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Items where Author is "Bailey, Christopher"

Items where Author is "Bailey, Christopher"

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(HSD) (ICA) 3D printing 3D-miniaturised systems abrasion accelerated testing ACF acoustic streaming active matrix liquid crystal display actuator design adhesive materials adhesives Advanced packaging and integration technologies ageing aging aluminium aluminium wirebonds AMLCD analysis tools Analytical models anisotropic conductive film (ACF) assembly process technology ball grid array (BGA) ball shear test Bayesian networks biofluid behaviour blood fluid separation blood plasma separation blood preparation bond strength bumps case study casting CFD CFD simulation chip mountdown solder chip-on-board (COB) assembly chip-on-flex (COF) circuit simulator circuits Coatings commercial off-the-shelf components compact thermal models complex geometries compliant PCB component terminations compound semiconductors compression bonding computational fluid Computational Fluid Dynamics computational fluid dynamics (CFD) computational mechanics computational modeling computational models computed tomography computer modelling computer simulation COMSOL condition based monitoring conductive particle conductivity conformal coating conservation constituitive modeling constitutive law contact angle contact resistance contactless convection oven cooling efficiency copper copper track designs corrosion coupled simulation coupling crack propagation creep curves cross-flow filtration cryogenic temperature crystal plasticity Cu column cure cure process curing curing processes current crowding current density Cutty Sark cyclic thermal-mechanical loading Damage Damage rule Data driven prognostics data-driven prognostics DC-DC decision support system decision tree degradation design design optimistation die attach dielectric material diffusion digital simulation distributed manipulation dynamics edgebond Electric Field Assisted Capillarity (EFAC) electrical configurations electrical connections electro thermal model electrodeposition electrolytes electromechanical devices electromigration electron bombardment electronic components electronic device electronic engineering electronic engineering computing electronic packaging electronic packaging thermal management electronic product design electronic products electronics design electronics industry electronics manufacture electronics manufacturing electronics reliability electroplating Electrostatics Electrothermal models Encapsulating Dielectric Fluid end-fed probes engineering design Eulerian fabrication Failure failure analysis failure mechanisms failure modes failure modes and mechanisms Fatigue FDTD FEA finite element finite element (FE) method finite element analysis finite element analysis (FEA) Finite Element Analysis(FEA) finite element method Finite Element Method (FEM) finite element modelling Finite volume Flex-No-Lead project flexible substrates flip chip flip-chip assembly flip-chip devices flip-chip packaging flip-chip underfills fluid dynamics Fluid structure interaction flux focal plane array foil fracture mechanics fracture propogation path frequency agile microwave oven bonding system (FAMOBS) Geometric conservation law glob top globtop globtop design granular flow growth rate health monitoring heat exchanger heat sensitive film heat transfer heating heritage structure heritage structures high aspect ratio microvia high current density induced damage high density packaging Historic Ships hot solder hot solder dip hot solder dip refinishing process Hull Efficiency IGBT IGBT power modules incomplete dataset individual surface mount components inhomogeneities insulated gate bipolar transistors Integrated circuit modeling integrated circuit modelling integrated circuit reliability interactions interfacial reaction phenomena interfacial reactions intermetallic compound intermetallic compound (IMC) intermetallic compound layer intermetallic compounds inverter isolation substrate isotropic conductive adhesives isotropic conductive adhesives (ICAs) jet impingement cooling system joints kinematic-hardening Kriging lab-on-a-chip Lagrangian laser spot weld formation layered structures LCD backlighting lead lead free applications lead free solder lead-free soldering leaded components LEDs level set method Life consumption life expectancy life prediction life-time lifetime modelling LIGA light emitting diode (LED) light emitting diodes Lithographically Induced Self-Construction (LISC) logistic regression low power tests low temperature (T<100 C) low-loss dielectric Machine learning manufacturing processes material degradation materials materials damage Materials reliability mathematical model mathematical modelling megasonic agitation melting melting processes MEMS device micro-BGA micro-electronic displays micro-electronics manufacture micro-manufactured micro-probe microassembly microcapsules microchannel biochip separator microchannel device microchannel systems microchannels microelectronics microelectronics packaging microfabricated solenoid inductor Microfabrication microfeeder microfluidic device Microfluidics microinductors microstructure Microstructures microsystem design microsystems microvias microwave microwave curing microwave oven microwave radiation microwave system microwave systems microwaves Miner's linear damage accumulation Mission profile Model order reduction modeling modelling modelling and simulation modelling methodologies modelling methodology modelling technologies moisture monitoring multi-physics multi-physics modelling multi-scale multi-scale modelling multichip modules multiphysics multiphysics modeling multiphysics modelling N/A Nano-Imprint Forming (NIF) nano-techology Newmark algorithm Newton Raphson non-linear non-linear transient finite element simulations Numerical methods numerical modelling Numerical simulation off-chip interconnection Offshore renewable energy on-chip interconnection one turn inductor open-ended applicator open-ended microwave curing system open-ended microwave oven open-oven OPISA optical fiber optical interconnects optical performance optimisation optimization optimization of solder optimization tools opto-electronic assembly optoelectronic packaging organic light emitting diodes (OLED) package design parameters packaged modules packaging packaging design packaging technology parallel parametric model order reduction parametric Model Order Reduction (pMOR) Pb-free solder photonics PHYSICA physics Physics of failure physics of failure techniques physics-of-failure plastic deformation plastic strain plate fin heat sink pneumatic microactuator Polydimethylsiloxane (PDMS) polymer polymer curing polymer encapsulant polymer materials curing polymers potting cure power cycling power electronic module power electronic modules power electronic modules (PEMs) Power electronics power electronics module Power Electronics Module (PEM) power electronics modules power electronics modules (PEMs) power module Power semiconductor packages power supply circuits predictive models printed circuit manufacture printed circuits probabilistic optimisation probability based analytical tools prognostic fusion prognostics prognostics and health management prognostics framework prototyping QFN Radial basis rainflow algorithm random forest real time recursive algorithm reduced order modelling (ROM) Reduced order models reduced order models (ROM) reflow relative permittivity reliability reliability assessment reliability management reliability modelling reliability prediction reliability prediction techniques Reliability test response surface model RF-ID tag bonding risk analysis risk mitigation SAC305 scanning acoustic microscopy scour ship silicon carbide simulation SiP SiP structure SnPbAgCu quaternary solder alloy solder solder interface strength Solder joint solder joint failure solder joint fatigue solder joint reliability solder joints solder paste solder-mask defined joints soldering Solid modeling solidification stress stress analysis stress and strain distribution Stress comparison structural bonding subsea cable scoring Subsea cables substrate delamination substrates surface tension testing thermal cycling thermal analysis thermal cycling thermal expansion thermal fatigue thermal modelling thermal processing thermal stress thermal stresses thermal-mechanical analysis thermal-mechanical loading thermo-mechanical thermo-mechanical behaviour thermo-mechanical Reliability thermo-mechanics thermomechanical processes thermomigration thermosetting polymer materials tin whiskers Topology Transient structural dynamics uncertainty analysis underfill UV-LIGA process variable frequency microwave (VFM) Variable Frequency Microwave (VFM) heating variable frequency microwave technology vias Vortex generator wafer processing wafer scale level packaging waveguide cavity resonator wear wetting wetting force wire bond fatigue wire/ribbon bond wirebond wires
Number of items: 641.

(HSD)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273091)

(ICA)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy (2004) Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

3D printing

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2017.8000936)

3D-miniaturised systems

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525088)

abrasion

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

accelerated testing

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432813)

ACF

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2008.01.045)

acoustic streaming

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)

active matrix liquid crystal display

Lee, Yek Bing, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

Lee, Yek, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:https://doi.org/10.1109/ESIME.2006.1644051)

actuator design

Xue, Xiangdong, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print), 1779-6288 (Online) (doi:https://doi.org/10.1051/ijsmdo/2009003)

adhesive materials

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

adhesives

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:https://doi.org/10.1109/POLYTR.2007.4339175)

Advanced packaging and integration technologies

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Lu, Hua ORCID: 0000-0002-4392-6562 (2017) Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability. Wspc Series In Advanced Integration And Packaging . World Scientific Publishing. ISBN 978-9814740203 ISSN 2315-473X (doi:https://doi.org/10.1142/9900)

ageing

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2008.01.045)

aging

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C., Islam, M. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.071)

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)

aluminium

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

aluminium wirebonds

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684555)

AMLCD

Lee, Yek, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:https://doi.org/10.1109/ESTC.2006.280164)

Lee, Yek Bing, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

Lee, Yek, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:https://doi.org/10.1109/ESIME.2006.1644051)

analysis tools

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:https://doi.org/10.1007/978-0-387-47325-3_2)

Analytical models

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046616)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

anisotropic conductive film (ACF)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

assembly process technology

Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:https://doi.org/10.1109/ICEPT.2008.4607039)

ball grid array (BGA)

