Items where Author is "Bailey, Christopher"

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(HSD) 3D-miniaturised systems accelerated temperature cycle accelerated testing ACF active matrix liquid crystal display actuator design adhesive materials adhesives ageing aging aluminium aluminium wirebonds AMLCD analysis tools analytical models analytical techniques anisotropic conductive film (ACF) assembly process technology ball grid array (BGA) ball shear test Bayesian networks biofluid behaviour blood fluid separation blood plasma separation blood preparation bond strength bumps carbon-nanotubes case study casting CFD CFD simulation chip mountdown solder chip-on-board (COB) assembly chip-on-flex (COF) circuits compact thermal models computational fluid dynamics computational fluid dynamics (CFD) computational mechanics computational models computed tomography computer modelling computer simulation conductive particle conductivity conservation constituitive modeling constitutive law contact angle contact resistance contactless convection oven cooling efficiency copper copper track designs coupled simulation coupling crack propagation creep curves cross-flow filtration cure cure process curing curing process curing processes current crowding Cutty Sark cyclic thermal-mechanical loading data driven prognostics data-driven prognostics DC-DC decision support system deformation design design optimistation design process die attach dielectric material diffusion distributed manipulation electric aircraft electric car electrical configurations electrical connections electrodeposition electromechanical devices electromigration electron bombardment electronic components electronic engineering electronic packaging electronic packaging thermal management electronic product design electronic products electronics design electronics industry embedded die end-fed probes evaluation fabrication failure failure analysis failure mechanisms failure modes failure modes and mechanisms fatigue fatigue life-time FDTD ferrous operations finite element finite element (FE) method finite element analysis finite element analysis (FEA) Finite Element Analysis(FEA) finite element modelling Flex-No-Lead project flexible substrates flip-chip assembly flip-chip packaging flip-chip underfills fluid dynamics flux foil fracture mechanics fracture propogation path frequency agile microwave oven bonding system (FAMOBS) glob top globtop globtop design granular flow growth rate health monitoring heat sensitive film heating heritage structure heritage structures heterogeneous electronics based systems high current density induced damage high density packaging higher-density interconnection hot solder hot solder dip IGBT power modules individual surface mount components insulated gate bipolar transistors interactions interconnection technology interfacial reaction phenomena interfacial reactions intermetallic compound intermetallic compound (IMC) intermetallic compound layer intermetallic compounds isolation substrate isotropic conductive adhesives (ICAs) jet impingement cooling system joints kinematic-hardening lab-on-a-chip laser spot weld formation LCD backlighting lead lead free applications lead free solder lead free solder interconnects lead-free soldering leaded components LEDs level set method life prediction life-time LIGA light emitting diode (LED) light emitting diodes low power tests low temperature (T<100 C) low-loss dielectric manufacturing processes manufacturing systems material degradation materials materials damage mathematical model mathematical modelling mathematics mechanics megasonic agitation MEMS device metals casting micro-electronic displays micro-electronics manufacture micro-manufactured micro-probe microassembly microchannel biochip separator microchannel device microchannel systems microchannels microelectronics microelectronics manufacturing microelectronics packaging microfabricated solenoid inductor microfeeder microfluidic device microinductors microsystem design microsystems microwave microwave curing microwave oven microwave radiation microwave system microwave systems microwaves Miner's linear damage accumulation miniaturisation modeling modeling iron modelling modelling and simulation modelling methodology modelling technologies moisture monitoring multi-disciplinary design multi-physics multi-physics modelling multi-scale multiphysics multiphysics modelling Nano-Imprint Forming (NIF) nano-techology nanotechnology non-linear transient finite element simulations novel micro-integrated products numerical modelling numerical models numerical optimisation off-chip interconnection on-chip interconnection one turn inductor open-ended applicator open-ended microwave curing system open-ended microwave oven open-oven OPISA optical interconnects optical performance optimisation optimization optimization of solder optimization tools opto-electronic assembly optoelectronic packaging organic light emitting diodes (OLED) package design parameters packaged modules packaging packaging design packaging technology parallel particle swarm optimisation algorithm Pb-free solder photonics PHYSICA physics physics of failure techniques physics-of-failure pneumatic microactuator polymer polymer cure kinetics models polymer curing polymer encapsulant polymer materials curing polymers potting cure power electronic modules power electronic modules (PEMs) power electronics power electronics module power electronics modules power electronics modules (PEMs) power supply circuits predictive models probability based analytical tools process efficiency prognostic fusion prognostics and health management prognostics framework prototyping rainflow algorithm recursive algorithm reduced order modelling (ROM) reduced order models reduced order models (ROM) relative permittivity reliability reliability management reliability prediction reliability prediction techniques renewable energy RF-ID tag bonding risk mitigation ship side-by-side dies silicon simulation SiP SiP structure SiP technology solder solder interface strength solder joint solder joint failure solder joint fatigue solder joints solder-mask defined joints soldering stacked die stcked die steelmaking processes stress stress and strain distribution structural bonding substrate delamination testing thermal cycling thermal analysis thermal modelling thermal processing thermal stresses thermal-mechanical loading thermo-mechanical thermo-mechanical behaviour thermo-mechanical reliability thermo-mechanical reliability analysis thermo-mechanics thermomechanical processes thermomigration thermosetting polymer materials uncertainty analysis uncertainty analysisfatigue life-time variable frequency microwave (VFM) Variable Frequency Microwave (VFM) heating variable frequency microwave technology wafer processing wafer scale level packaging warpage waveguide cavity resonator wetting wetting force wire bond fatigue wirebond wires

