Items where Author is "Durairaj, Rajkumar"
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adhesives
Durairaj, Rajkumar (2006) Rheological characterisation of solder pastes and isotropic conductive adhesives (ICAs) for microsystems assembly technology. PhD thesis, University of Greenwich.
advanced characterization
Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2010) Modeling the structural breakdown of solder paste using the structural kinetic model. Journal of Materials Engineering and Performance, 19 (1). pp. 40-45. ISSN 1059-9495 (Print) 1544-1024 (Online) (doi:10.1007/s11665-009-9448-0)
ageing
Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.
assembly
Durairaj, Rajkumar (2006) Rheological characterisation of solder pastes and isotropic conductive adhesives (ICAs) for microsystems assembly technology. PhD thesis, University of Greenwich.
assembly lines
Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. In: 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers , New York, USA, pp. 14-19. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417048)
attenuation
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763635)
Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763615)
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684351)
cement-based materials
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763635)
Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763615)
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684351)
creep
Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:10.1108/09540910810885705)
Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar and Marks, Antony (2008) An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20 (2). pp. 3-10. ISSN 0954-0911 (doi:1108/09540910810871511)
electronic materials
Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2010) Modeling the structural breakdown of solder paste using the structural kinetic model. Journal of Materials Engineering and Performance, 19 (1). pp. 40-45. ISSN 1059-9495 (Print) 1544-1024 (Online) (doi:10.1007/s11665-009-9448-0)
electronics assembly applications
Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar, Seman, Anton and Marks, Antony (2009) Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications. Materials and Design, 30 (10). pp. 4502-4506. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.05.028)
electronics manufacturing
Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. In: 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers , New York, USA, pp. 14-19. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417048)
emulsions
Ekere, Ndy, Mallik, Sabuj, Durairaj, Rajkumar and Marks, Antony (2007) A study of the rheological properties of lead free solder paste formulations used for flip-chip interconnection. In: 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. IEEE/CPM International Electronics Manufacturing Technology Symposium . IEEE, New York, USA, pp. 165-171. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417065)
flip-chip assemblies
Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. In: 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers , New York, USA, pp. 14-19. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417048)
flip-chip assembly
Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.
flip-chip assembly applications
Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2008) Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 1219-1224. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684527)
flow
Ekere, Ndy, Mallik, Sabuj, Durairaj, Rajkumar and Marks, Antony (2007) A study of the rheological properties of lead free solder paste formulations used for flip-chip interconnection. In: 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. IEEE/CPM International Electronics Manufacturing Technology Symposium . IEEE, New York, USA, pp. 165-171. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417065)
flux
Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:10.1108/09540910810885705)
industrial production
Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. In: 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers , New York, USA, pp. 14-19. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417048)
isotropic conductive adhesives
Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)
Ekere, Ndy, Durairaj, Rajkumar, Mallik, Sabuj and Seman, Anton (2009) Investigation of wall-slip behaviour in lead-free solder pastes and isotropic conductive adhesives. Sadhana - Academy Proceedings in Engineering Sciences, 34 (5). pp. 1-12. ISSN 0256-2499 (Print) 0973-7677 (Online) (doi:10.1007/s12046-009-0046-5)
lead
Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar and Marks, Antony (2008) An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20 (2). pp. 3-10. ISSN 0954-0911 (doi:1108/09540910810871511)
lead-free solder pastes
Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.
Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. In: 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers , New York, USA, pp. 14-19. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417048)
microstructure
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763635)
Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763615)
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684351)
microsystems
Durairaj, Rajkumar (2006) Rheological characterisation of solder pastes and isotropic conductive adhesives (ICAs) for microsystems assembly technology. PhD thesis, University of Greenwich.
modeling processes
Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2010) Modeling the structural breakdown of solder paste using the structural kinetic model. Journal of Materials Engineering and Performance, 19 (1). pp. 40-45. ISSN 1059-9495 (Print) 1544-1024 (Online) (doi:10.1007/s11665-009-9448-0)
particles
Durairaj, Rajkumar, Ekere, Ndy, Salam, B., Jackson, G. and He, Da (2003) Monte Carlo study of solder paste microstructure and ultra-fine-pitch stencil printing. Journal of Materials Science: Materials in Electronics, 14 (8). pp. 501-506. ISSN 0957-4522 (doi:10.1023/A:1023929119055)
printing performance
Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:10.1109/EPTC.2009.5416423)
Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.
printing processes
Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. In: 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers , New York, USA, pp. 14-19. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417048)
quality control
Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:10.1108/09540910810885705)
rheological behaviour
Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2008) Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 1219-1224. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684527)
rheological behaviours
Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:10.1109/EPTC.2009.5416423)
rheological characteristics
Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.
