Skip navigation

Modelling the melting and solidification of solder material

Modelling the melting and solidification of solder material

Wheeler, Daniel and Bailey, Christopher (1999) Modelling the melting and solidification of solder material. In: Advances in Electronic Packaging 1999: Proceedings of the Pacific Rim/Asme International Intersociety Electronic & Photonic Packaging Conference. American Society of Mechanical Engineers, New York, NY, USA, pp. 397-404. ISBN 978-0791816127

Full text not available from this repository.

Abstract

Abstract not available

Item Type: Conference Proceedings
Title of Proceedings: Advances in Electronic Packaging 1999: Proceedings of the Pacific Rim/Asme International Intersociety Electronic & Photonic Packaging Conference
Additional Information: International Intersociety Electronic and Photonic Packaging Conference, Maui, Hawaii, June 13-19, 1999.
Pre-2014 Departments: School of Computing & Mathematical Sciences
Last Modified: 14 Oct 2016 09:00
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/344

Actions (login required)

View Item View Item