Number of items: 102.

(HSD)

Stoyanov, Stoyan, Best, Chris, Alam, Mohammad, Bailey, Christopher, Tollafield, Peter, Parker, Mike and Scott, Jim (2012) Modelling and testing the impact of hot solder dip process on leaded components. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 303-308. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273091)

3D-miniaturised systems

Stoyanov, Stoyan, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2008) Modelling of nano-imprint forming process for the production of miniaturised 3D structures. In: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 497-504. ISBN 978-1-4244-2127-5 (doi:10.1109/ESIME.2008.4525088)

accelerated temperature cycle

Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283556)

accelerated testing

Bailey, Christopher, Tilford, Tim and Lu, Hua (2007) Reliability analysis for power electronics modules. In: 2007 30th International Spring Seminar On Electronics Technology. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 12-17. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432813)

ACF

Rizvi, M.J., Bailey, Christopher and Lu, Hua (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

active matrix liquid crystal display

Lee, Yek, Bailey, Christopher, Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

Lee, Yek, Bailey, Christopher, Lu, Hua, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. In: 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:10.1109/ESIME.2006.1644051)

actuator design

Xue, Xiangdong, Bailey, Christopher, Turitto, Michele and Ratchev, Svetan (2009) Modelling and optimization of a pneumatic microfeeder system. International Journal for Simulation and Multidisciplinary Design Optimization, 3 (1). pp. 307-315. ISSN 1779-627X (Print) 1779-6288 (Electronic) (doi:10.1051/ijsmdo/2009003)

adhesive materials

Goussetis, George, Sinclair, Keith I., Sangster, Alan J., Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Microwave curing for high density package. In: 2007 International Symposium on High Density Design Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 1. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283552)

adhesives

Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. In: 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863 (doi:10.1109/POLYTR.2007.4339175)

ageing

aging

Rizvi, M.J., Bailey, Christopher, Chan, Y.C., Islam, M. and Lu, Hua (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

Rizvi, M.J., Chan, Y.C., Bailey, Christopher, Lu, Hua and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

aluminium

Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. In: 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1 (doi:10.1109/IMPACT.2008.4783883)

aluminium wirebonds

Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer modelling analysis of the globtop's effects on aluminium wirebond reliability. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1369-1373. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684555)

AMLCD

Lee, Yek, Bailey, Christopher, Lu, Hua, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. In: Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE , pp. 1214-1217. ISBN 9781424405527 (doi:10.1109/ESTC.2006.280164)

analysis tools

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Tilford, Tim, Xue, Xiangdong, Alam, M.O., Yin, Chunyan and Hughes, Michael (2008) Modelling technologies and applications. In: Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)

analytical models

Stoyanov, Stoyan, Bailey, Christopher, Tollafield, Peter, Crawford, Rob, Parker, Mike, Scott, Jim and Roulston, John (2012) Thermal modelling and optimisation of hot solder dip process. In: 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012). Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA. ISBN 978-1-4673-1512-8 (doi:10.1109/ESimE.2012.6191763)

analytical techniques

Xue, Xiangdong, Bailey, Christopher, Lu, Hua and Stoyanov, Stoyan (2011) Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability, 51 (5). pp. 936-945. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.01.008)

anisotropic conductive film (ACF)

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. In: Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:10.1109/ITHERM.2006.1645436)

assembly process technology

Tilford, Tim, Bailey, Christopher, Parrott, Kevin, Rizvi, M.J., Yin, Chunyan, Sinclair, Keith I. and Desmulliez, Marc P.Y. (2008) Impact of assembly process technologies on electronic packaging materials. In: International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2739-0 (online) 978-1-4244-2740-6 (print) (doi:10.1109/ICEPT.2008.4607039)

ball grid array (BGA)