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

ball shear test

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

Bayesian networks

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

biofluid behaviour

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270767)

blood fluid separation

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Modelling and simulation of the behaviour of a biofluid in a microchannel biochip separator. Computer Methods in Biomechanics and Biomedical Engineering, 14 (6). pp. 549-560. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2010.485570)

blood plasma separation

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270767)

blood preparation

Kersaudy-Kerhoas, Maïwenn, Kavanagh, Deirdre, Xue, Xiangdong, Patel, Mayur, Bailey, Christopher, Dhariwal, Resham and Desmulliez, Marc P.Y. (2008) Integrated biomedical device for blood preparation. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-452. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684389)

bond strength

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

bumps

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

case study

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441412)

casting

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Pericleous, Koulis A. ORCID: 0000-0002-7426-9999 (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:https://doi.org/10.1080/15502280601149510)

CFD

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879 , McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

CFD simulation

Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: Dimov, Stefan, Menz, Wolfgang and Toshev, Yuli, (eds.) 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531

chip mountdown solder

Lu, Hua, Tilford, Tim, Xue, Xiangdong and Bailey, Christopher (2007) Thermal-mechanical modelling of power electronic module packaging. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 317-322. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.359960)

chip-on-board (COB) assembly

Tilford, Tim ORCID: 0000-0001-8307-6403 , Pavuluri, S., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270558)

chip-on-flex (COF)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

circuit simulator

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

circuits

Richardson, Andrew, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120710723706)

Coatings

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046616)

commercial off-the-shelf components

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

compact thermal models

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Mermet-Guyennet, M. (2010) Real-time life consumption power modules prognosis using on-line rainflow algorithm in metro applications. In: Energy Conversion Congress and Exposition (ECCE), 2010 IEEE. IEEE Xplore Digital Library, Atlanta GA, pp. 970-977. ISBN 978-1-4244-5286-6 (print) ISSN 978-1-4244-5287-3 (online) (doi:https://doi.org/10.1109/ECCE.2010.5617883)

complex geometries

Cross, Mark, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Pericleous, Koulis ORCID: 0000-0002-7426-9999 , Williams, Alison, Bojarevics, Valdis ORCID: 0000-0002-7326-7748 , Croft, Nick and Taylor, Gary (2002) The multiphysics modeling of solidification and melting processes. JOM (The Member Journal of The Minerals, Metals & Materials Society), 2002 (Supp.). ISSN 1047-4838

compliant PCB

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

component terminations

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

compound semiconductors

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

compression bonding

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

computational fluid

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

Computational Fluid Dynamics

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845 , Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Davies, Wynford, Harrap, Jullian, Kentley, Erik and Mason, Peter (2014) Digital modelling in the performance evaluation of 19th Century clipper ships: the Thermopylae and the Cutty Sark. In: Historic Ships 2014. Royal Institution of Naval Architects, pp. 81-86.

computational fluid dynamics (CFD)

Kay, Robert W., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Glinski, Greg P., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:https://doi.org/10.1109/TCAPT.2007.892085)

computational mechanics

Lee, Yek Bing, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

computational modeling

Cross, Mark, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Pericleous, Koulis ORCID: 0000-0002-7426-9999 , Williams, Alison, Bojarevics, Valdis ORCID: 0000-0002-7326-7748 , Croft, Nick and Taylor, Gary (2002) The multiphysics modeling of solidification and melting processes. JOM (The Member Journal of The Minerals, Metals & Materials Society), 2002 (Supp.). ISSN 1047-4838

computational models

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tang, Ying Kit, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Evans, Robert, Marson, Silvia and Allen, David (2009) Modelling and process capability analysis of focused ion beam. ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. IEEE Computer Society, Piscataway, NJ USA. ISBN 97814244 42607 (Print) (doi:https://doi.org/10.1109/ISSE.2009.5206925)

computed tomography

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

computer modelling

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:https://doi.org/10.1109/PHM.2010.5413403)

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh and Monger, George (2009) Prognostics framework for remaining life prediction of Cutty Sark iron structures. Annual Conference of the Prognostics and Health Management Society 2009. Prognostics and Health Management Society, 6 pages.

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684555)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2008.01.045)

Ridout, Stephen, Dusek, Milos, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.05.001)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

Rizvi, M.J., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Modeling the effect of lead-free soldering on flexible substrates. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:https://doi.org/10.1109/EMAP.2006.4430695)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Optimisation modelling for design of advanced interconnects. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:https://doi.org/10.1109/ESTC.2006.280148)

computer simulation

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:https://doi.org/10.1109/ICEPT.2008.4606983)

COMSOL

Tonry, Catherine, Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmuliez, Marc P.Y., Cargill, Scott and Yu, Weixing (2013) A method for the micro-encapsulation of dielectric fluids in joined polymer shells. Current Organic Chemistry, 17 (1). pp. 65-71. ISSN 1385-2728 (Print), 1875-5348 (Online)

condition based monitoring

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2017.8000936)

conductive particle

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

conductivity

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

conformal coating

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical analysis of conformally coated QFNs for high reliability applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11). pp. 2210-2218. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2019.2925874)

conservation

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:https://doi.org/10.1109/PHM.2010.5413403)

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh and Monger, George (2009) Prognostics framework for remaining life prediction of Cutty Sark iron structures. Annual Conference of the Prognostics and Health Management Society 2009. Prognostics and Health Management Society, 6 pages.

constituitive modeling

Ridout, Stephen, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:https://doi.org/10.1109/ESTC.2006.280122)

constitutive law

Ridout, Stephen and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:https://doi.org/10.1111/j.1460-2695.2006.01065.x)

contact angle

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)

contact resistance

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2008.01.045)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

contactless

Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: Dimov, Stefan, Menz, Wolfgang and Toshev, Yuli, (eds.) 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531

convection oven

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:https://doi.org/10.1109/IEMT.2008.5507869)

cooling efficiency

Rizvi, M.J., Skuriat, R., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Johnson, C. Mark and Lu, Hua ORCID: 0000-0002-4392-6562 (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:https://doi.org/10.1109/ESIME.2009.4938428)

copper

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273091)

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582869)

Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2008.09.105)

copper track designs

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:https://doi.org/10.1115/IPACK2007-33820)

corrosion

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Wenshuo, Tang and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Prognostics and health management of subsea cables. In: Goodman, Douglas, Hofmeister, James P. and Szidarovszky, Ferenc, (eds.) Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Data. Quality and Reliability Engineering Series . Wiley-Blackwell. ISBN 978-1119356653

coupled simulation

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

coupling

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441412)

crack propagation

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:https://doi.org/10.1109/ICEPT.2008.4606983)

creep curves

Ridout, Stephen, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:https://doi.org/10.1109/ESTC.2006.280122)

cross-flow filtration

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Modelling and simulation of the behaviour of a biofluid in a microchannel biochip separator. Computer Methods in Biomechanics and Biomedical Engineering, 14 (6). pp. 549-560. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2010.485570)

cryogenic temperature

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

crystal plasticity

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

Cu column

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

cure

Morris, James E., Tilford, Tim, Ferenets, M. and Bailey, Christopher (2009) A critical analysis of polymer cure modeling for microelectronics applications. In: IMAPS Nordic Conference 2009, 13-15 September 2009, Tønsberg, Norway.

cure process

Sinclair, Keith I., Tilford, Tim ORCID: 0000-0001-8307-6403 , Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684409)

curing

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:https://doi.org/10.1109/IEMT.2008.5507869)

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

curing processes

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.

current crowding

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

current density

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:https://doi.org/10.1109/EMAP.2012.6507864)

Cutty Sark

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:https://doi.org/10.1109/PHM.2010.5413403)

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh and Monger, George (2009) Prognostics framework for remaining life prediction of Cutty Sark iron structures. Annual Conference of the Prognostics and Health Management Society 2009. Prognostics and Health Management Society, 6 pages.

