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Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics

Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:10.1016/j.microrel.2013.08.006)

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Abstract

Microelectronics failure during operation is commonly attributed to ineffective heat management within the system. Hence, reliability of such devices becomes a challenge area. The use of lead-free solders as thermal interface materials to improve the heat conduction between a chip level device and a heat sink is becoming popular due to their promising thermal and mechanical material properties. Finite element modelling was employed in the analysis of the fatigue life of three lead-free solders (SAC105, SAC305, and SAC405) under commercial thermal cycling load (between −40 °C and 85 °C). This paper presents the results of the simulation work focusing on the effect of varying the solder thermal interface thickness (or bond line thickness) on the reliability of the microelectronic device. The results obtained were based on stress, strain, deformation, and plastic work density. The results showed that the fatigue life of the three solders increases as the solder thermal interface thickness increases. Also, the stresses, strains, and deformation were highest around the edges and vertices of the solder interface. In addition, the optimal solder material of choice based on the criteria of this research is given as SAC405. It has higher operational life span and good reliability capabilities.

Item Type: Article
Uncontrolled Keywords: solders, thermal interface materials, fatigue, lead-free
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Faculty / Department / Research Group: Faculty of Engineering & Science
Related URLs:
Last Modified: 30 Jan 2017 15:11
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/11141

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