Alam, M.O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)

ball shear test

Bayesian networks

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Bayesian networks for predicting remaining life. International Journal of Performability Engineering, 6 (5). pp. 499-512. ISSN 0973-1318

biofluid behaviour

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher, Desmulliez, Marc P.Y. and Topham, David (2009) Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: modelling biofluids in a microchannel biochip separator. In: International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 179-186. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270767)

blood fluid separation

Xue, Xiangdong, Patel, Mayur, Kersaudy-Kerhoas, Maïwenn, Bailey, Christopher and Desmulliez, Marc P.Y. (2011) Modelling and simulation of the behaviour of a biofluid in a microchannel biochip separator. Computer Methods in Biomechanics and Biomedical Engineering, 14 (6). pp. 549-560. ISSN 1025-5842 (Print), 1476-8259 (Online) (doi:10.1080/10255842.2010.485570)

blood plasma separation

blood preparation

Kersaudy-Kerhoas, Maïwenn, Kavanagh, Deirdre, Xue, Xiangdong, Patel, Mayur, Bailey, Christopher, Dhariwal, Resham and Desmulliez, Marc P.Y. (2008) Integrated biomedical device for blood preparation. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-452. ISBN 978-1-4244-2814-4 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684389)

bond strength

bumps

carbon-nanotubes

Bailey, Christopher and Lu, Hua (2011) Interconnect technologies using carbon nanotubes: Current status and future challenges. In: Electronics Technology (ISSE), 2011 34th International Spring Seminar on. 2011 34th International Spring Seminar on Electronics Technology (ISSE) . Institute of Electrical and Electronics Engineers, Danvers, M, pp. 1-5. ISBN 978-1-4577-2111-3 ISSN 2161-2528 (doi:10.1109/ISSE.2011.6053539)

case study

Xue, Xiangdong, Lu, Hua and Bailey, Christopher (2007) A modelling approach for coupling numerical analytical techniques applied in microsystems. In: ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 204-211. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441412)

casting

Cross, Mark, Croft, Nick, Slone, Avril, Williams, Alison, Christakis, Nicholas, Patel, Mayur, Bailey, Christopher and Pericleous, Koulis A. (2007) Computational modelling of multi-physics and multi-scale processes in parallel. International Journal for Computational Methods and Engineering Science and Mechanics, 8 (2). pp. 63-74. ISSN 1550-2287 (doi:10.1080/15502280601149510)

CFD

Hughes, Michael, Strussevitch, Nadia, Bailey, Christopher, McManus, Kevin, Kaufmann, Jens, Flynn, David and Desmulliez, Marc P.Y. (2010) Numerical algorithms for modelling electrodeposition: tracking the deposition front under forced convection from megasonic agitation. International Journal for Numerical Methods in Fluids, 64 (3). pp. 237-268. ISSN 0271-2091 (Print), 1097-0363 (Online) (doi:10.1002/fld.2140)

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

CFD simulation

Turitto, Michele, Ratchev, Svetan, Xue, Xiangdong, Hughes, Michael and Bailey, Christopher (2007) Pneumatic contactless microfeeder design refinement through CFD simulation. In: 4M 2007 Proceedings of the 3rd International Conference on Multi-Material Micro Manufacture. Whittles Publishing, Dunbeath, Scotland, pp. 65-68. ISBN 9781904445531

chip mountdown solder

Lu, Hua, Tilford, Tim, Xue, Xiangdong and Bailey, Christopher (2007) Thermal-mechanical modelling of power electronic module packaging. In: EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 317-322. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359960)

chip-on-board (COB) assembly

Tilford, Tim, Pavuluri, S., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) On variable frequency microwave processing of heterogeneous chip-on-board assemblies. In: International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 927-931. ISBN 978-1-4244-4659-9 (doi:10.1109/ICEPT.2009.5270558)

chip-on-flex (COF)

circuits

Richardson, Andrew, Bailey, Christopher, Yanou, Jean Marc, Dumas, Norbert, Liu, Dongsheng, Stoyanov, Stoyan and Strusevitch, Nadia (2007) "System in package technology" - design for manufacture challenges. Circuit World, 33 (1). pp. 36-46. ISSN 0305-6120 (doi:10.1108/03056120710723706)

compact thermal models

Musallam, M., Johnson, C.M., Yin, Chunyan, Bailey, Christopher and Mermet-Guyennet, M. (2010) Real-time life consumption power modules prognosis using on-line rainflow algorithm in metro applications. In: Energy Conversion Congress and Exposition (ECCE), 2010 IEEE. IEEE Xplore Digital Library, Atlanta GA, pp. 970-977. ISBN 978-1-4244-5286-6 (print) ISSN 978-1-4244-5287-3 (online) (doi:10.1109/ECCE.2010.5617883)

computational fluid dynamics

Cross, Mark, Croft, Nick, McBride, Diane, Slone, Avril, Williams, Alison, Bailey, Christopher and Pericleous, Koulis A. (2006) Computational fluid dynamics: advancements in technology for modeling iron and steelmaking processes. Aist Transactions - Iron and Steel Technology, 3 (7). pp. 155-163.