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Mason, P. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Finite element modelling of an historic ship structure - the Cutty Sark. In: Armstrong, Cecil G., (ed.) Proceedings of a joint conference of the Association for Computational Mechanics in Engineering (UK) and the Irish Society for Scientific and Engineeering Computation. 19th-20th April 2006, Queen's University Belfast. ACME/ISSEC, pp. 35-38.

cyclic thermal-mechanical loading

Lu, Hua, Tilford, Tim, Bailey, Christopher and Newcombe, David (2007) Lifetime prediction for power electronics module substrate mount-down solder interconnect. HDP'07: Proceedings Of The 2007 International Symposium On High Density Packaging And Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283558)

Damage

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

Damage rule

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-014-0054-5)

Data driven prognostics

Ahsan, Mominul, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2018.8443612)

Sutharssan, Thamo, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:https://doi.org/10.3390/mi3010078)

data-driven prognostics

Kabir, Ahsanul, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273136)

DC-DC

Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4

Lu, Hua ORCID: 0000-0002-4392-6562 , Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, M.Y. (2006) An analysis of a microfabricated solenoid inductor. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 556-561. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280058)

decision support system

Tang, Y.K., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Decision support systems for eco-friendly electronic products. Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:https://doi.org/10.1109/EMAP.2006.4430580)

decision tree

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Walshaw, Christopher ORCID: 0000-0003-0253-7779 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:https://doi.org/10.1515/comp-2019-0014)

degradation

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

design

Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Design and modeling challenges for high density packaging. 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, Piscataway, NJ, USA, pp. 324-328. ISBN 1424404886 (doi:https://doi.org/10.1109/HDP.2006.1707617)

design optimistation

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Optimisation modelling for design of advanced interconnects. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:https://doi.org/10.1109/ESTC.2006.280148)

die attach

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

dielectric material

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:https://doi.org/10.1115/IPACK2007-33820)

diffusion

Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2008.09.105)

digital simulation

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

distributed manipulation

Xue, Xiangdong, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print), 1779-6288 (Online) (doi:https://doi.org/10.1051/ijsmdo/2009003)

Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: Dimov, Stefan, Menz, Wolfgang and Toshev, Yuli, (eds.) 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531

dynamics

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

edgebond

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

Electric Field Assisted Capillarity (EFAC)

Tonry, Catherine, Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmuliez, Marc P.Y., Cargill, Scott and Yu, Weixing (2013) A method for the micro-encapsulation of dielectric fluids in joined polymer shells. Current Organic Chemistry, 17 (1). pp. 65-71. ISSN 1385-2728 (Print), 1875-5348 (Online)

electrical configurations

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:https://doi.org/10.1115/IPACK2007-33817)

electrical connections

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910610665107)

electro thermal model

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

electrodeposition

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:https://doi.org/10.1109/EMAP.2012.6507864)

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879 , McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)

Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684362)

Lu, Hua ORCID: 0000-0002-4392-6562 , Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, M.Y. (2006) An analysis of a microfabricated solenoid inductor. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 556-561. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280058)

electrolytes

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:https://doi.org/10.1109/EMAP.2012.6507864)

electromechanical devices

Richardson, Andrew, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120710723706)

electromigration

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

electron bombardment

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

electronic components

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Yin, Chunyan, Tilford, Tim and Ridout, Stephen (2008) Predictive reliability and prognostics for electronic components: current capabilities and future challenges. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 67-72. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276460)

electronic device

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Walshaw, Christopher ORCID: 0000-0003-0253-7779 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:https://doi.org/10.1515/comp-2019-0014)

electronic engineering

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910710843757)

electronic engineering computing

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

electronic packaging

Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:https://doi.org/10.1109/ICEPT.2008.4607039)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

electronic packaging thermal management

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273091)

electronic product design

Tang, Y.K., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Decision support systems for eco-friendly electronic products. Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:https://doi.org/10.1109/EMAP.2006.4430580)

electronic products

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

electronics design

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Optimisation modelling for design of advanced interconnects. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:https://doi.org/10.1109/ESTC.2006.280148)

electronics industry

Richardson, Andrew, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120710723706)

electronics manufacture

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2017.8000936)

electronics manufacturing

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)

electronics reliability

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

electroplating

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:https://doi.org/10.1109/EMAP.2012.6507864)

Electrostatics

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845 , Patel, Mayur K., Yu, Weixing, Desmulliez, Marc P. Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2019) Fabrication of hollow polymer microstructures using dielectric and capillary forces. Microsystem Technologies. pp. 1-8. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-019-04409-z)

Electrothermal models

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

Encapsulating Dielectric Fluid

Tonry, Catherine, Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmuliez, Marc P.Y., Cargill, Scott and Yu, Weixing (2013) A method for the micro-encapsulation of dielectric fluids in joined polymer shells. Current Organic Chemistry, 17 (1). pp. 65-71. ISSN 1385-2728 (Print), 1875-5348 (Online)

end-fed probes

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

engineering design

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Performance assessment of density and level-set topology optimisation methods for 3D heatsink design. Journal of Algorithms and Computational Technology, 12 (3). pp. 273-287. ISSN 1748-3018 (Print), 1748-3026 (Online) (doi:https://doi.org/10.1177/1748301818779019)

Eulerian

Slone, Avril, Fallah, Nosrat, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Cross, Mark (2002) A finite volume approach to geometrically non-linear stress analysis. In: Finite volumes for complex applications III: problems and perspectives. Hermes Penton Science, London, UK, pp. 663-670. ISBN 9781903996348

fabrication

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:https://doi.org/10.1007/978-0-387-47325-3_2)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276670)

Failure

Ahsan, Mominul, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2018.8443612)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2008.01.045)

failure analysis

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441412)

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

failure mechanisms

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

failure modes

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432813)

failure modes and mechanisms

Bailey, Christopher, Lu, Hua and Tilford, Tim (2007) Predicting the reliability of power electronic modules. In: Keyun, Bi and Ming, Li, (eds.) ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 809-813. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441543)

Fatigue

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

Ridout, Stephen and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:https://doi.org/10.1111/j.1460-2695.2006.01065.x)

FDTD

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

FEA

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

finite element

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

Ridout, Stephen and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:https://doi.org/10.1111/j.1460-2695.2006.01065.x)

finite element (FE) method

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441412)

finite element analysis

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical analysis of conformally coated QFNs for high reliability applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11). pp. 2210-2218. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2019.2925874)

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2017.8233827)

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:https://doi.org/10.1109/ICEPT.2008.4606983)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276670)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Mason, P. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Finite element modelling of an historic ship structure - the Cutty Sark. In: Armstrong, Cecil G., (ed.) Proceedings of a joint conference of the Association for Computational Mechanics in Engineering (UK) and the Irish Society for Scientific and Engineeering Computation. 19th-20th April 2006, Queen's University Belfast. ACME/ISSEC, pp. 35-38.

finite element analysis (FEA)

Lu, Hua, Tilford, Tim, Xue, Xiangdong and Bailey, Christopher (2007) Thermal-mechanical modelling of power electronic module packaging. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 317-322. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.359960)

Finite Element Analysis(FEA)

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

finite element method

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:https://doi.org/10.23919/EMPC55870.2023.10418328)

Finite Element Method (FEM)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE57496.2023.10168468)

finite element modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

Finite volume

Slone, Avril, Pericleous, Kyriacos A ORCID: 0000-0002-7426-9999 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Cross, M. and Bennett, C. (2002) Dynamic fluid-structure interactions using finite volume unstructured mesh procedures. Computers & Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:https://doi.org/10.1016/S0045-7949(01)00177-8)

Slone, Avril, Fallah, Nosrat, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Cross, Mark (2002) A finite volume approach to geometrically non-linear stress analysis. In: Finite volumes for complex applications III: problems and perspectives. Hermes Penton Science, London, UK, pp. 663-670. ISBN 9781903996348

Flex-No-Lead project

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:https://doi.org/10.1115/IPACK2007-33820)

flexible substrates

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:https://doi.org/10.1115/IPACK2007-33820)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:https://doi.org/10.1109/ESIME.2006.1644052)

Rizvi, M.J., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Modeling the effect of lead-free soldering on flexible substrates. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:https://doi.org/10.1109/EMAP.2006.4430695)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280134)

flip chip

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

flip-chip assembly

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy (2004) Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

flip-chip devices

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

flip-chip packaging

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Kay, Robert W., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.01.004)

flip-chip underfills

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

fluid dynamics

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:https://doi.org/10.1109/POLYTR.2007.4339175)

Fluid structure interaction

Slone, Avril, Pericleous, Kyriacos A ORCID: 0000-0002-7426-9999 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Cross, M. and Bennett, C. (2002) Dynamic fluid-structure interactions using finite volume unstructured mesh procedures. Computers & Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:https://doi.org/10.1016/S0045-7949(01)00177-8)

flux

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)

focal plane array

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

foil

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.444141)

fracture mechanics

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684445)

fracture propogation path

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

frequency agile microwave oven bonding system (FAMOBS)

Tilford, Tim ORCID: 0000-0001-8307-6403 , Pavuluri, S., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270558)

Geometric conservation law

Slone, Avril, Pericleous, Kyriacos A ORCID: 0000-0002-7426-9999 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Cross, M. and Bennett, C. (2002) Dynamic fluid-structure interactions using finite volume unstructured mesh procedures. Computers & Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:https://doi.org/10.1016/S0045-7949(01)00177-8)

glob top

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

globtop

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

globtop design

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684555)

granular flow

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Pericleous, Koulis A. ORCID: 0000-0002-7426-9999 (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:https://doi.org/10.1080/15502280601149510)

growth rate

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)

health monitoring

Sutharssan, Thamo, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:https://doi.org/10.3390/mi3010078)

heat exchanger

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

heat sensitive film

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

heat transfer

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

heating

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

heritage structure

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh and Monger, George (2009) Prognostics framework for remaining life prediction of Cutty Sark iron structures. Annual Conference of the Prognostics and Health Management Society 2009. Prognostics and Health Management Society, 6 pages.

heritage structures

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:https://doi.org/10.1109/PHM.2010.5413403)

high aspect ratio microvia

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)

high current density induced damage

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

high density packaging

Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Design and modeling challenges for high density packaging. 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, Piscataway, NJ, USA, pp. 324-328. ISBN 1424404886 (doi:https://doi.org/10.1109/HDP.2006.1707617)

Historic Ships

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845 , Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Davies, Wynford, Harrap, Jullian, Kentley, Erik and Mason, Peter (2014) Digital modelling in the performance evaluation of 19th Century clipper ships: the Thermopylae and the Cutty Sark. In: Historic Ships 2014. Royal Institution of Naval Architects, pp. 81-86.

hot solder

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

hot solder dip

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273091)

hot solder dip refinishing process

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

Hull Efficiency

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845 , Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Davies, Wynford, Harrap, Jullian, Kentley, Erik and Mason, Peter (2014) Digital modelling in the performance evaluation of 19th Century clipper ships: the Thermopylae and the Cutty Sark. In: Historic Ships 2014. Royal Institution of Naval Architects, pp. 81-86.

