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An integrated modeling approach to solder joint formation

An integrated modeling approach to solder joint formation

Bailey, Christopher ORCID: 0000-0002-9438-3879, Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

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Abstract

The attachment of electronic components to printed circuit boards using solder material is a complex process. This paper presents a novel modeling methodology, which integrates the governing physics taking place. Multiphysics modeling technology, imbedded into the simulation tool—PHYSICA is used to simulate fluid flow, heat transfer, solidification, and stress evolution in an integrated manner. Results using this code are presented, detailing the mechanical response of two solder materials as they cool, solidify and then deform. The shape that a solder joint takes upon melting is predicted using the SURFACE EVOLVER code. Details are given on how these predictions can be used in the PHYSICA code to provide a modeling route by which the shape, solidification history, and resulting stress profiles can be predicted.

Item Type: Article
Uncontrolled Keywords: digital simulation, electronic engineering computing, heat transfer, melting, printed circuit manufacture, soldering, multiphysics modeling, solidification, solder, surface tension, thermal stress
Subjects: Q Science > QA Mathematics > QA76 Computer software
Q Science > QC Physics
T Technology > TN Mining engineering. Metallurgy
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
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Last Modified: 13 Mar 2019 11:30
URI: http://gala.gre.ac.uk/id/eprint/255

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