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Low Reynolds number turbulence models for accurate thermal simulations of electronic components

Low Reynolds number turbulence models for accurate thermal simulations of electronic components

Dhinsa, K., Bailey, C. and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304081)

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Abstract

The electronics industry and the problems associated with the cooling of microelectronic equipment are developing rapidly. Thermal engineers now find it necessary to consider the complex area of equipment cooling at some level. This continually growing industry also faces heightened pressure from consumers to provide electronic product miniaturization, which in itself increases the demand for accurate thermal management predictions to assure product reliability. Computational fluid dynamics (CFD) is considered a powerful and almost essential tool for the design, development and optimization of engineering applications. CFD is now widely used within the electronics packaging design community to thermally characterize the performance of both the electronic component and system environment. This paper discusses CFD results for a large variety of investigated turbulence models. Comparison against experimental data illustrates the predictive accuracy of currently used models and highlights the growing demand for greater mathematical modelling accuracy with regards to thermal characterization. Also a newly formulated low Reynolds number (i.e. transitional) turbulence model is proposed with emphasis on hybrid techniques.

Item Type: Conference Proceedings
Title of Proceedings: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004
Additional Information: [1] This paper was originally presented at the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2004) held from 10-12 May 2004 in Brussels, Belgium. [2] This paper was published within Chapter 17, CFD and FE Modeling of Thermal Performance. [3] ISBN: 0780384202 (book); 0780384210 (CD-Rom).
Uncontrolled Keywords: circuit optimisation, computational fluid dynamics, CFD, electronic design automation, flow simulation, integrated circuit modelling, integrated circuit packaging, integrated circuit reliability, thermal analysis, thermal management (packaging), turbulence
Subjects: Q Science > QA Mathematics > QA76 Computer software
Q Science > QC Physics
T Technology > T Technology (General)
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
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Last Modified: 14 Oct 2016 09:01
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/776

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