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Numerical Modelling for Electronic Packaging - Future Requirements

Numerical Modelling for Electronic Packaging - Future Requirements

Bailey, C. (2005) Numerical Modelling for Electronic Packaging - Future Requirements. In: 2005 6th International Conference on Electronic Packaging Technology (ICEPT), 31 Aug - 02 Sep 2005, Shenzhen, China.

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Abstract

The fabrication, assembly and testing of electronic packaging can involve complex interactions between physical phenomena such as temperature, fluid flow, electromagnetics, and stress. Numerical modelling and optimisation tools are key computer-aided-engineering technologies that aid design engineers. This paper discusses these technologies and there future developments.

Item Type: Conference or Conference Paper (Paper)
Subjects: Q Science > QA Mathematics > QA76 Computer software
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 09:02
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/942

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