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A CFD study of the underfill encapsulation process in flip-chip packaging using the Oldroyd-B model

A CFD study of the underfill encapsulation process in flip-chip packaging using the Oldroyd-B model

Edussuriya, S.S., Williams, A.J. and Bailey, C. (2002) A CFD study of the underfill encapsulation process in flip-chip packaging using the Oldroyd-B model. In: Proceedings of the 6th European Conference of Rheology, (eurheo 2002). LSP, Institute of Polymer Materials, Erlangen-Nuremberg, Germany, pp. 285-286.

Full text not available from this repository.
Item Type: Conference Proceedings
Title of Proceedings: Proceedings of the 6th European Conference of Rheology, (eurheo 2002)
Additional Information: [1] This paper was first presented at the 6th European Conference of Rheology, (eurheo 2002), held from 1-6 September 2002 in Erlangen, Germany.
Uncontrolled Keywords: computational fluid dynamics, CFD, flip-chip packaging, Oldroyd-B
Subjects: Q Science > QA Mathematics > QA76 Computer software
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 09:00
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/563

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