computational fluid dynamics (CFD)

Kay, Robert W., Stoyanov, Stoyan, Glinski, Greg P., Bailey, Christopher and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:10.1109/TCAPT.2007.892085)

computational mechanics

computational models

Stoyanov, Stoyan, Tang, Ying Kit, Bailey, Christopher, Evans, Robert, Marson, Silvia and Allen, David (2009) Modelling and process capability analysis of focused ion beam. In: ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings. IEEE Computer Society, Piscataway, NJ USA. ISBN 97814244 42607 (Print) (doi:10.1109/ISSE.2009.5206925)

computed tomography

computer modelling

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh, Monger, George and Bell, Ian (2010) Fusion approach for predictive maintenance of heritage structures. In: Prognostics & Health Management Conference, 2010, PHM '10. IEEE Conference Publications . IEEE, pp. 1-6. ISBN 978-1-4244-4756-5 (print), 978-1-4244-4758-9 (e-book) (doi:10.1109/PHM.2010.5413403)

Rosunally, Yasmine, Stoyanov, Stoyan, Bailey, Christopher, Mason, Peter, Campbell, Sheelagh and Monger, George (2009) Prognostics framework for remaining life prediction of Cutty Sark iron structures. In: Annual Conference of the Prognostics and Health Management Society 2009. Prognostics and Health Management Society , 6 pages.

Ridout, Stephen, Dusek, Milos, Bailey, Christopher and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.05.001)

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Comparative wetting behavior of Sn-0.7Cu and Sn-0.7Cu-0.3Ni solders on Cu and Ni substrates. In: 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 145-151. ISBN 142440553X (doi:10.1109/ITHERM.2006.1645436)

Rizvi, M.J., Yin, Chunyan and Bailey, Christopher (2006) Modeling the effect of lead-free soldering on flexible substrates. In: Electronic Materials and Packaging, 2006, EMAP 2006, International Conference on 11-14 Dec. 2006. IEEE, Piscataway, NJ, USA, pp. 1038-1042. ISBN 1424408334; 1424408342 (doi:10.1109/EMAP.2006.4430695)

Stoyanov, Stoyan and Bailey, Christopher (2006) Optimisation modelling for design of advanced interconnects. In: 1st Electronics Systemintegration Technology Conference. Dresden, Saxony, Germany. 2006 proceedings. IEEE, Piscataway, NJ, USA, pp. 1108-1117. ISBN 1424405521 (doi:10.1109/ESTC.2006.280148)

computer simulation

Lu, Hua, Ridout, Stephen, Bailey, Christopher, Loh, Wei-Sun, Pearl, Agyakwa and Johnson, C. Mark (2008) Computer simulation of crack propagation in power electronics module solder joints. In: International Conference on Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4244-2740-6 (print) 978-1-4244-2739-0 (online) (doi:10.1109/ICEPT.2008.4606983)

conductive particle

conductivity

conservation

constituitive modeling

Ridout, Stephen, Bailey, Christopher, Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. In: Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE , pp. 927-933. ISBN 1-4244-0552-1 (doi:10.1109/ESTC.2006.280122)

constitutive law

Ridout, Stephen and Bailey, Christopher (2007) Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue & Fracture of Engineering Materials & Structures, 30 (5). pp. 400-412. ISSN 8756-758X (doi:10.1111/j.1460-2695.2006.01065.x)

contact angle

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

contact resistance

contactless

convection oven

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. In: 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:10.1109/IEMT.2008.5507869)

cooling efficiency

Rizvi, M.J., Skuriat, R., Tilford, Tim, Bailey, Christopher, Johnson, C. Mark and Lu, Hua (2009) Modelling of jet-impingement cooling for power electronics. In: 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. Institute of Electrical and Electronics Engineers, Inc. , Piscataway, NJ, USA. ISBN 978-1-4244-4160-0 (doi:10.1109/ESIME.2009.4938428)

copper

Rizvi, M.J., Lu, Hua and Bailey, Christopher (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)

