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Modelling the effect of temperature on product reliability

Modelling the effect of temperature on product reliability

Bailey, Chris (2003) Modelling the effect of temperature on product reliability. In: 2003 Proceedings, Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 324-331. ISBN 0780377931 ISSN 1065-2221 (doi:10.1109/STHERM.2003.1194380)

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Abstract

Reliability of electronic parts is a major concern for many manufacturers, since early failures in the field can cost an enormous amount to repair - in many cases far more than the original cost of the product. A great deal of effort is expended by manufacturers to determine the failure rates for a process or the fraction of parts that will fail in a period of time. It is widely recognized that the traditional approach to reliability predictions for electronic systems are not suitable for today's products. This approach, based on statistical methods only, does not address the physics governing the failure mechanisms in electronic systems. This paper discusses virtual prototyping technologies which can predict the physics taking place and relate this to appropriate failure mechanisms. Simulation results illustrate the effect of temperature on the assembly process of an electronic package and the lifetime of a flip-chip package.

Item Type: Conference Proceedings
Title of Proceedings: 2003 Proceedings, Nineteenth IEEE Semiconductor Thermal Measurement and Management Symposium
Additional Information: [1] This paper was first presented at the 2003 Semiconductor Thermal Measurement and Management (SEMI-THERM) Symposium held from 11-13 March 2003 in San Jose, California, USA. This paper was given within Session 11: Temperature Effects on Performance and Reliability. [3] ISBN: 0780377931 (Softbound); 078037794X (CD-RoM).
Uncontrolled Keywords: assembling, circuit reliability, circuit simulation, failure analysis, flip-chip devices, integrated circuit modelling, integrated optoelectronics, optimisation, thermal management (packaging), virtual prototyping
Subjects: Q Science > QA Mathematics > QA76 Computer software
Q Science > QC Physics
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 09:01
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/681

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