# Modelling the assembly and performance of optoelectronic packages

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Gwyer, D., Bailey, C., Pericleous, K., Philpott, D. and Misselbrook, P.
(2003)
*Modelling the assembly and performance of optoelectronic packages.*
In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 77-85.
ISBN 0780370546

Item Type: | Conference Proceedings |
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Title of Proceedings: | Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003 |

Additional Information: | [1] This paper was first presented at the IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2003) held from 30 March - 2 April 2003 in Aix en Provence, France. It was given on 31 March 2003 in Session 4: Thermal Behavior Modeling. [2] ISBN: 0780370546 (Print); 0780370562 (CD) |

Uncontrolled Keywords: | computer modelling, optoelectronic packages |

Subjects: | Q Science > QA Mathematics > QA76 Computer software T Technology > TK Electrical engineering. Electronics Nuclear engineering |

Pre-2014 Departments: | School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences |

Related URLs: | |

Last Modified: | 14 Oct 2016 09:01 |

URI: | http://gala.gre.ac.uk/id/eprint/680 |

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