Items where Author is "Jackson, G.J."
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Article
Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C.
ORCID: 0000-0002-9438-3879
(2002)
Correlation of solder paste rheology with computational simulations of the stencil printing process.
Soldering and Surface Mount Technology, 14 (1).
pp. 11-17.
ISSN 0954-0911
(doi:https://doi.org/10.1108/09540910210416422)