IGBT

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

IGBT power modules

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Mermet-Guyennet, M. (2010) Real-time life consumption power modules prognosis using on-line rainflow algorithm in metro applications. In: Energy Conversion Congress and Exposition (ECCE), 2010 IEEE. IEEE Xplore Digital Library, Atlanta GA, pp. 970-977. ISBN 978-1-4244-5286-6 (print) ISSN 978-1-4244-5287-3 (online) (doi:https://doi.org/10.1109/ECCE.2010.5617883)

incomplete dataset

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Walshaw, Christopher ORCID: 0000-0003-0253-7779 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:https://doi.org/10.1515/comp-2019-0014)

individual surface mount components

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.

inhomogeneities

Tonry, Catherine, Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmuliez, Marc P.Y., Cargill, Scott and Yu, Weixing (2013) A method for the micro-encapsulation of dielectric fluids in joined polymer shells. Current Organic Chemistry, 17 (1). pp. 65-71. ISSN 1385-2728 (Print), 1875-5348 (Online)

insulated gate bipolar transistors

Kabir, Ahsanul, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273136)

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582869)

Integrated circuit modeling

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046616)

integrated circuit modelling

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

integrated circuit reliability

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

interactions

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441412)

interfacial reaction phenomena

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

interfacial reactions

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)

intermetallic compound

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684445)

intermetallic compound (IMC)

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

intermetallic compound layer

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C., Islam, M. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.071)

intermetallic compounds

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)

inverter

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

isolation substrate

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

Lu, Hua, Tilford, Tim, Xue, Xiangdong and Bailey, Christopher (2007) Thermal-mechanical modelling of power electronic module packaging. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 317-322. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.359960)

isotropic conductive adhesives

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy (2004) Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

isotropic conductive adhesives (ICAs)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Kay, Robert W., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.01.004)

Kay, Robert W., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Glinski, Greg P., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:https://doi.org/10.1109/TCAPT.2007.892085)

jet impingement cooling system

Rizvi, M.J., Skuriat, R., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Johnson, C. Mark and Lu, Hua ORCID: 0000-0002-4392-6562 (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:https://doi.org/10.1109/ESIME.2009.4938428)

joints

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

Rizvi, M.J., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Modeling the effect of lead-free soldering on flexible substrates. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:https://doi.org/10.1109/EMAP.2006.4430695)

kinematic-hardening

Ridout, Stephen, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:https://doi.org/10.1109/ESTC.2006.280122)

Kriging

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-014-0054-5)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

lab-on-a-chip

Kersaudy-Kerhoas, Maïwenn, Kavanagh, Deirdre, Xue, Xiangdong, Patel, Mayur, Bailey, Christopher, Dhariwal, Resham and Desmulliez, Marc P.Y. (2008) Integrated biomedical device for blood preparation. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-452. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684389)

Lagrangian

Slone, Avril, Fallah, Nosrat, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Cross, Mark (2002) A finite volume approach to geometrically non-linear stress analysis. In: Finite volumes for complex applications III: problems and perspectives. Hermes Penton Science, London, UK, pp. 663-670. ISBN 9781903996348

laser spot weld formation

Malik, Asif, Hughes, Michael and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Optoelectronic packaging interfaces for submicron alignment (OPISA) and the dynamics of laser spot weld formation. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 387-391. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280031)

layered structures

Nwanoro, Kenneth C., Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) An approximate numerical method for the prediction of plastic strain in layered structures. In: 2018 7th Electronic System-Integration Technology Conference (ESTC 2018). IEEE, pp. 181-187. ISBN 978-1538668153

LCD backlighting

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.444141)

lead

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

lead free applications

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:https://doi.org/10.1109/ESIME.2006.1644052)

lead free solder

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280134)

lead-free soldering

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:https://doi.org/10.1115/IPACK2007-33820)

leaded components

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273091)

LEDs

Sutharssan, Thamo, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:https://doi.org/10.3390/mi3010078)

level set method

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879 , McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)

Life consumption

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

life expectancy

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

life prediction

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

Ridout, Stephen and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:https://doi.org/10.1111/j.1460-2695.2006.01065.x)

life-time

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

lifetime modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

LIGA

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879 , McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)

light emitting diode (LED)

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.444141)

light emitting diodes

Sutharssan, Thamo, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:https://doi.org/10.3390/mi3010078)

Lithographically Induced Self-Construction (LISC)

Tonry, Catherine, Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmuliez, Marc P.Y., Cargill, Scott and Yu, Weixing (2013) A method for the micro-encapsulation of dielectric fluids in joined polymer shells. Current Organic Chemistry, 17 (1). pp. 65-71. ISSN 1385-2728 (Print), 1875-5348 (Online)

logistic regression

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Walshaw, Christopher ORCID: 0000-0003-0253-7779 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:https://doi.org/10.1515/comp-2019-0014)

low power tests

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

low temperature (T<100 C)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Kay, Robert W., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.01.004)

low-loss dielectric

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

Machine learning

Ahsan, Mominul, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2018.8443612)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2017.8000936)

manufacturing processes

Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4

material degradation

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh and Monger, George (2009) Prognostics framework for remaining life prediction of Cutty Sark iron structures. Annual Conference of the Prognostics and Health Management Society 2009. Prognostics and Health Management Society, 6 pages.

materials

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

materials damage

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh and Monger, George (2009) Prognostics framework for remaining life prediction of Cutty Sark iron structures. Annual Conference of the Prognostics and Health Management Society 2009. Prognostics and Health Management Society, 6 pages.

Materials reliability

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046616)

mathematical model

Kabir, Ahsanul, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273136)

mathematical modelling

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

megasonic agitation

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879 , McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)

melting

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

melting processes

Cross, Mark, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Pericleous, Koulis ORCID: 0000-0002-7426-9999 , Williams, Alison, Bojarevics, Valdis ORCID: 0000-0002-7326-7748 , Croft, Nick and Taylor, Gary (2002) The multiphysics modeling of solidification and melting processes. JOM (The Member Journal of The Minerals, Metals & Materials Society), 2002 (Supp.). ISSN 1047-4838

MEMS device

Xue, Xiangdong, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print), 1779-6288 (Online) (doi:https://doi.org/10.1051/ijsmdo/2009003)

micro-BGA

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

micro-electronic displays

Lee, Yek Bing, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

Lee, Yek, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:https://doi.org/10.1109/ESIME.2006.1644051)

micro-electronics manufacture

Sinclair, Keith I., Tilford, Tim ORCID: 0000-0001-8307-6403 , Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684409)

micro-manufactured

Lu, Hua ORCID: 0000-0002-4392-6562 , Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:https://doi.org/10.1109/HDP.2006.1707562)

micro-probe

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Leach, Richard, Hughes, Ben, Wilson, Alan, O'Neill, William, Dorey, Robert, Shaw, Christopher, Underhill, Daniel and Almond, Heather (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 193-198. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684348)

microassembly

Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: Dimov, Stefan, Menz, Wolfgang and Toshev, Yuli, (eds.) 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531

microcapsules

Tonry, Catherine, Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmuliez, Marc P.Y., Cargill, Scott and Yu, Weixing (2013) A method for the micro-encapsulation of dielectric fluids in joined polymer shells. Current Organic Chemistry, 17 (1). pp. 65-71. ISSN 1385-2728 (Print), 1875-5348 (Online)

microchannel biochip separator

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270767)

microchannel device

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Modelling and simulation of the behaviour of a biofluid in a microchannel biochip separator. Computer Methods in Biomechanics and Biomedical Engineering, 14 (6). pp. 549-560. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2010.485570)

microchannel systems

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270767)

microchannels

Kersaudy-Kerhoas, Maïwenn, Kavanagh, Deirdre, Xue, Xiangdong, Patel, Mayur, Bailey, Christopher, Dhariwal, Resham and Desmulliez, Marc P.Y. (2008) Integrated biomedical device for blood preparation. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-452. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684389)

microelectronics

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

Morris, James E., Tilford, Tim, Ferenets, M. and Bailey, Christopher (2009) A critical analysis of polymer cure modeling for microelectronics applications. In: IMAPS Nordic Conference 2009, 13-15 September 2009, Tønsberg, Norway.

