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Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows

Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows

Glinski, G.P., Bailey, C., Durairaj, R. and Ekere, N.N. (2002) Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows. In: IMAPS - Europe Cracow 2002, 16-18 June 2002, Cracow, Poland.

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Item Type: Conference or Conference Paper (Paper)
Additional Information: [1] This paper was first presented at IMAPS - Europe Cracow 2002, European Microelectronics Packaging and Interconnection Symposium and Table Top Exhibition, held from 16-18 June 2002 in Crakow, Poland. It was delivered within Session 7: Assembly Technologies (Part II) on 18 June 2002.
Uncontrolled Keywords: multi-scale computational simulations, adhesive flows
Subjects: Q Science > QA Mathematics > QA76 Computer software
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 09:01
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/788

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