Skip navigation

A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly

A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly

Lu, H., Stoyanov, S., Bailey, C., Hung, K.C. and Chan, Y.C. (2001) A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly. In: Proceedings of the 4th International Symposium on Electronic Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., pp. 338-343. ISBN 0780398114

Full text not available from this repository.

Abstract

In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfills as the application and curing of this type of underfill can be undertaken before and during the reflow process - adding high volume throughput. Adopting a no-flow underfill process may result in underfill entrapment between solder and fluid, voiding in the underfill, a possible delamination between underfill and surrounding surfaces. The magnitude of these phenomena may adversely affect the reliability of the assembly in terms of solder joint thermal fatigue. This paper presents both an experimental and mdeling analysis investigating the reliabity of a flip-chip component and how the magnitude of underfill entrapment may affect thermal-mechanical fatigue life.

Item Type: Conference Proceedings
Title of Proceedings: Proceedings of the 4th International Symposium on Electronic Packaging Technology
Additional Information: [1] This paper was first presented at the 4th International Symposium on Electronic Packaging Technology, (ISEPT' 2001), held from 8-11 August 2001 in Beijing, China.
Uncontrolled Keywords: flip-chip assembly, no-flow underfill materials
Subjects: Q Science > QA Mathematics > QA76 Computer software
T Technology > TJ Mechanical engineering and machinery
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 09:01
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/792

Actions (login required)

View Item View Item