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Modelling the fillet lifting defect

Modelling the fillet lifting defect

Bailey, Christopher and Boettinger, W. (1999) Modelling the fillet lifting defect. In: Advances in electronic packaging, 1999: Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99. American Society of Mechanical Engineers, New Yor, NY, USA, pp. 405-413. ISBN 9780791816127

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Abstract

Abstract not available

Item Type: Conference Proceedings
Title of Proceedings: Advances in electronic packaging, 1999: Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '99
Additional Information: International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii sponsored by the Electrical and Electronic Packaging Division, ASME.
Pre-2014 Departments: School of Computing & Mathematical Sciences
Last Modified: 14 Oct 2016 09:00
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/343

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