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Hughes, Michael, Yin, Chunyan and Gwyer, David (2007) Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 4-11. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.360048)

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:https://doi.org/10.1109/POLYTR.2007.4339175)

microelectronics packaging

Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.

microfabricated solenoid inductor

Lu, Hua ORCID: 0000-0002-4392-6562 , Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, M.Y. (2006) An analysis of a microfabricated solenoid inductor. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 556-561. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280058)

Microfabrication

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845 , Patel, Mayur K., Yu, Weixing, Desmulliez, Marc P. Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2019) Fabrication of hollow polymer microstructures using dielectric and capillary forces. Microsystem Technologies. pp. 1-8. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-019-04409-z)

microfeeder

Xue, Xiangdong, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print), 1779-6288 (Online) (doi:https://doi.org/10.1051/ijsmdo/2009003)

Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: Dimov, Stefan, Menz, Wolfgang and Toshev, Yuli, (eds.) 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531

microfluidic device

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Modelling and simulation of the behaviour of a biofluid in a microchannel biochip separator. Computer Methods in Biomechanics and Biomedical Engineering, 14 (6). pp. 549-560. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2010.485570)

Microfluidics

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845 , Patel, Mayur K., Yu, Weixing, Desmulliez, Marc P. Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2019) Fabrication of hollow polymer microstructures using dielectric and capillary forces. Microsystem Technologies. pp. 1-8. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-019-04409-z)

Tonry, Catherine, Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmuliez, Marc P.Y., Cargill, Scott and Yu, Weixing (2013) A method for the micro-encapsulation of dielectric fluids in joined polymer shells. Current Organic Chemistry, 17 (1). pp. 65-71. ISSN 1385-2728 (Print), 1875-5348 (Online)

microinductors

Flynn, David, Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4

microstructure

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

Microstructures

Tonry, Catherine E. H. ORCID: 0000-0002-8214-0845 , Patel, Mayur K., Yu, Weixing, Desmulliez, Marc P. Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2019) Fabrication of hollow polymer microstructures using dielectric and capillary forces. Microsystem Technologies. pp. 1-8. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-019-04409-z)

Tonry, Catherine, Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmuliez, Marc P.Y., Cargill, Scott and Yu, Weixing (2013) A method for the micro-encapsulation of dielectric fluids in joined polymer shells. Current Organic Chemistry, 17 (1). pp. 65-71. ISSN 1385-2728 (Print), 1875-5348 (Online)

microsystem design

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441412)

microsystems

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

Hughes, Michael, Strussevich, Nadia, Bailey, Christopher ORCID: 0000-0002-9438-3879 , McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2009) Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:https://doi.org/10.1002/fld.2140)

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:https://doi.org/10.1007/978-0-387-47325-3_2)

Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Hughes, Michael, Yin, Chunyan and Gwyer, David (2007) Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 4-11. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.360048)

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441412)

microvias

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:https://doi.org/10.1109/EMAP.2012.6507864)

microwave

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

microwave curing

Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

microwave oven

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: 0000-0001-8307-6403 , Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

microwave radiation

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

microwave system

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:https://doi.org/10.1109/IEMT.2008.5507869)

microwave systems

Sinclair, Keith I., Tilford, Tim ORCID: 0000-0001-8307-6403 , Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684409)

microwaves

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910710843757)

Miner's linear damage accumulation

Lu, Hua, Tilford, Tim, Bailey, Christopher and Newcombe, David (2007) Lifetime prediction for power electronics module substrate mount-down solder interconnect. HDP'07: Proceedings Of The 2007 International Symposium On High Density Packaging And Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283558)

Mission profile

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

Model order reduction

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC52472.2021.9626396)

modeling

Morris, James E., Tilford, Tim, Ferenets, M. and Bailey, Christopher (2009) A critical analysis of polymer cure modeling for microelectronics applications. In: IMAPS Nordic Conference 2009, 13-15 September 2009, Tønsberg, Norway.

Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2008.09.105)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)

modelling

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270767)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Leach, Richard, Hughes, Ben, Wilson, Alan, O'Neill, William, Dorey, Robert, Shaw, Christopher, Underhill, Daniel and Almond, Heather (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 193-198. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684348)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Mason, P. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Finite element modelling of an historic ship structure - the Cutty Sark. In: Armstrong, Cecil G., (ed.) Proceedings of a joint conference of the Association for Computational Mechanics in Engineering (UK) and the Irish Society for Scientific and Engineeering Computation. 19th-20th April 2006, Queen's University Belfast. ACME/ISSEC, pp. 35-38.

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910610665107)

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

modelling and simulation

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2011) Modelling and simulation of the behaviour of a biofluid in a microchannel biochip separator. Computer Methods in Biomechanics and Biomedical Engineering, 14 (6). pp. 549-560. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:https://doi.org/10.1080/10255842.2010.485570)

modelling methodologies

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Lu, Hua ORCID: 0000-0002-4392-6562 (2017) Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability. Wspc Series In Advanced Integration And Packaging . World Scientific Publishing. ISBN 978-9814740203 ISSN 2315-473X (doi:https://doi.org/10.1142/9900)

modelling methodology

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525088)

modelling technologies

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:https://doi.org/10.1007/978-0-387-47325-3_2)

moisture

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910610665107)

monitoring

Kabir, Ahsanul, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273136)

multi-physics

Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Pericleous, Koulis A. ORCID: 0000-0002-7426-9999 (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:https://doi.org/10.1080/15502280601149510)

multi-physics modelling

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Hughes, Michael, Yin, Chunyan and Gwyer, David (2007) Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 4-11. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.360048)

multi-scale

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Pericleous, Koulis A. ORCID: 0000-0002-7426-9999 (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:https://doi.org/10.1080/15502280601149510)

multi-scale modelling

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

multichip modules

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582869)

multiphysics

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

Cross, Mark, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Pericleous, Koulis ORCID: 0000-0002-7426-9999 , Williams, Alison, Bojarevics, Valdis ORCID: 0000-0002-7326-7748 , Croft, Nick and Taylor, Gary (2002) The multiphysics modeling of solidification and melting processes. JOM (The Member Journal of The Minerals, Metals & Materials Society), 2002 (Supp.). ISSN 1047-4838

multiphysics modeling

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

multiphysics modelling

Tilford, Tim ORCID: 0000-0001-8307-6403 , Pavuluri, S., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270558)

N/A

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Mason, Peter, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) Structural Analysis on the Riveted Hull of the Paddle Steamer Medway Queen. In: Historic Ships Conference 2012. Royal Institution of Naval Architects (RINA).

Nano-Imprint Forming (NIF)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276670)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Amalou, Farid, Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:https://doi.org/10.1109/ESIME.2008.4525088)

nano-techology

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:https://doi.org/10.1007/978-0-387-47325-3_2)

Newmark algorithm

Slone, Avril, Pericleous, Kyriacos A ORCID: 0000-0002-7426-9999 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Cross, M. and Bennett, C. (2002) Dynamic fluid-structure interactions using finite volume unstructured mesh procedures. Computers & Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:https://doi.org/10.1016/S0045-7949(01)00177-8)

Newton Raphson

Slone, Avril, Fallah, Nosrat, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Cross, Mark (2002) A finite volume approach to geometrically non-linear stress analysis. In: Finite volumes for complex applications III: problems and perspectives. Hermes Penton Science, London, UK, pp. 663-670. ISBN 9781903996348

non-linear

Slone, Avril, Fallah, Nosrat, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Cross, Mark (2002) A finite volume approach to geometrically non-linear stress analysis. In: Finite volumes for complex applications III: problems and perspectives. Hermes Penton Science, London, UK, pp. 663-670. ISBN 9781903996348

non-linear transient finite element simulations

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432818)

Numerical methods

Nwanoro, Kenneth C., Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) An approximate numerical method for the prediction of plastic strain in layered structures. In: 2018 7th Electronic System-Integration Technology Conference (ESTC 2018). IEEE, pp. 181-187. ISBN 978-1538668153

numerical modelling

Strusevich, Nadezhda, Desmulliez, Marc P.Y., Abraham, Eitan, Flynn, David, Jones, Thomas, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming. Advances in Manufacturing, 1 (3). pp. 211-217. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-013-0039-9)

Rizvi, M.J., Skuriat, R., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Johnson, C. Mark and Lu, Hua ORCID: 0000-0002-4392-6562 (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:https://doi.org/10.1109/ESIME.2009.4938428)

Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684362)

