Skip navigation

Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

Costello, S., Strusevich, N., Flyyn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2012) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. EDA Publishing Association, Grenoble, France, pp. 98-102. ISBN 9782355000201

Full text not available from this repository.

Abstract

This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.

Item Type: Conference Proceedings
Title of Proceedings: DTIP 2012 Conference 2012: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Additional Information: [1] This paper was first presented at the 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2012) held from 25-27 April 2012 in Cannes, France. [2] ISBN: 9781467307857 (IEEE); 9782355000201 (EDA).
Uncontrolled Keywords: electrodeposition, micro-particle imaging velocimetry (micro-PIV), fluid flow, electrodeposition of copper, megasonic agitation
Subjects: Q Science > QA Mathematics > QA76 Computer software
Q Science > QC Physics
Q Science > QD Chemistry
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
Related URLs:
Last Modified: 14 Oct 2016 09:26
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/10817

Actions (login required)

View Item View Item