copper track designs

Rizvi, M.J., Yin, Chunyan, Bailey, Christopher and Lu, Hua (2007) Modelling the reliability of components on flexible substrates. In: IPACK 2007: proceedings of the ASME Interpack Conference 2007. American Society of Mechanical Engineers, New York, pp. 375-380. ISBN 9780791842775 (doi:10.1115/IPACK2007-33820)

coupled simulation

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Coupled FDTD-FVM simulation of microwave heating of polymer materials for micro-systems packaging applications. Annual microwave heating symposium (41st). pp. 7-11. ISSN 1070-0129

coupling

crack propagation

creep curves

cross-flow filtration

cure

Morris, James E., Tilford, Tim, Ferenets, M. and Bailey, Christopher (2009) A critical analysis of polymer cure modeling for microelectronics applications. In: IMAPS Nordic Conference 2009, 13-15 September 2009, Tønsberg, Norway.

cure process

Sinclair, Keith I., Tilford, Tim, Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Advanced microwave oven for rapid curing of encapsulant. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 551-556. ISBN 978-1-4244-2814-4 (print) 978-1-4244-2813-7 (online) (doi:10.1109/ESTC.2008.4684409)

curing

curing process

Tilford, Tim, Ferenets, M., Morris, James E., Krumme, A., Pavuluri, S., Rajaguru, P.R., Desmulliez, Marc P.Y. and Bailey, Christopher (2010) Application of particle swarm optimisation to evaluation of polymer cure kinetics models. Journal of Algorithms & Computational Technology, 4 (1). pp. 121-146. ISSN 1748-3018 (doi:10.1260/1748-3018.4.1.121)

curing processes

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Pavuluri, S. and Desmulliez, Marc P.Y. (2009) On the application of variable frequency microwave technology for processing of individual surface mount components. In: 2009 International Conference on Electronics Packaging.

current crowding

Alam, M.O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)

Cutty Sark

Stoyanov, Stoyan, Mason, P. and Bailey, Christopher (2006) Finite element modelling of an historic ship structure - the Cutty Sark. In: Proceedings of a joint conference of the Association for Computational Mechanics in Engineering (UK) and the Irish Society for Scientific and Engineeering Computation. 19th-20th April 2006, Queen's University Belfast. ACME/ISSEC, pp. 35-38.

cyclic thermal-mechanical loading

Lu, Hua, Tilford, Tim, Bailey, Christopher and Newcombe, David (2007) Lifetime prediction for power electronics module substrate mount-down solder interconnect. In: HDP'07: Proceedings Of The 2007 International Symposium On High Density Packaging And Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283558)

data driven prognostics

Sutharssan, Thamo, Stoyanov, Stoyan, Bailey, Christopher and Rosunally, Yasmine (2012) Prognostics and health monitoring of high power LED. Micromachines, 3 (1). pp. 78-100. ISSN 2072-666X (doi:DOI: 10.3390/mi3010078)

data-driven prognostics

Kabir, Ahsanul, Bailey, Christopher, Lu, Hua and Stoyanov, Stoyan (2012) A review of data-driven prognostics in power electronics. In: 2012 35th International Spring Seminar on Electronics Technology. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, N.J., USA, pp. 189-192. ISBN 978-1-4673-2241-6 (Print), 978-1-4673-2239-3 (Online) ISSN 2161-2528 (doi:10.1109/ISSE.2012.6273136)

DC-DC

Flynn, David, Lu, Hua, Bailey, Christopher and Desmulliez, Marc P.Y. (2006) Assessment of microInductors for DC-DC converters. In: Proceedings of 2006 International Conference on Electronic Materials and Packaging (EMAP 2006). IEEE. ISBN 978-1-4244-0834-4

Lu, Hua, Flynn, David, Bailey, Christopher and Desmulliez, M.Y. (2006) An analysis of a microfabricated solenoid inductor. In: Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 556-561. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280058)

decision support system

Tang, Y.K., Stoyanov, Stoyan, Bailey, Christopher and Lu, Hua (2006) Decision support systems for eco-friendly electronic products. In: Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on. IEEE, Piscataway, N.J., pp. 77-84. ISBN 1424408342; 9781424408344 (doi:10.1109/EMAP.2006.4430580)

deformation

Stoyanov, Stoyan, Tilford, Tim, Amalou, Farid, Cargill, Scott, Bailey, Christopher and Desmulliez, Marc P.Y. (2011) Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. Engineering Computations, 28 (1). pp. 93-111. ISSN 0264-4401 (doi:10.1108/02644401111097046)

design

Bailey, Christopher (2006) Design and modeling challenges for high density packaging. In: 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, Piscataway, NJ, USA, pp. 324-328. ISBN 1424404886 (doi:10.1109/HDP.2006.1707617)

