Skip navigation

Large scale parallel simulations for the assembly of a flip-chip component to a printed circuit

Large scale parallel simulations for the assembly of a flip-chip component to a printed circuit

Wheeler, D., Lu, H., Cross, M., Bailey, C. and McManus, K. (1999) Large scale parallel simulations for the assembly of a flip-chip component to a printed circuit. In: The Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii.

Full text not available from this repository.

Abstract

Abstract not available

Item Type: Conference or Conference Paper (Paper)
Pre-2014 Departments: School of Computing & Mathematical Sciences
Last Modified: 14 Oct 2016 08:59
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/268

Actions (login required)

View Item View Item