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Material properties, geometry and their effect on the fatigue life of two flip-chip models

Material properties, geometry and their effect on the fatigue life of two flip-chip models

Lu, Hua and Bailey, C. (2000) Material properties, geometry and their effect on the fatigue life of two flip-chip models. In: ITHERM Proceedings. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 65-71. ISBN 0780359127 ISSN 0189-9870 (doi:10.1109/ITHERM.2000.866172)

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Abstract

This paper describes how modeling technology has been used in providing fatigue life time data of two flip-chip models. Full-scale three-dimensional modeling of flip-chips under cyclic thermal loading has been combined with solder joint stand-off height prediction to analyze the stress and strain conditions in the two models. The Coffin-Manson empirical relationship is employed to predict the fatigue life times of the solder interconnects. In order to help designers in selecting the underfill material and the printed circuit board, the Young's modulus and the coefficient of thermal expansion of the underfill, as well as the thickness of the printed circuit boards are treated as variable parameters. Fatigue life times are therefore calculated over a range of these material and geometry parameters. In this paper we will also describe how the use of micro-via technology may affect fatigue life

Item Type: Conference Proceedings
Title of Proceedings: ITHERM Proceedings
Additional Information: [1] This paper was first presented at the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2000 (ITHERM 2000) held from 23-26 May 2000 in Las Vegas, NV, USA. [2] ISBN: 0780359127 (pbk); 0780359135 (hbk): 0780359143 (microfiche edition)
Uncontrolled Keywords: fatigue, flip-chip, modeling, reliability, Coffin-Manson, underfill
Subjects: Q Science > QA Mathematics
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 08:59
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/270

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