Skip navigation

Items where Author is "Di Maio, D."

Items where Author is "Di Maio, D."

Up a level
Export as [feed] RSS
Group by: Item Type | Uncontrolled Keywords | No Grouping
Number of items: 11.

96.5Sn3.0Ag0.5Cu lead-free solder

Kamara, E., Lu, H., Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

Ball Grid Arrays (BGAs)

Kamara, E., Lu, H., Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

chiral structures

Klepka, A., Staszewski, W.J., Uhl, T., Di Maio, D., Scarpa, F. and Tee, K.F. (2012) Impact damage detection in composite chiral sandwich panels. Key Engineering Materials, 518. pp. 160-167. ISSN 1013-9826 (Print), 1662-9795 (Online) (doi:10.4028/www.scientific.net/KEM.518.160)

concave joints

Kamara, E., Lu, H., Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

impact damage detection

Klepka, A., Staszewski, W.J., Uhl, T., Di Maio, D., Scarpa, F. and Tee, K.F. (2012) Impact damage detection in composite chiral sandwich panels. Key Engineering Materials, 518. pp. 160-167. ISSN 1013-9826 (Print), 1662-9795 (Online) (doi:10.4028/www.scientific.net/KEM.518.160)

lead-free solders

Kamara, E., Lu, H., Bailey, C., Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:10.1016/j.microrel.2010.07.152)

nonlinear acoustics

Klepka, A., Staszewski, W.J., Uhl, T., Di Maio, D., Scarpa, F. and Tee, K.F. (2012) Impact damage detection in composite chiral sandwich panels. Key Engineering Materials, 518. pp. 160-167. ISSN 1013-9826 (Print), 1662-9795 (Online) (doi:10.4028/www.scientific.net/KEM.518.160)

piezo-ceramic transducers

Klepka, A., Staszewski, W.J., Uhl, T., Di Maio, D., Scarpa, F. and Tee, K.F. (2012) Impact damage detection in composite chiral sandwich panels. Key Engineering Materials, 518. pp. 160-167. ISSN 1013-9826 (Print), 1662-9795 (Online) (doi:10.4028/www.scientific.net/KEM.518.160)

reliability

Kamara, E., Lu, H., Bailey, C., Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:10.1016/j.microrel.2010.07.152)

solder isothermal fatigue failure

Kamara, E., Lu, H., Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

vibration

Kamara, E., Lu, H., Bailey, C., Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:10.1016/j.microrel.2010.07.152)

This list was generated on Thu Apr 19 21:52:36 2018 BST.