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Modelling electromigration for microelectronics design

Modelling electromigration for microelectronics design

Zhu, Xiao, Kotadia, Hiren, Xu, Sha, Lu, Hua, Mannan, Samjid, Bailey, Chris and Chan, Yancheong (2013) Modelling electromigration for microelectronics design. Journal of Computational Science and Technology, 7 (2). pp. 251-264. ISSN 1881-6894 (doi:10.1299/jcst.7.251)

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Computer simulation of electromigration (EM) in microelectronics devices has been reviewed and a multi-physics numerical simulation method has been proposed and developed so that the electric current, temperature, stress can be solved simultaneously and the vacancy concentration can be predicted in a seamless framework. The design considerations for resisting EM is also discussed in this work and a shunt structure for solder joint pad is proposed and its potential for the reduction of EM risk is demonstrated.

Item Type: Article
Additional Information: [1] Published in Journal of Computational Science and Technology (2013) Vol. 7, No. 2 - Special issue on International Computational Mechanics Symposium, 2012 (ICMS2012), Kobe. [2] The JSME-CMD (Japan Society of Mechanical Engineers-Computational Mechanics Division) International Computational Mechanics Symposium (ICMS) 2012 was held during October 9-11, 2012, to celebrate the 25th anniversary of the Division of Computational Mechanics which was established in 1988.
Uncontrolled Keywords: electromigration, simulation, shunt, solder joint
Subjects: Q Science > QA Mathematics
T Technology > T Technology (General)
Pre-2014 Departments: School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 09:26
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None

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