Items where Author is "Chan, Y.C"
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Article
Alam, M.O., Lu, Hua, Bailey, Chris and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability (T-DMR), 9 (1). pp. 40-48. ISSN 1530-4388 (doi:10.1109/TDMR.2008.2010595)
Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)