer simulation

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:https://doi.org/10.1109/ICEPT.2008.4606983)

crack propagation

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:https://doi.org/10.1109/ICEPT.2008.4606983)

electrical configurations

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:https://doi.org/10.1115/IPACK2007-33817)

Finite Element Analysis

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:https://doi.org/10.1109/ICEPT.2008.4606983)

globtop

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

globtop design

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684555)

packaged modules

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:https://doi.org/10.1115/IPACK2007-33817)

physics of failure techniques

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:https://doi.org/10.1115/IPACK2007-33817)

power electronic modules (PEMs)

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

power electronics

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:https://doi.org/10.1115/IPACK2007-33817)

power electronics module

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:https://doi.org/10.1109/ICEPT.2008.4606983)

power electronics modules

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684555)

reliability

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:https://doi.org/10.1115/IPACK2007-33817)

solder joint

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:https://doi.org/10.1109/ICEPT.2008.4606983)

thermal cycling reliability

Loh, Wei-Sun, Corfield, Martin, Lu, Hua, Hogg, Simon, Tilford, Tim and Johnson, C. Mark (2007) Wire bond reliability for power electronic modules - effect of bonding temperature. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. IEEE, New York, pp. 427-432. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.360057)

wire bonds

Loh, Wei-Sun, Corfield, Martin, Lu, Hua, Hogg, Simon, Tilford, Tim and Johnson, C. Mark (2007) Wire bond reliability for power electronic modules - effect of bonding temperature. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. IEEE, New York, pp. 427-432. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.360057)

wirebond

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

This list was generated on Thu Mar 28 20:16:04 2024 UTC.