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A parametric study of flip-chip reliability via computer simulation

A parametric study of flip-chip reliability via computer simulation

Bailey, Christopher, Cross, Mark and Lu, Hua (1999) A parametric study of flip-chip reliability via computer simulation. In: Advances in electronic packaging, 1999: Proceedings of the Pacific RIM/ASME International Intersociety Electronic & Photonic Packaging Conference, InterPACK '99. American Society of Mechanical Engineers, New York, NY, USA, pp. 263-269. ISBN 9780791816127

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Abstract

Abstract not available

Item Type: Conference Proceedings
Title of Proceedings: Advances in electronic packaging, 1999: Proceedings of the Pacific RIM/ASME International Intersociety Electronic & Photonic Packaging Conference, InterPACK '99
Additional Information: Presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 13-19, 1999, Maui, Hawaii
Pre-2014 Departments: School of Computing & Mathematical Sciences
Last Modified: 14 Oct 2016 08:59
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/250

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