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Thermal management technologies for electronic packaging: current capabilities and future challenges for modelling tools

Thermal management technologies for electronic packaging: current capabilities and future challenges for modelling tools

Bailey, C. (2008) Thermal management technologies for electronic packaging: current capabilities and future challenges for modelling tools. In: 2008 10th Electronics Packaging Technology Conference (EPTC 2008) [Conference Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 527-532. ISBN 9781424421176 (doi:10.1109/EPTC.2008.4763487)

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Abstract

Extracting heat from electronic systems has always been a challenging task for electronic package designers. Ever increasing miniaturisation and functionality of Microsystems packaging technologies is resulting in increased power densities that current thermal management techniques are finding difficult to manage.

Thermal management of electronics is a significant issue because of increasing volumetric power densities and the harsh environments in which they are deployed. Environmental factors are forcing companies to broaden their view of thermal management as energy management, where industry is being driven to minimise the amount of energy required to keep electronic systems cool.

This paper will discuss both current capabilities and future requirements for passive and active cooling technologies. Modelling technologies which can be used by designers to 10 predict optimal thermal/energy management solutions will also be discussed.

Item Type: Conference Proceedings
Title of Proceedings: 2008 10th Electronics Packaging Technology Conference (EPTC 2008) [Conference Proceedings]
Additional Information: [1] This paper was first presented at the 10th Electronics Packaging Technology Conference, 2008. (EPTC 2008), held from 9-12 December 2008 in Singapore. [2] ISSN: 9781424421176 (Print); 9781424421183 (Online)
Uncontrolled Keywords: electronic packaging thermal management, electronics packaging, energy management, environmental factors, environmental management, power system management, power system modeling, technology management, thermal management, thermal management of electronics
Subjects: Q Science > QA Mathematics > QA76 Computer software
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Computing & Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 09:23
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/9209

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