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

Lu, Hua, Tilford, Tim, Bailey, Christopher and Newcombe, David (2007) Lifetime prediction for power electronics module substrate mount-down solder interconnect. HDP'07: Proceedings Of The 2007 International Symposium On High Density Packaging And Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283558)

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432813)

Tang, Y.K., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Decision support systems for eco-friendly electronic products. Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:https://doi.org/10.1109/EMAP.2006.4430580)

Strusevitch, Nadia, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Liu, D., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:https://doi.org/10.1109/EPTC.2006.342703)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Optimisation modelling for design of advanced interconnects. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:https://doi.org/10.1109/ESTC.2006.280148)

Numerical simulation

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

off-chip interconnection

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

Offshore renewable energy

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

on-chip interconnection

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

one turn inductor

Lu, Hua ORCID: 0000-0002-4392-6562 , Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:https://doi.org/10.1109/HDP.2006.1707562)

open-ended applicator

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: 0000-0001-8307-6403 , Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

open-ended microwave curing system

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:https://doi.org/10.1109/EPTC.2007.446975)

open-ended microwave oven

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

open-oven

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

OPISA

Malik, Asif, Hughes, Michael and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Optoelectronic packaging interfaces for submicron alignment (OPISA) and the dynamics of laser spot weld formation. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 387-391. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280031)

optical fiber

Powell, Adam, Warren, James and Bailey, Christopher ORCID: 0000-0002-9438-3879 (1998) Mechanism of motion of an optical fiber aligned by a solder droplet. In: MRS Spring Meeting - Symposium DD – Reliabilty of Photonics Materials & Structures.

optical interconnects

Misselbrook, P., Gwyer, David, Bailey, Christopher, Conway, P.P. and Williams, K. (2007) Review of the technology and reliability issues arising as optical interconnects migrate onto the circuit board. In: Lee, Y. C., Wong, C. P. and Suhir, Ephraim, (eds.) Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging. Springer, Boston, pp. 361-382. ISBN 978038727974 9 (doi:https://doi.org/10.1007/0-387-32989-7_34)

optical performance

Lee, Yek, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:https://doi.org/10.1109/ESTC.2006.280164)

optimisation

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Performance assessment of density and level-set topology optimisation methods for 3D heatsink design. Journal of Algorithms and Computational Technology, 12 (3). pp. 273-287. ISSN 1748-3018 (Print), 1748-3026 (Online) (doi:https://doi.org/10.1177/1748301818779019)

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

optimization

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

optimization of solder

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441412)

optimization tools

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441412)

opto-electronic assembly

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

optoelectronic packaging

Malik, Asif, Hughes, Michael and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Optoelectronic packaging interfaces for submicron alignment (OPISA) and the dynamics of laser spot weld formation. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 387-391. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280031)

organic light emitting diodes (OLED)

Kay, Robert W., Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Glinski, Greg P., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:https://doi.org/10.1109/TCAPT.2007.892085)

package design parameters

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432818)

packaged modules

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:https://doi.org/10.1115/IPACK2007-33817)

packaging

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:https://doi.org/10.1007/978-0-387-47325-3_2)

packaging design

Strusevitch, Nadia, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Liu, D., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:https://doi.org/10.1109/EPTC.2006.342703)

packaging technology

Tilford, Tim ORCID: 0000-0001-8307-6403 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Thermo-mechanical modelling of power electronics module structures. 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:https://doi.org/10.1109/EPTC.2006.342718)

parallel

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Pericleous, Koulis A. ORCID: 0000-0002-7426-9999 (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:https://doi.org/10.1080/15502280601149510)

parametric model order reduction

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:https://doi.org/10.23919/EMPC55870.2023.10418328)

parametric Model Order Reduction (pMOR)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE57496.2023.10168468)

Pb-free solder

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.444141)

photonics

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:https://doi.org/10.1109/POLYTR.2007.4339175)

PHYSICA

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.444141)

physics

Kabir, Ahsanul, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273136)

Physics of failure

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

physics of failure techniques

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:https://doi.org/10.1115/IPACK2007-33817)

physics-of-failure

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

plastic deformation

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

plastic strain

Nwanoro, Kenneth C., Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) An approximate numerical method for the prediction of plastic strain in layered structures. In: 2018 7th Electronic System-Integration Technology Conference (ESTC 2018). IEEE, pp. 181-187. ISBN 978-1538668153

plate fin heat sink

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

pneumatic microactuator

Xue, Xiangdong, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print), 1779-6288 (Online) (doi:https://doi.org/10.1051/ijsmdo/2009003)

Polydimethylsiloxane (PDMS)

Tonry, Catherine, Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmuliez, Marc P.Y., Cargill, Scott and Yu, Weixing (2013) A method for the micro-encapsulation of dielectric fluids in joined polymer shells. Current Organic Chemistry, 17 (1). pp. 65-71. ISSN 1385-2728 (Print), 1875-5348 (Online)

polymer

Morris, James E., Tilford, Tim, Ferenets, M. and Bailey, Christopher (2009) A critical analysis of polymer cure modeling for microelectronics applications. In: IMAPS Nordic Conference 2009, 13-15 September 2009, Tønsberg, Norway.

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

polymer curing

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

polymer encapsulant

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:https://doi.org/10.1109/IEMT.2008.5507869)

polymer materials curing

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:https://doi.org/10.1109/EPTC.2007.446975)

polymers

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:https://doi.org/10.1109/POLYTR.2007.4339175)

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910710843757)

potting cure

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

power cycling

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

power electronic module

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC52472.2021.9626396)

Hua, Lu, Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) A numerical procedure for the optimization of IGBT module packaging. In: 2018 19th International Conference on Electronic Packaging Technology (ICEPT). 08-11 August 2018. Shanghai, China. IEEE Xplore (CFP 18553-ART) (18553). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 156-160. ISBN 978-1538663868; 978-1538663851; 978-1538663875 (doi:https://doi.org/10.1109/ICEPT.2018.8480746)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

power electronic modules

Bailey, Christopher, Lu, Hua and Tilford, Tim (2007) Predicting the reliability of power electronic modules. In: Keyun, Bi and Ming, Li, (eds.) ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 809-813. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441543)

Tilford, Tim ORCID: 0000-0001-8307-6403 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Thermo-mechanical modelling of power electronics module structures. 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:https://doi.org/10.1109/EPTC.2006.342718)

power electronic modules (PEMs)

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

Power electronics

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2017.8233827)

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

Kabir, Ahsanul, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273136)

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:https://doi.org/10.1115/IPACK2007-33817)

power electronics module

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:https://doi.org/10.23919/EMPC55870.2023.10418328)

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:https://doi.org/10.1109/ICEPT.2008.4606983)

Power Electronics Module (PEM)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE57496.2023.10168468)

power electronics modules

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Musallam, M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C.M. (2010) In-service reliability assessment of solder interconnect in power electronics modules. In: 2010 Prognostics and System Health Management Conference, PHM '10. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781424447565 (Print), 9781424447589 (Online) (doi:https://doi.org/10.1109/PHM.2010.5413346)

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684555)

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432813)

power electronics modules (PEMs)

Rizvi, M.J., Skuriat, R., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Johnson, C. Mark and Lu, Hua ORCID: 0000-0002-4392-6562 (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:https://doi.org/10.1109/ESIME.2009.4938428)

power module

Shahjalal, Mohammad, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Electro-thermal modelling of multi chip power modules for high power converter application. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin. IEEE, pp. 940-945. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046599)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-014-0054-5)

Power semiconductor packages

Ahsan, Mominul, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2018.8443612)

power supply circuits

Lu, Hua ORCID: 0000-0002-4392-6562 , Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:https://doi.org/10.1109/HDP.2006.1707562)

predictive models

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273091)

Kabir, Ahsanul, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273136)

printed circuit manufacture

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

printed circuits

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:https://doi.org/10.1109/EMAP.2012.6507864)

probabilistic optimisation

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

probability based analytical tools

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441412)

prognostic fusion

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh and Monger, George (2009) Prognostics framework for remaining life prediction of Cutty Sark iron structures. Annual Conference of the Prognostics and Health Management Society 2009. Prognostics and Health Management Society, 6 pages.

prognostics

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Machine learning for additive manufacturing of electronics. In: Proceedings 2017 40th International Spring Seminar on Electronics Technology (ISSE). IEEE. ISBN 978-1-5386-0583-7 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2017.8000936)

prognostics and health management

Kabir, Ahsanul, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273136)

prognostics framework

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:https://doi.org/10.1109/PHM.2010.5413403)

Rosunally, Yasmine, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Mason, Peter, Campbell, Sheelagh and Monger, George (2009) Prognostics framework for remaining life prediction of Cutty Sark iron structures. Annual Conference of the Prognostics and Health Management Society 2009. Prognostics and Health Management Society, 6 pages.

prototyping

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Leach, Richard, Hughes, Ben, Wilson, Alan, O'Neill, William, Dorey, Robert, Shaw, Christopher, Underhill, Daniel and Almond, Heather (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 193-198. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:https://doi.org/10.1109/ESTC.2008.4684348)