design optimistation

design process

Rajaguru, P.R., Stoyanov, Stoyan, Tang, Ying Kit, Bailey, Christopher, Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. In: 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:10.1109/ESIME.2010.5464573)

die attach

dielectric material

diffusion

distributed manipulation

electric aircraft

Bailey, Christopher, Lu, Hua and Newcombe, D.R. (2007) Rapid solutions for application specific IGBT module design. In: International Exhibition and Conference for Power Electronics, Intelligent Motion and Power Quality (PCIM Europe 2007). Curran Associates, Inc., Red Hook , New York. ISBN 9781604231816

electric car

electrical configurations

Lu, Hua, Loh, Wei-Sun, Tilford, Tim, Johnson, M. and Bailey, Christopher (2007) Reliability of power electronic modules. In: ASME 2007 InterPACK Conference. American Society of Mechanical Engineers, New York, pp. 883-888. ISBN 0791842789 (doi:10.1115/IPACK2007-33817)

electrical connections

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y.C. (2006) Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly. Soldering & Surface Mount Technology, 18 (2). pp. 27-32. ISSN 0954-0911 (doi:10.1108/09540910610665107)

electrodeposition

Strusevitch, Nadia, Hughes, Michael, Bailey, Christopher and Djambazov, Georgi (2008) Numerical modelling of electrodeposition phenomena. In: 2nd Electronics System-Integration Technology Conference, Greenwich, UK, 1-4 September 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 281-286. ISBN 978-1-4244-2813-7 (Print) 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684362)

electromechanical devices

electromigration

electron bombardment

electronic components

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Yin, Chunyan, Tilford, Tim and Ridout, Stephen (2008) Predictive reliability and prognostics for electronic components: current capabilities and future challenges. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 67-72. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276460)

electronic engineering

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Goussetis, George, Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing in micro-electronics packaging applications. Soldering & Surface Mount Technology, 19 (3). pp. 26-33. ISSN 0954-0911 (doi:10.1108/09540910710843757)

electronic packaging

electronic packaging thermal management

electronic product design

electronic products

electronics design

electronics industry

embedded die

Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: IMAPS Poland 2007: 31 International conference and exhibition: Proceedings. Institute of Electrical and Electronics Engineers, Inc.. ISBN 9788391770146

end-fed probes

Sinclair, Keith I., Sangster, Alan J., Goussetis, George, Desmulliez, Marc P.Y., Tilford, Tim, Parrott, Kevin and Bailey, Christopher (2007) Open ended microwave oven for flip-chip assembly. In: 2007 European Microwave Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 620-623. ISBN 9782874870019

evaluation

fabrication

Stoyanov, Stoyan, Amalou, Farid, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2008) Minimising the risk of defects in nano-imprint forming. In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 367-372. ISBN 978-1-4244-3972-0 (doi:10.1109/ISSE.2008.5276670)

failure

failure analysis

failure mechanisms

failure modes

failure modes and mechanisms

Bailey, Christopher, Lu, Hua and Tilford, Tim (2007) Predicting the reliability of power electronic modules. In: ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 809-813. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.4441543)

fatigue

fatigue life-time

FDTD

ferrous operations

finite element

Bailey, Christopher, Tilford, Tim, Ridout, Stephen and Lu, Hua (2008) Optimizing the reliability of power electronics module isolation substrates. In: EngOpt 2008: International Conference on Engineering Optimization. Universidade Federal do Rio de Janeiro, Rio de Janeiro, Brazil. ISBN 978-85-7650-152-7 (print and CD ROM)

finite element (FE) method

finite element analysis

finite element analysis (FEA)

Finite Element Analysis(FEA)

finite element modelling

Flex-No-Lead project

flexible substrates

Yin, Chunyan, Lu, Hua, Bailey, Christopher and Chan, Y. (2006) Analyzing the performance of flexible substrates for lead-free applications. In: Proceedings of EuroSime 2006 : 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. IEEE, pp. 539-544. ISBN 1 4244 0276 X (doi:10.1109/ESIME.2006.1644052)

