Skip navigation

The effect of thermal cycle profiles on solder joint damage

The effect of thermal cycle profiles on solder joint damage

Ridout, Stephen, Dusek, Milos, Bailey, Chris and Hunt, Chris (2004) The effect of thermal cycle profiles on solder joint damage. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 436-441. ISBN 983251486X

Full text not available from this repository.

Abstract

The relationship between the damage caused at different thermal cycles is very important. The whole of accelerated thermal cycle testing is based on the premise that damage at one cycle is representative of damage at a different cycle. In this paper, the relative damage caused by six thermal cycle profiles are predicted using Finite Element (FE) modelling and the results validated against experiments. Both creep strain and strain energy density were used as damage indicators and creep strain was found to correlate better with experiment. The validated FE model is then used to investigate the effect of altering each of the thermal profile parameters (ramp and swell times, hot and cold temperatures). The components used for testing are surface mount resistors - 1206, 0805 and 0603. The solders investigated are eutectic SnAgCu and eutectic SnAg.

Item Type: Conference Proceedings
Title of Proceedings: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004)
Additional Information: [1] This paper was first presented at the 6th International Conference on Electronics Materials and Packaging (EMAP 2004), held from 5-7 December 2004 in Penang, Malaysia.
Uncontrolled Keywords: thermal cycles, strain, Finite Element, (FE), solder joints
Subjects: Q Science > QA Mathematics > QA76 Computer software
T Technology > TN Mining engineering. Metallurgy
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 09:02
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/841

Actions (login required)

View Item View Item