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Items where Author is "Durairaj, R."

Items where Author is "Durairaj, R."

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Number of items: 10.

Durairaj, R., Man, Lam Wai, Ekere, N.N. and Mallik, S. (2010) The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes. Materials and Design, 31 (3). pp. 1056-1062. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.09.051)

Mallik, S., Ekere, N.N., Marks, A.E., Seman, A. and Durairaj, R. (2010) Modeling the structural breakdown of solder paste using the structural kinetic model. Journal of Materials Engineering and Performance, 19 (1). pp. 40-45. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:10.1007/s11665-009-9448-0)

Durairaj, R., Mallik, S., Seman, A. and Ekere, N.N. (2009) Investigation of wall-slip behaviour in lead-free solder pastes and isotropic conductive adhesives. Sadhana - Academy Proceedings in Engineering Sciences, 34 (5). pp. 799-810. ISSN 0256-2499 (Print), 0973-7677 (Online) (doi:10.1007/s12046-009-0046-5)

Durairaj, R., Ramesh, S., Mallik, S., Seman, A. and Ekere, N. (2009) Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes. Materials and Design, 30 (9). pp. 3812-3818. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.01.028)

Mallik, S., Ekere, N.N., Durairaj, R., Marks, A.E. and Seman, A. (2009) Wall-slip effects in SnAgCu solder pastes used in electronics assembly applications. Materials & Design, 30 (10). pp. 4502-4506. ISSN 0261-3069 (doi:10.1016/j.matdes.2009.05.028)

Durairaj, R., Man, Lam Wai, Ramesh, S., Wea, Lim Chia, Leng, Eu Poh, Ekere, N.N., Mallik, S. and Seman, A. (2009) Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives. In: Electronics Packaging Technology Conference, 2009. EPTC '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 422-426. ISBN 978-1-4244-5099-2 (print), 978-1-4244-5100-5 (e-ISBN) (doi:10.1109/EPTC.2009.5416511)

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2008) Viscoelastic properties of solder paste and isotropic conductive adhesives used for flip-chip assembly. In: Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 1-8. ISBN 9781424433926 (print), 9781424433933 (electronic) ISSN 1089-8190 (doi:10.1109/IEMT.2008.5507801)

Glinski, G.P., Bailey, C., Durairaj, R. and Ekere, N.N. (2002) Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows. In: IMAPS - Europe Cracow 2002, 16-18 June 2002, Cracow, Poland.

Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. (2002) Correlation of solder paste rheology with computational simulations of the stencil printing process. Soldering and Surface Mount Technology, 14 (1). pp. 11-17. ISSN 0954-0911 (doi:10.1108/09540910210416422)

This list was generated on Tue May 22 20:53:58 2018 BST.