Yin, Chunyan, Rizvi, M.J., Lu, Hua and Bailey, Christopher (2006) Thermal-mechanical analysis of flexible substrates during lead-free solder reflow. In: Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1007-1011. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280134)

flip-chip assembly

flip-chip packaging

Stoyanov, Stoyan, Kay, Robert W., Bailey, Christopher and Desmulliez, Marc P.Y. (2007) Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives. Microelectronics Reliability, 47 (1). pp. 132-141. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.01.004)

flip-chip underfills

fluid dynamics

flux

foil

Yin, Chunyan, Lee, Youngjo, Bailey, Christopher, Riches, Steve, Cartwright, C., Sharpe, R. and Orr, H. (2007) Thermal analysis of LEDS for liquid crystal display's backlighting. In: ICEPT: 2007 8th International Conference On Electronics Packaging Technology, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 212-216. ISBN 9781424413911 (doi:10.1109/ICEPT.2007.444141)

fracture mechanics

Alam, M.O., Lu, Hua, Bailey, Christopher and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684445)

fracture propogation path

frequency agile microwave oven bonding system (FAMOBS)

glob top

globtop

globtop design

granular flow

growth rate

health monitoring

heat sensitive film

heating

heritage structure

heritage structures

heterogeneous electronics based systems

high current density induced damage

high density packaging

higher-density interconnection

hot solder

hot solder dip

IGBT power modules

individual surface mount components

insulated gate bipolar transistors

interactions

interconnection technology

interfacial reaction phenomena

interfacial reactions

intermetallic compound

intermetallic compound (IMC)

intermetallic compound layer

intermetallic compounds

isolation substrate

isotropic conductive adhesives (ICAs)

jet impingement cooling system

joints

kinematic-hardening

lab-on-a-chip

laser spot weld formation

Malik, Asif, Hughes, Michael and Bailey, Christopher (2006) Optoelectronic packaging interfaces for submicron alignment (OPISA) and the dynamics of laser spot weld formation. In: Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 387-391. ISBN 1 4244 0552 1 (doi:10.1109/ESTC.2006.280031)

LCD backlighting

lead

lead free applications

lead free solder

lead free solder interconnects

lead-free soldering

leaded components

LEDs

level set method

life prediction

life-time

LIGA

light emitting diode (LED)

light emitting diodes

low power tests

low temperature (T<100 C)

low-loss dielectric

manufacturing processes

manufacturing systems

material degradation

materials

materials damage

mathematical model

mathematical modelling

mathematics

Bailey, Christopher, Clapham, S., Cross, Mark, Dixon, T., Wolfe, S. and Norman, P. (1996) Modelling stress evolution during cable fabrication. ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 76 (Issue Supplement S4). pp. 97-100. ISSN ISSN: 0044-2267 (print), 1521-4001 (online) (doi:10.1002/zamm.19960761408)

mechanics

megasonic agitation

MEMS device

metals casting

Bailey, Christopher, Lyster, C., Cross, Mark, Fryer, Yvonne and Pericleous, Koulis A. (1996) Multiphysics modelling of the metals casting process. Proceedings of the Royal Society A, 452 (1946). pp. 459-486. ISSN Online: 1471-2946 (doi:10.1098/rspa.1996.0024)

micro-electronic displays

micro-electronics manufacture

micro-manufactured

Lu, Hua, Flynn, David, Bailey, Christopher and Desmulliez, Marc P.Y. (2006) Computer modeling of a micro-manufactured one-turn inductor. In: Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. IEEE. ISBN 1 4244 0489 4 (doi:10.1109/HDP.2006.1707562)

micro-probe

Stoyanov, Stoyan, Bailey, Christopher, Leach, Richard, Hughes, Ben, Wilson, Alan, O'Neill, William, Dorey, Robert, Shaw, Christopher, Underhill, Daniel and Almond, Heather (2008) Modelling and prototyping the conceptual design of 3D CMM micro-probe. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 193-198. ISBN 978-1-4244-2814-4 (Print), 978-1-4244-2813-7 (Online) (doi:10.1109/ESTC.2008.4684348)

microassembly

microchannel biochip separator

microchannel device

microchannel systems

microchannels

microelectronics

Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Hughes, Michael, Yin, Chunyan and Gwyer, David (2007) Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges. In: EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 4-11. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360048)

microelectronics manufacturing

microelectronics packaging

Ferenets, M., Tilford, Tim, Sinclair, Keith I., Bailey, Christopher and Desmulliez, Marc P.Y. (2009) Microwave curing of thermosetting polymer materials in microelectronics applications. In: Baltic Polymer Symposium 2009, 22-25 September 2009, Ventspils, Latvia.

