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Lifetime assessment of electronic components for high reliability aerospace applications

Lifetime assessment of electronic components for high reliability aerospace applications

Stoyanov, S. ORCID: 0000-0001-6091-1226, Mackay, W., Bailey, C., Jibb, D. and Gregson, C. (2004) Lifetime assessment of electronic components for high reliability aerospace applications. In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-329. ISBN 0780388216 (doi:10.1109/EPTC.2004.1396627)

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Abstract

This paper details a modelling approach for assessing the in-service (field) reliability and thermal fatigue life-time of electronic package interconnects for components used in the assembly of an aerospace system. The Finite Element slice model of a Plastic Ball Grid Array (PBGA) package and suitable energy based damage models for crack length predictions are used in this study.

Thermal fatigue damage induced in tin-lead solder joints are investigated by simulating the crack growth process under a set of prescribed field temperature profiles that cover the period of operational life. The overall crack length in the solder joint for all different thermal profiles and number of cycles for each profile is predicted using a superposition technique.

The effect of using an underfill is also presented. A procedure for verifying the field lifetime predictions for the electronic package by using reliability assessment under Accelerated Thermal Cycle (ATC) testing is also briefly outlined.

Item Type: Conference Proceedings
Title of Proceedings: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004)
Additional Information: [1] This paper was first presented at the 6th Electronics Packaging Technology Conference (EPTC 2004) held from 8-10 December 2004 in Singapore. [2] ISBN:0-7803-8821-6 (bound ed.); ISBN 0-7803-8822-4 (CD-ROM edition).
Uncontrolled Keywords: aerospace, ball grid arrays, finite element analysis, integrated circuit interconnections, integrated circuit reliability, life testing, solders thermal stress cracking
Subjects: Q Science > QA Mathematics > QA76 Computer software
T Technology > TK Electrical engineering. Electronics Nuclear engineering
T Technology > TL Motor vehicles. Aeronautics. Astronautics
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 09:02
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/840

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