QFN

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical analysis of conformally coated QFNs for high reliability applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11). pp. 2210-2218. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2019.2925874)

Radial basis

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-014-0054-5)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

rainflow algorithm

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Mermet-Guyennet, M. (2010) Real-time life consumption power modules prognosis using on-line rainflow algorithm in metro applications. In: Energy Conversion Congress and Exposition (ECCE), 2010 IEEE. IEEE Xplore Digital Library, Atlanta GA, pp. 970-977. ISBN 978-1-4244-5286-6 (print) ISSN 978-1-4244-5287-3 (online) (doi:https://doi.org/10.1109/ECCE.2010.5617883)

random forest

Hinojosa Herrera, Ana Elsa ORCID: 0000-0002-0636-1881 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Walshaw, Christopher ORCID: 0000-0003-0253-7779 and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Data analytics to reduce stop-on-fail test in electronics manufacturing. Open Computer Sciences, 9 (1). pp. 200-211. ISSN 2299-1093 (Online) (doi:https://doi.org/10.1515/comp-2019-0014)

real time

Musallam, Mahera, Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, Mark (2014) Mission profile-based reliability design and real-time life consumption estimation in power electronics. IEEE Transactions on Power Electronics, 30 (5). pp. 2601-2613. ISSN 0885-8993 (Print), 1941-0107 (Online) (doi:https://doi.org/10.1109/TPEL.2014.2358555)

recursive algorithm

Musallam, M., Johnson, C.M., Yin, Chunyan ORCID: 0000-0003-0298-0420 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Mermet-Guyennet, M. (2010) Real-time life consumption power modules prognosis using on-line rainflow algorithm in metro applications. In: Energy Conversion Congress and Exposition (ECCE), 2010 IEEE. IEEE Xplore Digital Library, Atlanta GA, pp. 970-977. ISBN 978-1-4244-5286-6 (print) ISSN 978-1-4244-5287-3 (online) (doi:https://doi.org/10.1109/ECCE.2010.5617883)

reduced order modelling (ROM)

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441412)

Reduced order models

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2014) Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings. Advances in Manufacturing, 2 (3). pp. 239-250. ISSN 2095-3127 (Print), 2195-3597 (Online) (doi:https://doi.org/10.1007/s40436-014-0054-5)

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

reduced order models (ROM)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Yannou, J.-M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.359948)

reflow

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

relative permittivity

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

reliability

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Waite, Rhys, Hicks, Christopher and Golding, Terry (2020) Packaging challenges and reliability performance of compound semiconductor focal plane arrays. In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, pp. 1-8. ISBN 978-0956808660 (doi:https://doi.org/10.23919/EMPC44848.2019.8951842)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical analysis of conformally coated QFNs for high reliability applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11). pp. 2210-2218. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2019.2925874)

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Numerical simulation of the junction temperature, the coolant flow rate and the reliability of an IGBT module. In: 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2018). IEEE, pp. 250-255. ISBN 978-1538667606

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2017.8233827)

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582869)

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Musallam, M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C.M. (2010) In-service reliability assessment of solder interconnect in power electronics modules. In: 2010 Prognostics and System Health Management Conference, PHM '10. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781424447565 (Print), 9781424447589 (Online) (doi:https://doi.org/10.1109/PHM.2010.5413346)

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:https://doi.org/10.1115/IPACK2007-33817)

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:https://doi.org/10.1115/IPACK2007-33820)

Rizvi, M.J., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Modeling the effect of lead-free soldering on flexible substrates. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:https://doi.org/10.1109/EMAP.2006.4430695)

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

reliability assessment

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:https://doi.org/10.23919/EMPC55870.2023.10418328)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE57496.2023.10168468)

reliability management

Richardson, Andrew, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120710723706)

reliability modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy (2004) Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

reliability prediction

Tilford, Tim ORCID: 0000-0001-8307-6403 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Thermo-mechanical modelling of power electronics module structures. 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:https://doi.org/10.1109/EPTC.2006.342718)

reliability prediction techniques

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Yin, Chunyan, Tilford, Tim and Ridout, Stephen (2008) Predictive reliability and prognostics for electronic components: current capabilities and future challenges. 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 67-72. ISBN 978-1-4244-3972-0 (doi:https://doi.org/10.1109/ISSE.2008.5276460)

Reliability test

Ahsan, Mominul, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Data driven prognostics for failure of power semiconductor packages. In: Proceedings of 41st Spring Seminar on Electronics Technology (ISSE). IEEE Xplore, pp. 1-6. ISBN 978-1-5386-5730-0 ISSN 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE.2018.8443612)

response surface model

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

RF-ID tag bonding

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

risk analysis

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

risk mitigation

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

SAC305

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

scanning acoustic microscopy

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

scour

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

ship

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Mason, P. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Finite element modelling of an historic ship structure - the Cutty Sark. In: Armstrong, Cecil G., (ed.) Proceedings of a joint conference of the Association for Computational Mechanics in Engineering (UK) and the Irish Society for Scientific and Engineeering Computation. 19th-20th April 2006, Queen's University Belfast. ACME/ISSEC, pp. 35-38.

silicon carbide

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

simulation

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

Tilford, Tim ORCID: 0000-0001-8307-6403 , Sinclair, Keith I., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910710843757)

SiP

Strusevitch, Nadia, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Liu, D., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:https://doi.org/10.1109/EPTC.2006.342703)

SiP structure

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Yannou, J.-M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.359948)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432818)

SnPbAgCu quaternary solder alloy

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

solder

Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:https://doi.org/10.1016/j.tsf.2008.09.105)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C., Islam, M. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.071)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

Rizvi, M.J., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Modeling the effect of lead-free soldering on flexible substrates. Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:https://doi.org/10.1109/EMAP.2006.4430695)

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

Powell, Adam, Warren, James and Bailey, Christopher ORCID: 0000-0002-9438-3879 (1998) Mechanism of motion of an optical fiber aligned by a solder droplet. In: MRS Spring Meeting - Symposium DD – Reliabilty of Photonics Materials & Structures.

solder interface strength

Alam, M. O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.) 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

Solder joint

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2015) A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55 (11). pp. 2371-2381. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2015.07.047)

Alam, M.O., Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:https://doi.org/10.1109/ESTC.2008.4684445)

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:https://doi.org/10.1109/ICEPT.2008.4606983)

Ridout, Stephen and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:https://doi.org/10.1111/j.1460-2695.2006.01065.x)

solder joint failure

Bailey, Christopher, Lu, Hua and Tilford, Tim (2007) Predicting the reliability of power electronic modules. In: Keyun, Bi and Ming, Li, (eds.) ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 809-813. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441543)

solder joint fatigue

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Lu, Hua ORCID: 0000-0002-4392-6562 , Musallam, M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C.M. (2010) In-service reliability assessment of solder interconnect in power electronics modules. In: 2010 Prognostics and System Health Management Conference, PHM '10. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781424447565 (Print), 9781424447589 (Online) (doi:https://doi.org/10.1109/PHM.2010.5413346)

solder joint reliability

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

solder joints

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

Ridout, Stephen, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:https://doi.org/10.1109/ESTC.2006.280122)

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

Lu, Hua, Tilford, Tim, Bailey, Christopher and Newcombe, David (2007) Lifetime prediction for power electronics module substrate mount-down solder interconnect. HDP'07: Proceedings Of The 2007 International Symposium On High Density Packaging And Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283558)

Ridout, Stephen, Dusek, Milos, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.05.001)

Strusevitch, Nadia, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Liu, D., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: Pang, J.H.L., Vaidyanathan, K., Wong, S.C.K. and Tee, T.Y., (eds.) 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:https://doi.org/10.1109/EPTC.2006.342703)

solder paste

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

solder-mask defined joints

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:https://doi.org/10.1115/IPACK2007-33820)

soldering

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582869)

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

Solid modeling

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2017) Modelling the impact of conformal coating penetration on QFN reliability. In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1021-1026. ISBN 978-1-5386-2973-4 (doi:https://doi.org/10.1109/ICEPT.2017.8046616)

solidification

Cross, Mark, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Pericleous, Koulis ORCID: 0000-0002-7426-9999 , Williams, Alison, Bojarevics, Valdis ORCID: 0000-0002-7326-7748 , Croft, Nick and Taylor, Gary (2002) The multiphysics modeling of solidification and melting processes. JOM (The Member Journal of The Minerals, Metals & Materials Society), 2002 (Supp.). ISSN 1047-4838

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

stress

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273091)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

stress analysis

Slone, Avril, Fallah, Nosrat, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Cross, Mark (2002) A finite volume approach to geometrically non-linear stress analysis. In: Finite volumes for complex applications III: problems and perspectives. Hermes Penton Science, London, UK, pp. 663-670. ISBN 9781903996348

stress and strain distribution

Bailey, Christopher, Lu, Hua and Tilford, Tim (2007) Predicting the reliability of power electronic modules. In: Keyun, Bi and Ming, Li, (eds.) ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 809-813. ISBN 9781424413911 (doi:https://doi.org/10.1109/ICEPT.2007.4441543)

