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Items where Author is "Goussetis, G."

Items where Author is "Goussetis, G."

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Number of items: 41.

computer control systems

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

conversion efficiency

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

cure process

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)

curing

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T., Adamietz, R., Muller, G., Eicher, F. and Bailey, C. (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:10.1109/ESTC.2010.5643015)

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

design

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

differential scanning calorimetry

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

electromagnetic heating

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T., Adamietz, R., Muller, G., Eicher, F. and Bailey, C. (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:10.1109/TCPMT.2011.2177524)

encapsulant

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

encapsulant curing

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525086)

encapsulants

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)

encapsulation

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T., Adamietz, R., Muller, G., Eicher, F. and Bailey, C. (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:10.1109/TCPMT.2011.2177524)

heating

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T., Bailey, C. and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)

materials

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)

microwave curing

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T., Bailey, C. and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)

microwave devices

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

microwave measurements

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)

microwave ovens

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)

microwave theory and techniques

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)

numerical analysis

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)

numerical simulation

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525086)

open-ended microwave oven

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T., Adamietz, R., Muller, G., Eicher, F. and Bailey, C. (2010) Experimental investigation of open-ended microwave oven assisted encapsulation process. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-8553-6 (print), 978-1-4244-8554-3 (online) (doi:10.1109/ESTC.2010.5643015)

open-ended waveguide cavity oven

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

ovens

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

packaging

Pavuluri, S.K., Ferenets, M., Goussetis, G., Desmulliez, M.P.Y., Tilford, T., Adamietz, R., Muller, G., Eicher, F. and Bailey, C. (2012) Encapsulation of microelectronic components using open-ended microwave oven. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2 (5). pp. 799-806. ISSN 2156-3950 (doi:10.1109/TCPMT.2011.2177524)

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

radio frequency (RF) curing

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

resonant cavity

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T., Bailey, C. and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)

resonant microwave applicator

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)

stoves

Pavuluri, S.K., Tilford, T., Goussetis, G., Desmulliez, M.P.Y., Ferenets, M., Adamietz, R., Eicher, F. and Bailey, C. (2010) Advances in the design and test of a novel open ended microwave oven. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. IEEE Computer Society, Piscataway, USA, pp. 247-252. ISBN 9781424466368 (Print), 9782355000119 (Online)

temperature measurement

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)

thermal stresses

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)

thermosetting polymer

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)

variable frequency microwave (VFM) heating

Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C., Parrott, K. and Sangster, A.J. (2008) Open ended microwave oven for packaging. In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20. ISBN 978-2-3550-0006-5 (doi:10.1109/DTIP.2008.4752943)

Variable Frequency Microwave (VFM) system

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical analysis of thermal stresses induced during VFM encapsulant curing. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276666)

Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C., Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J. (2008) Numerical simulation of encapsulant curing within a variable frequency microwave processing system. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525086)

waveguide resonator

Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T., Bailey, C. and Parrott, A.K. (2008) Optimization of an open-ended microwave oven for microelectronics packaging. IEEE Transactions on Microwave Theory and Techniques, 56 (11). pp. 2635-2641. ISSN 0018-9480 (doi:10.1109/TMTT.2008.2005925)

This list was generated on Tue Jun 19 17:25:22 2018 BST.