microfabricated solenoid inductor

microfeeder

microfluidic device

microinductors

microsystem design

microsystems

Bailey, Christopher, Stoyanov, Stoyan, Tang, Ying Kit, Xue, Xiangdong and Tilford, Tim (2008) Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components. In: 8th World Congress on Computational Mechanics (WCCM8) and 5th European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, Venice, Italy. International Center for Numerical Methods in Engineering (CIMNE), Barcelona, Spain. ISBN 978-84-96736-55-9

microwave

Tilford, Tim, Sinclair, Keith I., Rajaguru, P.R., Morris, James E., Desmulliez, Marc P.Y. and Bailey, Christopher (2009) Numerical optimisation of polymer curing using a dual-section microwave system. Annual microwave heating symposium (43rd). pp. 129-136. ISSN 1070-0129

microwave curing

microwave oven

Pavuluri, S.K., Goussetis, George, Desmulliez, Marc P.Y., Adamietz, R., Tilford, Tim, Ferenets, M., Muller, G., Eicher, F. and Bailey, Christopher (2011) Open-ended single mode resonant applicator for microelectronics packaging applications. In: Proceedings of the Microwave Heating and Processing of Materials Seminar 2011. IET, pp. 89-91. ISBN 978 1 84919 310 8

microwave radiation

microwave system

microwave systems

microwaves

Miner's linear damage accumulation

miniaturisation

modeling

modeling iron

modelling

modelling and simulation

modelling methodology

modelling technologies

moisture

monitoring

multi-disciplinary design

Bailey, Christopher, Lu, Hua, Tilford, Tim, Rizvi, M.J. and Yin, Chunyan (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600 (doi:10.1109/ESIME.2009.4938505)

multi-physics

multi-physics modelling

multi-scale

multiphysics

multiphysics modelling

Nano-Imprint Forming (NIF)

nano-techology

nanotechnology

non-linear transient finite element simulations

Stoyanov, Stoyan, Bailey, Christopher, Strusevitch, Nadia and Yannou, J.-M. (2007) Computational approach for reliable and robust system-in-package design. In: 2007 30th International Spring Seminar On Electronics Technology. International Spring Seminar on Electronics Technology ISSE . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 40-45. ISBN 9781424412174 (doi:10.1109/ISSE.2007.4432818)

novel micro-integrated products

numerical modelling

Strusevitch, Nadia, Stoyanov, Stoyan, Liu, D., Bailey, Christopher, Richardson, A., Dumas, N., Yannou, J.M. and Georgel, V. (2006) Modelling the behavior of solder joints for wafer level SiP. In: 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 127-132. ISBN 1424406641; 142440665X (doi:10.1109/EPTC.2006.342703)

numerical models

numerical optimisation

off-chip interconnection

on-chip interconnection

one turn inductor

open-ended applicator

open-ended microwave curing system

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Variable frequency microwave curing of polymer materials in microelectronics packaging applications. In: 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., New York, pp. 791-796. ISBN 9781424413232 (doi:10.1109/EPTC.2007.446975)

open-ended microwave oven

open-oven

OPISA

optical interconnects

Misselbrook, P., Gwyer, David, Bailey, Christopher, Conway, P.P. and Williams, K. (2007) Review of the technology and reliability issues arising as optical interconnects migrate onto the circuit board. In: Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging. Springer, Boston, pp. 361-382. ISBN 978038727974 9 (doi:10.1007/0-387-32989-7_34)

optical performance

optimisation

optimization

optimization of solder

optimization tools

opto-electronic assembly

optoelectronic packaging

organic light emitting diodes (OLED)

package design parameters

packaged modules

packaging

packaging design

packaging technology

Tilford, Tim, Lu, Hua and Bailey, Christopher (2006) Thermo-mechanical modelling of power electronics module structures. In: 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:10.1109/EPTC.2006.342718)

parallel

particle swarm optimisation algorithm

Pb-free solder

photonics

PHYSICA

physics

physics of failure techniques

physics-of-failure

pneumatic microactuator

polymer

polymer cure kinetics models

polymer curing

polymer encapsulant

polymer materials curing

polymers

potting cure

power electronic modules

power electronic modules (PEMs)

power electronics

power electronics module

power electronics modules

Yin, Chunyan, Lu, Hua, Musallam, M., Bailey, Christopher and Johnson, C.M. (2010) In-service reliability assessment of solder interconnect in power electronics modules. In: 2010 Prognostics and System Health Management Conference, PHM '10. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA. ISBN 9781424447565 (Print), 9781424447589 (Online) (doi:10.1109/PHM.2010.5413346)

power electronics modules (PEMs)

power supply circuits

predictive models

probability based analytical tools

process efficiency

prognostic fusion

prognostics and health management

prognostics framework

prototyping

rainflow algorithm

recursive algorithm

reduced order modelling (ROM)

reduced order models

reduced order models (ROM)

Stoyanov, Stoyan, Yannou, J.-M., Bailey, Christopher and Strusevitch, Nadia (2007) Reliability based design optimisation for system-in-package. In: EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 289-296. ISBN 9781424411054 (doi:10.1109/ESIME.2007.359948)

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