rheological characterization
Durairaj, Rajkumar, Ekere, Ndy, Salam, B., Jackson, G. and He, Da (2003) Monte Carlo study of solder paste microstructure and ultra-fine-pitch stencil printing. Journal of Materials Science: Materials in Electronics, 14 (8). pp. 501-506. ISSN 0957-4522 (doi:10.1023/A:1023929119055)
rheology
Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)
Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)
Ekere, Ndy, Durairaj, Rajkumar, Mallik, Sabuj and Seman, Anton (2009) Investigation of wall-slip behaviour in lead-free solder pastes and isotropic conductive adhesives. Sadhana - Academy Proceedings in Engineering Sciences, 34 (5). pp. 1-12. ISSN 0256-2499 (Print) 0973-7677 (Online) (doi:10.1007/s12046-009-0046-5)
Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:10.1108/09540910810885705)
Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar and Marks, Antony (2008) An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20 (2). pp. 3-10. ISSN 0954-0911 (doi:1108/09540910810871511)
Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. In: 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers , New York, USA, pp. 14-19. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417048)
shear testing
Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. In: 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers , New York, USA, pp. 14-19. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417048)
simulation
Durairaj, Rajkumar, Ekere, Ndy, Salam, B., Jackson, G. and He, Da (2003) Monte Carlo study of solder paste microstructure and ultra-fine-pitch stencil printing. Journal of Materials Science: Materials in Electronics, 14 (8). pp. 501-506. ISSN 0957-4522 (doi:10.1023/A:1023929119055)
slip
Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar and Marks, Antony (2008) An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20 (2). pp. 3-10. ISSN 0954-0911 (doi:1108/09540910810871511)
solder joints
Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763615)
solder paste
Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)
Ekere, Ndy, Durairaj, Rajkumar, Mallik, Sabuj and Seman, Anton (2009) Investigation of wall-slip behaviour in lead-free solder pastes and isotropic conductive adhesives. Sadhana - Academy Proceedings in Engineering Sciences, 34 (5). pp. 1-12. ISSN 0256-2499 (Print) 0973-7677 (Online) (doi:10.1007/s12046-009-0046-5)
Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:10.1108/09540910810885705)
Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar and Marks, Antony (2008) An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20 (2). pp. 3-10. ISSN 0954-0911 (doi:1108/09540910810871511)
Durairaj, Rajkumar, Ekere, Ndy, Salam, B., Jackson, G. and He, Da (2003) Monte Carlo study of solder paste microstructure and ultra-fine-pitch stencil printing. Journal of Materials Science: Materials in Electronics, 14 (8). pp. 501-506. ISSN 0957-4522 (doi:10.1023/A:1023929119055)
solder pastes
Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:10.1109/EPTC.2009.5416423)
Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)
Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar, Seman, Anton and Marks, Antony (2009) Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications. Materials and Design, 30 (10). pp. 4502-4506. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.05.028)
Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763615)
Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2008) Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 1219-1224. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684527)
Ekere, Ndy, Durairaj, Rajkumar, Mallik, Sabuj, Marks, Antony, Bauer, R. and Winter, M. (2006) Rheological characterisation of new lead-free solder paste formulations for flip-chip assembly. In: ESTC 2006: 1st Electronics Systemintegration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 995-1000. ISBN 1424405521 (doi:10.1109/ESTC.2006.280132)
Durairaj, Rajkumar (2006) Rheological characterisation of solder pastes and isotropic conductive adhesives (ICAs) for microsystems assembly technology. PhD thesis, University of Greenwich.
stencil printing process
Ekere, Ndy, Durairaj, Rajkumar, Mallik, Sabuj and Seman, Anton (2009) Investigation of wall-slip behaviour in lead-free solder pastes and isotropic conductive adhesives. Sadhana - Academy Proceedings in Engineering Sciences, 34 (5). pp. 1-12. ISSN 0256-2499 (Print) 0973-7677 (Online) (doi:10.1007/s12046-009-0046-5)
stress
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763635)
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684351)
stretched exponential model
Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)
thixotropy
Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)
Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)
viscosity
Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)
Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763635)
Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763615)
Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:10.1108/09540910810885705)
Wall-slip
Ekere, Ndy, Durairaj, Rajkumar, Mallik, Sabuj and Seman, Anton (2009) Investigation of wall-slip behaviour in lead-free solder pastes and isotropic conductive adhesives. Sadhana - Academy Proceedings in Engineering Sciences, 34 (5). pp. 1-12. ISSN 0256-2499 (Print) 0973-7677 (Online) (doi:10.1007/s12046-009-0046-5)
wall-slip effects
Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar, Seman, Anton and Marks, Antony (2009) Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications. Materials and Design, 30 (10). pp. 4502-4506. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.05.028)
water
Ekere, Ndy, Mallik, Sabuj, Durairaj, Rajkumar and Marks, Antony (2007) A study of the rheological properties of lead free solder paste formulations used for flip-chip interconnection. In: 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. IEEE/CPM International Electronics Manufacturing Technology Symposium . IEEE, New York, USA, pp. 165-171. ISBN 9781424413355 (doi:10.1109/IEMT.2007.4417065)