Items where Author is "Alam, M.O."
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Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:10.1016/j.microrel.2012.01.015)
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.05.001)
Alam, M.O. and Bailey, C. (Eds.) (2011) Advanced adhesives in electronics, materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767
Alam, M.O. and Bailey, C. (2011) Introduction to adhesives joining technology for electronics. In: Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767
Bailey, C. (2011) Modelling techniques used to assess conductive adhesive properties. In: Advanced adhesives in electronics: Materials, properties and applications. Woodhead Publishing Limited, Cambridge, UK. ISBN 9781845695767
Alam, M.O., Lu, H., Bailey, Chris and Chan, Y.C. (2009) Fracture mechanics analysis of solder joint intermetallic compounds in shear test. Computational Materials Science, 45 (2). pp. 576-583. ISSN 0927-0256 (doi:10.1016/j.commatsci.2008.12.001)
Alam, M.O., Lu, Hua, Bailey, Chris and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability (T-DMR), 9 (1). pp. 40-48. ISSN 1530-4388 (doi:10.1109/TDMR.2008.2010595)
Bailey, Christopher, Lu, Hua, Stoyanov, Stoyan, Tilford, Tim, Xue, Xiangdong, Alam, M.O., Yin, Chunyan and Hughes, Michael (2008) Modelling technologies and applications. In: Nanopackaging: Nanotechnologies and Electronics Packaging. Springer Science+Business Media, LLC, New York, USA, pp. 15-38. ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online) (doi:10.1007/978-0-387-47325-3_2)
Alam, M.O., Lu, Hua, Bailey, Christopher and Chan, Y.C. (2008) Fracture mechanics analysis of cracks in solder joint intermetallic compounds. In: 2nd Electronics System-Integration Technology Conference, 2008. ESTC 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 757-762. ISBN 978-1-4244-2813-7 (doi:10.1109/ESTC.2008.4684445)
Alam, M.O., Lu, Hua, Bailey, Christopher, Chan, Y.C. and Wu, B.Y. (2007) Shear strength analysis of ball grid array (BGA) solder interfaces. In: 2007 9th Electronics Packaging Technology Conference. Electronics Packaging Technology Conference Proceedings . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773. ISBN 9781424413249 (doi:11.1109/EPTC.2007.4469797)
Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)
Alam, M.O., Bailey, Christopher, Wu, B.Y., Yang, Dan and Chan, Y.C. (2007) High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99. ISBN 9781424412525 (doi:10.1109/HDP.2007.4283569)
Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (doi:10.1007/s10853)
Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)