Stress comparison

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Transactions on Device and Materials Reliability, 17 (4). pp. 727-737. ISSN 1530-4388 (doi:https://doi.org/10.1109/TDMR.2017.2766692)

structural bonding

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

subsea cable scoring

Flynn, David, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Wenshuo, Tang and Yin, Chunyan ORCID: 0000-0003-0298-0420 (2019) Prognostics and health management of subsea cables. In: Goodman, Douglas, Hofmeister, James P. and Szidarovszky, Ferenc, (eds.) Prognostics and Health Management: A Practical Approach to Improving System Reliability Using Condition-Based Data. Quality and Reliability Engineering Series . Wiley-Blackwell. ISBN 978-1119356653

Subsea cables

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

substrate delamination

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432813)

substrates

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Lu, Hua ORCID: 0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:https://doi.org/10.1109/ICEPT.2010.5582869)

surface tension

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

testing

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan ORCID: 0000-0003-0298-0420 and Hughes, Michael (2008) Modelling technologies and applications. In: Morris, James E., (ed.) Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:https://doi.org/10.1007/978-0-387-47325-3_2)

thermal cycling

Ridout, Stephen and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:https://doi.org/10.1111/j.1460-2695.2006.01065.x)

thermal analysis

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

thermal cycling

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Stewart, Paul (2019) Thermo-mechanical analysis of conformally coated QFNs for high reliability applications. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (11). pp. 2210-2218. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2019.2925874)

thermal expansion

Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2002) Computer modelling of the reliability of flip chips with metal column bumping. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., pp. 967-973. ISBN 0780371526 (doi:https://doi.org/10.1109/ITHERM.2002.1012561)

thermal fatigue

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

thermal modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:https://doi.org/10.1109/ESimE.2012.6191763)

thermal processing

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim ORCID: 0000-0001-8307-6403 , Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

thermal stress

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

thermal stresses

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273091)

thermal-mechanical analysis

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:https://doi.org/10.23919/EMPC55870.2023.10418328)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2023) Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania. IEEE Xplore . Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7. ISBN 979-8350334845; 979-8350334852 ISSN 2161-2528 (Print), 2161-2536 (Online) (doi:https://doi.org/10.1109/ISSE57496.2023.10168468)

thermal-mechanical loading

Lu, Hua, Tilford, Tim, Xue, Xiangdong and Bailey, Christopher (2007) Thermal-mechanical modelling of power electronic module packaging. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 317-322. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.359960)

thermo-mechanical

Yin, Chunyan ORCID: 0000-0003-0298-0420 , Rizvi, M.J., Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:https://doi.org/10.1109/ESTC.2006.280134)

thermo-mechanical behaviour

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Yannou, J.-M., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:https://doi.org/10.1109/ESIME.2007.359948)

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432818)

thermo-mechanical Reliability

Xu, Yilun, Xian, Jingwei, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Coyle, Richard, Gourlay, Christopher and Dunne, Fionn (2022) A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. International Journal of Plasticity, 155:103308. ISSN 0749-6419 (doi:https://doi.org/10.1016/j.ijplas.2022.103308)

thermo-mechanics

Lee, Yek, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:https://doi.org/10.1109/ESTC.2006.280164)

Lee, Yek, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:https://doi.org/10.1109/ESIME.2006.1644051)

thermomechanical processes

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273091)

thermomigration

Alam, M. O., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283569)

thermosetting polymer materials

Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.

Sinclair, Keith I., Tilford, Tim ORCID: 0000-0001-8307-6403 , Goussetis, George, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:https://doi.org/10.1109/ESTC.2008.4684409)

tin whiskers

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Stewart, Paul, Parker, Mike and Roulston, John F. (2020) Experimental and modelling study on delamination risks for refinished electronic packages under hot solder dip loads. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (3). pp. 502-515. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2020.2972635)

Topology

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2018) Performance assessment of density and level-set topology optimisation methods for 3D heatsink design. Journal of Algorithms and Computational Technology, 12 (3). pp. 273-287. ISSN 1748-3018 (Print), 1748-3026 (Online) (doi:https://doi.org/10.1177/1748301818779019)

Transient structural dynamics

Slone, Avril, Pericleous, Kyriacos A ORCID: 0000-0002-7426-9999 , Bailey, Christopher ORCID: 0000-0002-9438-3879 , Cross, M. and Bennett, C. (2002) Dynamic fluid-structure interactions using finite volume unstructured mesh procedures. Computers & Structures, 80 (5-6). pp. 371-390. ISSN 0045-7949 (doi:https://doi.org/10.1016/S0045-7949(01)00177-8)

uncertainty analysis

Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: Schrefler, B.A. and Perego, U., (eds.) 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

underfill

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Stewart†, Paul and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2021) Reliability optimisation and lifetime modelling of micro-BGA assemblies in harsh environment applications. In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). 13-16 Sept. 2021. Gothenburg, Sweden. IEEE Xplore . Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-0956808677 ; 978-1665423687 (doi:https://doi.org/10.23919/EMPC53418.2021.9584970)

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 , Glinski, Greg, Wheeler, Daniel, Hamilton, Phil, Hendriksen, Mike and Smith, Brian (2002) Using computer models to identify optimal conditions for flip-chip assembly and reliability. Circuit World, 28 (1). pp. 14-20. ISSN 0305-6120 (doi:https://doi.org/10.1108/03056120210696658)

UV-LIGA process

Tonry, Catherine, Patel, Mayur K., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Desmuliez, Marc P.Y., Cargill, Scott and Yu, Weixing (2013) A method for the micro-encapsulation of dielectric fluids in joined polymer shells. Current Organic Chemistry, 17 (1). pp. 65-71. ISSN 1385-2728 (Print), 1875-5348 (Online)

variable frequency microwave (VFM)

Tilford, Tim ORCID: 0000-0001-8307-6403 , Pavuluri, S., Bailey, Christopher ORCID: 0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:https://doi.org/10.1109/ICEPT.2009.5270558)

Variable Frequency Microwave (VFM) heating

Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:https://doi.org/10.1109/ICEPT.2008.4607039)

variable frequency microwave technology

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:https://doi.org/10.1109/EPTC.2007.446975)

vias

Strusevich, Nadezhda, Patel, Mayur and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2012) Parametric modeling study of basic electrodeposition in microvias. In: The 14th International Conference on Electronic Materials and Packaging, 13-16 December 2012, Citygate, Lantau Island, Hong Kong. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 145-149. ISBN 9781467349444 (doi:https://doi.org/10.1109/EMAP.2012.6507864)

Vortex generator

Santhanakrishnan, Mani Sekaran, Tilford, Timothy ORCID: 0000-0001-8307-6403 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2022) Heat transfer characteristics of plate fin heat sink with longitudinal vortex generators. International Journal of Numerical Methods for Heat and Fluid Flow, 33 (3). pp. 1203-1228. ISSN 0961-5539 (doi:https://doi.org/10.1108/HFF-06-2022-0386)

wafer processing

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:https://doi.org/10.1109/HDP.2007.4283552)

wafer scale level packaging

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

waveguide cavity resonator

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

wear

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 (2019) Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications. IEEE ACCESS, 7. pp. 54658-54669. ISSN 2169-3536 (Online) (doi:https://doi.org/10.1109/ACCESS.2019.2911260)

wetting

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C., Islam, M. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.071)

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:https://doi.org/10.1109/ITHERM.2006.1645436)

wetting force

Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)

wire bond fatigue

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:https://doi.org/10.1109/ISSE.2007.4432813)

wire/ribbon bond

Nwanoro, Kenneth Chimezie, Lu, Hua ORCID: 0000-0002-4392-6562 , Yin, Chunyan ORCID: 0000-0003-0298-0420 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2017) Computer simulation of the reliability of wire bonds and ribbon bonds in power electronics modules. In: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, pp. 1-6. ISBN 978-1-5386-1929-2 ISSN 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC.2017.8233827)

wirebond

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Bailey, Christopher ORCID: 0000-0002-9438-3879 and Bella, Martina (2021) Applying model order reduction to the reliability prediction of power electronic module wire bond structure. In: 2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE, Piscataway, US. ISBN 978-1665418973 ISSN 2474-1515 (Print), 2474-1523 (Online) (doi:https://doi.org/10.1109/THERMINIC52472.2021.9626396)

Lu, Hua ORCID: 0000-0002-4392-6562 , Loh, Wei-Sun, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:https://doi.org/10.1109/IMPACT.2008.4783883)

wires

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Best, Chris, Alam, Mohammad, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:https://doi.org/10.1109/ISSE.2012.6273091)

This list was generated on Wed Mar 27 22:56:57 2024 UTC.