Items where Author is "Hughes, Michael"
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Article
Hughes, Michael, Strussevitch, Nadia, Bailey, Christopher, McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2010) Numerical algorithms for modelling electrodeposition: tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.2140)
Taylor, Gareth A., Hughes, Michael, Strusevich, Nadia and Pericleous, Koulis (2002) Finite volume methods applied to the computational modelling of welding phenomena. Applied Mathematical Modelling, 26 (2). pp. 311-322. ISSN 0307-904X (doi:10.1016/S0307-904X(01)00063-4)
Book Section
Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Tilford, Tim, Xue, Xiangdong, Alam, M.O., Yin, Chunyan and Hughes, Michael (2008) Modelling technologies and applications. In: Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)
Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. In: 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684362)
Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531
Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Hughes, Michael, Yin, Chunyan and Gwyer, David (2007) Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges. In: EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 4-11. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360048)
Malik, Asif, Hughes, Michael and Bailey, Christopher (2006) Optoelectronic packaging interfaces for submicron alignment (OPISA) and the dynamics of laser spot weld formation. In: Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 387-391. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280031)